JPS6028392B2 - Resin composition for encapsulating electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a resin composition suitable for encapsulating electronic components, and particularly to a composition containing polyphenylene sulfide resin as a main component.

Conventionally, electronic components such as ICs, transistors, diodes, capacitors, and resistors have been treated with heat-treated materials such as epoxy resin or silicone resin for the purpose of protecting them, maintaining electrical insulation, or preventing deterioration of various characteristics due to the external atmosphere. Curing resins are widely used to seal these electronic components, but these thermosetting resins require a longer molding cycle for sealing, or waste scraps such as runners and spools. It has disadvantages such as not being able to be reused. Therefore, attempts have been made to seal using polyphenylene sulfide resin, which is a thermoplastic resin, in order to eliminate the disadvantages of thermosetting resins as described above. Electronic components formed by sealing with a thermosetting resin have a problem in that they have inferior temperature resistance characteristics compared to electronic components sealed using a thermosetting resin. In other words, since polyphenylene sulfide resin has poor adhesion (adhesion) to the frame of electronic components or IJ-wires, the interface between the sealing resin and the frame or lead wires may deteriorate at high temperatures or in a high-temperature atmosphere. Water easily infiltrates through the substrate, causing deterioration of various properties inherent in electronic components, such as green resistance such as corrosion of aluminum electrodes. The present invention aims to provide a novel polyphenylene sulfide resin composition for encapsulating electronic components which eliminates such disadvantages or disadvantages, and which comprises: 10 parts by weight of polyphenylene sulfide resin; [o- Formula (R)a(H)bSi.

2,000F (wherein R represents a substituted or unsubstituted monovalent hydrocarbon group).

a is 0<a≦3, b is OSbSI, but a+b is 0.
5Sa+b<4), 0.1 to 7 parts by weight of an elementary compound, and 50 to 30 parts by weight of an inorganic filler.

This composition has high adhesion (adhesiveness) to frames or lead wires of electronic parts, so moisture resistance is significantly improved, and furthermore, it has effects such as shortening of molding cycles and reusability of scraps.

Hereinafter, the polyphenylene sulfide resin composition for sealing according to the present invention will be explained in detail.

First, the polyphenylene sulfide resin used as the main component in the present invention is a publicly known resin described in, for example, U.S. Pat. It is obtained by a condensation reaction with sodium sulfide.
As such polyphenylene sulfide resin,
Specifically, Ryton V-1 (trade name, uncrosslinked polyphenylene sulfide resin, manufactured by Phillips Petroleum), Ryton P-4, Ryton P-6, or Ryton R-6 (trade name, all crosslinked polyphenylene sulfide resins) Examples include plastic resins manufactured by Phillips Petroleum Co., Ltd.).

Note that in the present invention, there is no problem in using an uncrosslinked polyphenylene sulfide resin and a crosslinked polyphenylene resin together, but in the case of this combination, in order to prevent damage to electronic components during sealing work, It is desirable to increase the proportion of uncrosslinked polyphenylene sulfide resin used and lower the viscosity of the mixture before use.

Next, the 'o} component used in the present invention is an organic poppy compound represented by the above formula, in which R
represents a substituted or unsubstituted --valent hydrocarbon group, and examples of this monovalent hydrocarbon group include alkyl groups such as methyl group, ethyl group, propyl group, butyl group, bentyl group, hexyl group, heptyl group, and octyl group. , cycloalkyl groups such as cyclobutyl group, cyclobentyl group, cyclohexyl group, alkenyl groups such as vinyl group, allyl group, 1-probenyl group, aryl group such as phenyl group, tolyl group, xylyl group, naphthyl group, benzyl group, phenylethyl group Aralkyl groups such as, or groups in which the hydrogen atoms of these groups are partially substituted with halogen atoms, sia/groups, etc.
For example, chloropropyl group, trifluoropropyl group,
Examples include chlorophenyl group and chloronaphthyl group.

The definitions of a, b and a and b are as described above. As such an organic poppy compound, R in the above formula
, a and b are shown in the table below.

However, the abbreviations of Me, Ph and Vi in the following description each represent the following groups.

Me...・CH3-Ph"...C6 day 5- Vi...CH2=CH- This {b) component is preferably 0.1 to 70 parts by weight based on the weight of the above {i component 10. is required to be used in the range of 1 to 30 parts by weight, and the purpose or effect of the present invention as described above can be achieved if the amount used is less than 0.1 part by weight. On the other hand, even if more than 7 parts by weight are used, not only will no significant effect be obtained by using a large amount, but the mechanical strength of the resulting encapsulated molded product will deteriorate.

Furthermore, the inorganic fillers which are one of the components used in the present invention include precipitated silica, fume silica, quartz powder, poppies such as diatomaceous earth, acid salts, metal oxides such as aluminum oxide and zinc oxide, and calcium carbonate. , metal carbonates such as magnesium carbonate and zinc carbonate, metal hydroxides such as aluminum hydroxide, asbestos, glass fiber, glass beads, clay, finely powdered mica, talc, or the surface of these inorganic fillers is treated with silane. Things like this are common.

