JPS62197451A - Resin composition for use in sealing electronic component - Google Patents
Resin composition for use in sealing electronic componentInfo
- Publication number
- JPS62197451A JPS62197451A JP61037482A JP3748286A JPS62197451A JP S62197451 A JPS62197451 A JP S62197451A JP 61037482 A JP61037482 A JP 61037482A JP 3748286 A JP3748286 A JP 3748286A JP S62197451 A JPS62197451 A JP S62197451A
- Authority
- JP
- Japan
- Prior art keywords
- silicone oil
- polyphenylene sulfide
- resin composition
- group
- unmodified
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007789 sealing Methods 0.000 title claims description 9
- 239000011342 resin composition Substances 0.000 title claims description 8
- -1 polydimethylsiloxane Polymers 0.000 claims abstract description 32
- 229920002545 silicone oil Polymers 0.000 claims abstract description 26
- 229920005989 resin Polymers 0.000 claims abstract description 20
- 239000011347 resin Substances 0.000 claims abstract description 20
- 239000004734 Polyphenylene sulfide Substances 0.000 claims abstract description 16
- 229920000069 polyphenylene sulfide Polymers 0.000 claims abstract description 16
- 125000000524 functional group Chemical group 0.000 claims abstract description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 3
- 125000003396 thiol group Chemical group [H]S* 0.000 claims abstract description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 14
- 229910000077 silane Inorganic materials 0.000 claims description 14
- 239000011256 inorganic filler Substances 0.000 claims description 10
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 10
- 125000003277 amino group Chemical group 0.000 claims description 2
- 125000003700 epoxy group Chemical group 0.000 claims description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 1
- 239000004205 dimethyl polysiloxane Substances 0.000 abstract description 13
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 abstract description 13
- 239000000203 mixture Substances 0.000 abstract description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 6
- 239000000155 melt Substances 0.000 abstract description 6
- 239000004593 Epoxy Substances 0.000 abstract description 3
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 abstract description 3
- 229920000642 polymer Polymers 0.000 abstract description 3
- 239000000654 additive Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract description 2
- 239000000945 filler Substances 0.000 abstract 2
- 150000001282 organosilanes Chemical class 0.000 abstract 2
- 239000005350 fused silica glass Substances 0.000 abstract 1
- 239000003990 capacitor Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical group OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000010456 wollastonite Substances 0.000 description 2
- 229910052882 wollastonite Inorganic materials 0.000 description 2
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- 101150011252 CTSK gene Proteins 0.000 description 1
- 241000251730 Chondrichthyes Species 0.000 description 1
- 229920002943 EPDM rubber Polymers 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- 235000010582 Pisum sativum Nutrition 0.000 description 1
- 240000004713 Pisum sativum Species 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000004103 aminoalkyl group Chemical group 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical class C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- HVYWMOMLDIMFJA-DPAQBDIFSA-N cholesterol Chemical group C1C=C2C[C@@H](O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2 HVYWMOMLDIMFJA-DPAQBDIFSA-N 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 229920006037 cross link polymer Polymers 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920001921 poly-methyl-phenyl-siloxane Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 239000008262 pumice Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、耐湿性および成形加工性の優れたポリフェニ
レンサルファイド樹脂からなる電子部品封止用樹脂組成
物に関するものでありＩＣ、トランジスター、キャパシ
ター、レジスター、ダイオード、トリオード、サイリス
ター、コイル、バリスター、コネクター、コンデンサー
、トランスデーーサー、水晶発振器、ヒユーズ、整流器
、電源、スイッチ、センサー、リレーおよびこれらの複
合部品等の各種電子部品の封止に利用することができる
。Detailed Description of the Invention (Industrial Field of Application) The present invention relates to a resin composition for encapsulating electronic components made of polyphenylene sulfide resin with excellent moisture resistance and moldability, and is suitable for use in ICs, transistors, capacitors, Used for sealing various electronic components such as resistors, diodes, triodes, thyristors, coils, varistors, connectors, capacitors, transducers, crystal oscillators, fuses, rectifiers, power supplies, switches, sensors, relays, and composite components of these. can do.
（従来の技術および発明が解決しようとする問題点）
ＩＣ，トランジスター、キャパシター、レジスター等、
上記に挙けた電子部品は電気絶縁性の保持、機械的保護
、外部雰囲気による特性変化の防止等の目的で合成樹脂
で封止することが広く行われている。合成樹脂としては
従来エポキシ樹脂やシリコン樹脂等の熱硬化性樹脂が主
に使用されているが、これらの熱硬化性樹脂を用いて電
子部品を封止する際、成形サイクルが長い、パリが出や
すい、樹脂自体の保存性が充分でない、スゲルーランナ
ーの再利用ができない、等の欠点がある。(Problems to be solved by conventional techniques and inventions) ICs, transistors, capacitors, resistors, etc.
The above-mentioned electronic components are widely sealed with synthetic resin for purposes such as maintaining electrical insulation, mechanical protection, and preventing changes in characteristics due to external atmosphere. Traditionally, thermosetting resins such as epoxy resins and silicone resins have been mainly used as synthetic resins, but when these thermosetting resins are used to encapsulate electronic components, they require long molding cycles and produce cracks. There are disadvantages such as being easy to use, the resin itself does not have sufficient storage stability, and the Sugeru runner cannot be reused.
一方、ポリフェニレンサルファイド樹脂は耐熱性、難燃
性、耐薬品性に優れ、かつ熱可塑性樹脂であるために、
上記の熱硬化性樹脂に与られる欠点がなく、生産性が高
いと言う利点を有していることから、近年電子部品封止
用樹脂として注目されている。On the other hand, polyphenylene sulfide resin has excellent heat resistance, flame retardancy, and chemical resistance, and because it is a thermoplastic resin,
It has attracted attention in recent years as a resin for encapsulating electronic components because it does not have the disadvantages of the above-mentioned thermosetting resins and has the advantage of high productivity.
ところが、ポリフェニレンサルファイド樹脂で封止する
場合、エポキシ樹脂に比較して封止時の浴融粘度が高い
、電子部品に用いられている金属製リードとの密着性が
不良のため電子部品の信頼性が劣るなどの問題点を有し
ている。However, when sealing with polyphenylene sulfide resin, the reliability of electronic parts is affected because the melt viscosity during sealing is higher than with epoxy resin, and the adhesion with the metal leads used in electronic parts is poor. It has problems such as inferior performance.
（問題点を解決するための手段）
本発明者らはこのような不利あるいは欠点を解？Ａｔべ
く鋭意研究の結果、ポリフェニレンサルファイド樹脂に
対してアスペクト比（長さ／直径）９以下の無機充填材
を用いかつ有機シランと未変性および又は変性シリコー
ンオイルを併用することよって、封止時の溶融粘度を下
げかつ成形機及び金型の摩耗を減じ、電子部品の信頼性
を高めうる高いｉｔ ｔｉ ％性を有する電子部品封止
用樹脂組成物がえられることが分かシ、本発明に至った
ものである。(Means for Solving the Problems) Did the inventors solve these disadvantages or shortcomings? As a result of intensive research into At, we found that by using an inorganic filler with an aspect ratio (length/diameter) of 9 or less for polyphenylene sulfide resin, and using organic silane and unmodified and/or modified silicone oil, The present invention provides a resin composition for encapsulating electronic components that has a high it ti % property that can reduce melt viscosity, reduce wear on molding machines and molds, and increase the reliability of electronic components. This is what we have come to.
本発明のポリフェニレンサルファイド樹脂（Ａ）は発明
の目的を逸脱しない範囲で共重合体樹脂も用いることが
できる。又、該ポリフェニレンサルファイド樹脂はＡＳ
ＴＭ Ｄ １２３８−７４ （３１６℃、５ｋｇ荷重）
で測定されたメルト７０−レイトが１０００〜１ｏＯｏ
ｏ１−／１０分の範囲にあることが好ましく、電子部品
の種類によって、適切なメルトフローレイトを選択でき
る。とくに、好ましいポリフェニレンサルファイドのメ
ルトフローレイトは、３０００〜１００００ ？／１０
分である。該ポリフェニレンサルファイドは架橋してい
ない重合体、酸素、イオウ、３官能モノマーで架橋した
重合体およびこれらの混合物が含まれる。Copolymer resins can also be used as the polyphenylene sulfide resin (A) of the present invention without departing from the purpose of the invention. Moreover, the polyphenylene sulfide resin is AS
TM D 1238-74 (316℃, 5kg load)
Melt 70-rate measured at 1000-1oOo
The melt flow rate is preferably in the range o1-/10 minutes, and an appropriate melt flow rate can be selected depending on the type of electronic component. In particular, the preferred melt flow rate of polyphenylene sulfide is 3,000 to 10,000? /10
It's a minute. The polyphenylene sulfide includes non-crosslinked polymers, polymers crosslinked with oxygen, sulfur, trifunctional monomers, and mixtures thereof.