This component needs to be used in a range of 50 to 30 parts by weight based on the 10 parts by weight of component {i} above, but if the amount used is less than 5 parts by weight, The mechanical strength of the resulting encapsulated molded product becomes inferior, and
This is because if the amount exceeds 0 parts by weight, the viscosity of the composition will increase and the fluidity will deteriorate.

The composition of the present invention can be prepared using various methods, including, for example, a method in which one component is uniformly mixed and then pelletized using an extruder or the like. can be given.

The composition of the present invention may optionally contain pigments such as carbon black, titanium white, chromium oxide or iron oxide, stearic acid or its metal salts, thickeners such as silicone oil and waxes, and N-(2- There is no problem in adding and blending a silane coupling agent such as (aminoethyl)-3-aminopropylmethyldimethoxysilane or 3-glycidoxypropyltrimethoxysilane.

In order to encapsulate electronic components using the composition according to the present invention, the encapsulating material prepared as described above may be encapsulated using a molding method such as transfer molding, injection molding, or compression molding. Generally, there are no particular restrictions on this sealing means.

Next, examples of the present invention will be given, and the amount (parts) in the examples
All values are expressed in parts by weight.

Examples Ryton P-6 (trade name, cross-linked polyphenylene sulfide resin, manufactured by Phillips Petroleum Company), Ryton V-1 (trade name, cross-linked polyphenylene sulfide resin, manufactured by Phillips Petroleum Company), average fiber length or average Glass or asbestos fibers with particle sizes as shown in the table below; mineral fillers of the type shown in the table (quartz powder, talc, calcium carbonate, glass beads, aluminum hydroxide, or clay);
The organic poppy seeds and the elementary compound were mixed uniformly using a Henshil mixer in the proportions shown in the same table, and then extruded into a compound using an extruder to obtain a sealing resin.

Using the sealing resin obtained above, a 14-pin IC dummy frame was sealed to obtain a sealed electronic component as shown in Figure 1 (in the figure, 1 is an IC chip, 2 is a lead wire). , 3 is the sealing resin).

This seal was made using a 1 oz injection molding machine with a cylinder temperature of 31 and 0, a mold temperature of 150°C, and an injection pressure of 200K.
9/ I went under the conditions of the ground.

The various physical properties of the sealed electronic component obtained above were examined by the following methods (Experiments 1 and 2) and the results are also listed in the table.

Experiment 1 Regarding the encapsulated electronic component manufactured above, the bending strength, dielectric constant (d), yield loss tangent (tan6) of the resin after encapsulation, and adhesiveness (adhesion) between the encapsulating resin and the frame were investigated. The results are shown in the table below.

(The adhesion (adhesion) between the sheath sealing resin and the frame was determined as follows.

After uniformly mixing commercially available red ink and alcohol and soaking the dummy frame around the 14-pin sealing resin,
9/ When one hour had elapsed since the pressure was applied, the frame was taken out and the intrusion state of the red ink alcohol mixture at the interface between the frame or lead wire and the sealing resin was examined.

As shown in FIG. 2, this measurement was carried out by providing in advance five locations (A to E) that serve as criteria for determining one lead terminal, and the results are shown as B to E.

Experiment 2 Using the sealing resin obtained above, the IC frame to which the element for aluminum wiring corrosion test was attached was sealed (molding conditions were the same as above).

After punching and bending this sealed IC frame, it was placed in a pressurized steam atmosphere at a temperature of 121°C and heated for 50 minutes.
A voltage of V (direct current) was applied, and the average life time at which the disconnection rate due to aluminum corrosion reached 50% was determined (aluminum wiring corrosion test), which was defined as green resistance, and the results are shown in the table below.

*1. (Me). ．． . 〇(H) Skin 0Sio,. 00*2
．． (Me),. 52(Vi)〇. . 78Si○,. 2o
*3. (Me),. 20(H)〇. 60Sio,. ．． .

*4. (Me),. 50(Ph)o. 25 (Town o.7
5 Si0o. 75*5. (Me)2.00(H),.
〇. si00.50*6. (Me). ．． 6o Si○,
．． 2o*7. (Me),. 20(H).

．． 90Si○o. 95 Brief Description of the Drawings FIG. 1 is a schematic view showing a 14-pin IC dummy frame sealed with the composition of the present invention or a control product, and FIG. 2 is an enlarged schematic view of the circular part of FIG. 1. It is.

1...IC chip, 2...Lead wire, 3...
...Sealing resin.

Figure 1 Figure 2

Claims (1)

[Scope of Claims] 1 (a) 100 parts by weight of polyphenylene sulfide resin, (b) Formula (R)_a(H)_bSiO(4-a-b)/2 (wherein, R is substituted or unsubstituted) Represents a substituted monovalent hydrocarbon group. a is 0<a≦3, b is 0≦b≦1, where a+b is 0.
5≦a+b<4)
．． 1 to 70 parts by weight, and (c) an inorganic filler 50 to 300 parts by weight.