本発明のアスペクト比９以下の無機充填材（Ｂ）は、例
えばシリカ、ケイソワ土、アルミナ、酸化チタン、酸化
鉄、酸化亜鉛、酸化アンチモン、軽石、炭酸カルシウム
、炭酸マグネシタム、チタン酸カリウム、硫酸カルシウ
ム、亜硫酸力ルシタム、硫酸バリウム、メルク、クレー
、マイカ、アスベスト、ガラス、ケイ酸力ルシクム、モ
ンモリロナイト、ベントナイト、ウオラストナイト、炭
化ケイ素などの粒状あるいは繊維状の定形又は不定形の
もの及びこれらの混合物が挙げられる。特に好ましい無
機充填材（Ｂ）は、シリカ、ガラス繊維、ガラスピーズ
などのガラス、ウォラストナイ）Ｋ代表されるケイ酸、
ケイ酸塩である。Examples of the inorganic filler (B) having an aspect ratio of 9 or less of the present invention include silica, diatomaceous earth, alumina, titanium oxide, iron oxide, zinc oxide, antimony oxide, pumice, calcium carbonate, magnesium carbonate, potassium titanate, and calcium sulfate. , granular or fibrous fixed or amorphous materials such as lucidum sulfite, barium sulfate, Merck, clay, mica, asbestos, glass, lucidum silicate, montmorillonite, bentonite, wollastonite, silicon carbide, and mixtures thereof. can be mentioned. Particularly preferable inorganic fillers (B) include silica, glass fibers, glasses such as glass peas, silicic acid represented by Wollastonite),
It is a silicate.
無機充填材は、２５〜４００重量部用いられ、好ましく
は８０〜３００重量部用いられる。２５ｍ１部より少な
いと耐熱性、耐湿熱性に劣り、４００重祉部より多いと
溶融粘度が高くなυ成形性が悪くなるので好ましくない
。該無機充填材のアスにクト比は９以下であるが好まし
くは８以下である。平均アスペクト比を９より大きくす
ると、本発明組成物の溶融粘度が高くなシミ子部品の封
正に不利になるだけでなく、耐湿性も低下する傾向にあ
り好ましくないが、本部発明の効果を損なわない限シア
スペクト比の９よシ大きい無機充填材を混合することを
妨げるものではない。The inorganic filler is used in an amount of 25 to 400 parts by weight, preferably 80 to 300 parts by weight. If the amount is less than 25 m1 part, the heat resistance and heat and humidity resistance will be poor, and if it is more than 400 parts by weight, the melt viscosity will be high and the υ moldability will be poor, which is not preferable. The aspect ratio of the inorganic filler is 9 or less, preferably 8 or less. If the average aspect ratio is larger than 9, the melt viscosity of the composition of the present invention is not only disadvantageous for sealing stain parts, but also the moisture resistance tends to decrease, which is undesirable. This does not preclude the incorporation of inorganic fillers with a shear aspect ratio greater than 9 as long as this does not impair the composition.
本発明に用いられる有機シランは、一般にシランカップ
リング剤として知られているものであって、ビニルシラ
ン、メタクリロキシ７ラン、エポキシシラン、アミノシ
ラン、メルカグト７ラン等の各種タイプが含まれ、例え
ばビニルトリクロルシラン、ビニルトリス（β−メトキ
シエトキシ）シラン、ビニルトリエトキシシラン、ビニ
ルトリメトキシシラン、γ−メタクリロキシグロピルト
リメトキシシラン、β−（３，４−エポキシシクロヘキ
シル）エチルトリメトキシシラン、γ−グリシドキシグ
ロピルトリメトキシシラン、ｒ−グリ７ドキシプロビル
メチルジエトキンシラン、Ｎ−β−（アミノエチル）−
γ−アミノグロビルトリメトキ７シラン、Ｎ−β−（ア
ミノエチル） −ｒ−アミノプロピルトリエトキシシラ
ン、Ｎ−β−（アミノエチル）−γ−アミノグロピルメ
チルジメトキシシラン、γ−アミノグロピルトリエトキ
シシラン、Ｎ−フェニル−ｒ−アミノプロピルトリエト
キシシラン、γ−メルカグトグロビルトリメトキシシラ
ン、ｒ−クロロプロピルトリメトキシシランなどが例示
されるが、これらに限定されるものでない。The organic silane used in the present invention is generally known as a silane coupling agent, and includes various types such as vinyl silane, methacryloxy 7-lane, epoxy silane, amino silane, mercagto-7 silane, etc. For example, vinyl trichlorosilane , vinyltris(β-methoxyethoxy)silane, vinyltriethoxysilane, vinyltrimethoxysilane, γ-methacryloxyglopyltrimethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, γ-glycidoxyglo Pyrtrimethoxysilane, r-gly7doxypropylmethyldiethquinsilane, N-β-(aminoethyl)-
γ-aminoglobiltrimethoxy7silane, N-β-(aminoethyl)-r-aminopropyltriethoxysilane, N-β-(aminoethyl)-γ-aminoglopylmethyldimethoxysilane, γ-aminoglopyru Examples include, but are not limited to, triethoxysilane, N-phenyl-r-aminopropyltriethoxysilane, γ-mercagutoglobil trimethoxysilane, and r-chloropropyltrimethoxysilane.
更に本発明で用いる未変性および又は変性シリコーンオ
イル（Ｃ）は公知の各種のシリコーンオイル及びその変
性物が利用できる。未変性シリコーンオイルはポリジメ
チルシロキサンおよびポリメチルフェニルシロキサンが
代表的であシ、後者は例えばポリジメチル−ジフェニル
シロキサンコポリマー、ポリジメチル−フェニルメチル
シロキサンコポリマー、ポリメチルフェニル−ジフェニ
ルシロキサンコポリマーが含まれる。一方変性シリコー
ンオイルは、上記未変性シリコーンオイルの一部を官能
基で変性したものであシその官能基として好ましいもの
は、ヒドロキシル基、アミノ基、カル７＋？キシル基、
エポキシ基、メタクリロキシ基、メルカプト基等である
。これらの具体例を挙げれば末端シラノールポリジメチ
ルシロキサン、末端シラノールジメチルジフェニルシロ
キサン、末端カルビノールポリジメチルシロキサン、末
端ヒドロキシグロビルポリジメチルシロキサン、ポリジ
メチルヒドロキシアルキレンオキシドメチルシロキサン
、末端アセトキシポリジメチルシロキサン、末端ジメチ
ルアミノノリジメチルシロキサン、末端エトキシポリジ
メチルシロキサン、末端ステアロキシポリジメチルシロ
キサン、末端アミノプロピルポリジメチルシロキサン、
アミノアルキル含有Ｔ構造ポリジメチルシロキサン、末
端カルゲキシグロピルポリジメチルシロキサン、カル？
キシグロビル含有Ｔ構造ポリジメチルシロキサン、末端
グリシドキシプロピルポリ・ツメチルシロキサン、ダリ
シドキンプロビル含有Ｔ構造ポリゾメチルシロキサン、
ポリグリシドキシプロピルメチルシロキサン、ポリグリ
シドキシプロピルメチル−ジメチルシロキサンコポリマ
ー、末端メタクリロキシプロピルポリジメチルシロキサ
ン、メタクリロキシグロピル含有で構造ポリジメチルシ
ロキサン、ポリジメテルーメタクリロキシグロピルメチ
ルシロキサン、メルカグト！ロピル含有Ｔ構造４リジメ
チルシロキサン、ポリメルカプトプロビルメチルシロキ
サンなどである。以上の未変性および又は変性シリコン
オイルの粘度は２５℃で１０ ｃｔｓｋ゛〜５，０００
，０００ ｃｔｍｋの範囲で特に制限がないが、高粘度
のものがより好ましい。Furthermore, various known silicone oils and modified products thereof can be used as the unmodified and/or modified silicone oil (C) used in the present invention. Unmodified silicone oils are typically polydimethylsiloxane and polymethylphenylsiloxane, the latter including, for example, polydimethyl-diphenylsiloxane copolymer, polydimethyl-phenylmethylsiloxane copolymer, polymethylphenyl-diphenylsiloxane copolymer. On the other hand, the modified silicone oil is obtained by modifying a part of the above-mentioned unmodified silicone oil with a functional group. Preferred functional groups are a hydroxyl group, an amino group, and a Cal7+ group. xyl group,
These include epoxy groups, methacryloxy groups, mercapto groups, and the like. Specific examples of these include terminal silanol polydimethylsiloxane, terminal silanol dimethyldiphenylsiloxane, terminal carbinol polydimethylsiloxane, terminal hydroxyglovyl polydimethylsiloxane, polydimethylhydroxyalkylene oxide methylsiloxane, terminal acetoxypolydimethylsiloxane, and terminal dimethylsiloxane. aminonolidimethylsiloxane, terminal ethoxypolydimethylsiloxane, terminal stearoxypolydimethylsiloxane, terminal aminopropylpolydimethylsiloxane,
Aminoalkyl-containing T-structure polydimethylsiloxane, terminal calgexiglopyl polydimethylsiloxane, Cal?
xyglobil-containing T-structure polydimethylsiloxane, terminal glycidoxypropyl poly-trimethylsiloxane, dalicidoquinprobil-containing T-structure polyzomethylsiloxane,
Polyglycidoxypropylmethylsiloxane, polyglycidoxypropylmethyl-dimethylsiloxane copolymer, terminal methacryloxypropyl polydimethylsiloxane, structure containing methacryloxyglopyl, polydimethylsiloxane, polydimethylmethacryloxyglopylmethylsiloxane, Mercagt! These include lopyl-containing T-structure 4-lydimethylsiloxane, polymercaptopropylmethylsiloxane, and the like. The viscosity of the above unmodified and/or modified silicone oils is 10 ctsk~5,000 at 25°C.
,000 ctmk, although there is no particular limitation, one with a high viscosity is more preferable.
本発明に於て使用する有機シランと未変性および又は変
性シリコーンオイル（Ｑは（Ａ）成分のポリフェニレン
サルファイド樹脂１００重量部に対して０．２〜２５ｉ
ｆｉ部使用され、０．２重量部以下では本発明組成物の
耐湿性および封止時の流動性が低下し、かつ電子部品の
リードとの密着性が損われるので好ましくなく、他方２
５重被部以上では封止時の揮発性成分の増大、および封
止成形品の表面にブリードするなどの問題を生じ好まし
くない。The organic silane used in the present invention and unmodified and/or modified silicone oil (Q is 0.2 to 25 parts by weight based on 100 parts by weight of the polyphenylene sulfide resin of component (A))
If less than 0.2 parts by weight is used, the moisture resistance of the composition of the present invention and the fluidity during sealing will decrease, and the adhesion to the leads of electronic components will be impaired, so it is not preferable.
If there are more than 5 layers, problems such as an increase in volatile components during sealing and bleeding on the surface of the sealed molded product are undesirable.
更に、有機シランと未変性および又は変性シリコンオイ
ルの量的割合は、９５対５〜５対９５（重量比）が好ま
しく該割合が９５対５を越えて有機シランが多く、未変
性および又は変性シリコーンオイルが少なくなると変性
シリコーンオイルの効果が損われやすく封止時の流動性
の低下、電子部品のリードとの密着性の低下、成形機、
金型への摩耗等の問題が生じやすい。一方該割合が５対
９５をこえて有機シランが少なく、未変性および又は変
性シリコーンオイルが多くなると有機シランの効果が損
われやすく、本組成物の耐湿性の低下を招きやすいので
好ましくない。Furthermore, the quantitative ratio of organic silane and unmodified and/or modified silicone oil is preferably 95:5 to 5:95 (weight ratio), and the ratio exceeds 95:5, with a large amount of organic silane and unmodified and/or modified silicone oil. When the amount of silicone oil decreases, the effect of modified silicone oil tends to be impaired, resulting in decreased fluidity during sealing, decreased adhesion to leads of electronic components, molding machines,
Problems such as wear to the mold are likely to occur. On the other hand, if the ratio exceeds 5:95, with less organic silane and more unmodified and/or modified silicone oil, the effect of the organic silane is likely to be impaired and the moisture resistance of the composition is likely to deteriorate, which is not preferred.
本発明組成物は、ポリフェニレンサルファイド樹脂（Ａ
）、アスペクト比９以下の無機充填材（Ｂ）、有で溶融
混練して得ることができる。各成分の混合はたとえば無
機充填材にあらかじめ有機シラン、未変性および又は変
性シリコーンオイルを付着せしめたのち、ポリフェニレ
ンサルファイド樹脂と混合する方法をとっても全成分を
同時に混合する方法をとってもよい。混練機での浴融混
練温度は２８０〜４００℃が好ましい。更に、本発明組
成物は、本発明の目的を逸脱しない範囲で他の重合体例
えばポリオレフィン、ポリサルホン、ポリイミド、ポリ
アミドイミド、エポキシ、？リフェニレンエーテル、ポ
リアミド、未水添もしくは水添スチレンブタジェンゴム
、ＥＰＤＭゴム、ポリブテンを添加することができる。The composition of the present invention is a polyphenylene sulfide resin (A
) and an inorganic filler (B) having an aspect ratio of 9 or less. The components may be mixed by, for example, adhering organic silane, unmodified and/or modified silicone oil to the inorganic filler in advance, and then mixing it with the polyphenylene sulfide resin, or by mixing all the components at the same time. The bath melt-kneading temperature in the kneader is preferably 280 to 400°C. Furthermore, the composition of the present invention may contain other polymers such as polyolefin, polysulfone, polyimide, polyamideimide, epoxy, etc. without departing from the object of the present invention. Riphenylene ether, polyamide, unhydrogenated or hydrogenated styrene butadiene rubber, EPDM rubber, polybutene can be added.
又、本発明組成物は、公知の添加剤例えば酸化防止剤、
熱安定剤、腐食防止剤、滑剤、着色剤を添加することが
できる。The composition of the present invention may also contain known additives such as antioxidants,
Heat stabilizers, corrosion inhibitors, lubricants, and colorants can be added.
本発明において電子部品の封止とは、特に限定するもの
ではないが一般には電子部品、例えば、ＩＣ、トランジ
スター、ダイオード、コイル、コンデンサー、抵抗器、
バリスター、コネクター、各独センサー類、変換器、ス
イッチ、レジスター、サイリスター、水晶発振器、ヒエ
ーズ、整流器、電源リレー、トランスデー−サー等ある
いはこれらをハイプリ、ド化した部品を樹脂組成物で封
入し、機械的保１、電気絶縁性の保持、外部雰囲気によ
る特性変化の防止吟の目的で行なうものを言うＯ
（発明の効果）
本発明のポリフェニレンサルファイドｍ ＪＡＷ カラ
成る電子部品封止用樹脂組成物は耐湿性、成形加工性が
優れるために各ａｔ電子部品封止した時、電子部品の信
頼性を高める効果を有する。In the present invention, encapsulation of electronic components generally refers to electronic components such as ICs, transistors, diodes, coils, capacitors, resistors, etc., but is not particularly limited.
Varistors, connectors, individual sensors, converters, switches, registers, thyristors, crystal oscillators, fuses, rectifiers, power relays, transducers, etc., or parts made of these are encapsulated in a resin composition. (Effects of the Invention) A resin composition for encapsulating electronic components made of polyphenylene sulfide of the present invention, which is used for the purpose of maintaining mechanical insulation, maintaining electrical insulation, and preventing changes in characteristics due to external atmosphere. Since it has excellent moisture resistance and moldability, it has the effect of increasing the reliability of electronic components when each AT electronic component is sealed.
（実施例） 以下、本発明を実施例、および比較例によシ説明する。(Example) The present invention will be explained below with reference to Examples and Comparative Examples.
実施例１〜７、比較例１
メルトフローレイトが５０００のポリフェニレンサルフ
ァイド樹脂１００重量部と各種無機充填材、有機シラン
、未変性シリコーンオイルを６５■φ押出機を用いて３
２０℃で溶融混練しペレット化した。得られた４レツト
を射出成形機にて樹脂温度３２０℃で金型温度１５０°
で物性測定用テストピースを作成し次表の結果をえた。Examples 1 to 7, Comparative Example 1 100 parts by weight of polyphenylene sulfide resin with a melt flow rate of 5000, various inorganic fillers, organic silane, and unmodified silicone oil were mixed using a 65 φ extruder.
The mixture was melt-kneaded at 20°C and pelletized. The obtained 4lets were molded using an injection molding machine at a resin temperature of 320°C and a mold temperature of 150°C.
A test piece for measuring physical properties was prepared using the following method, and the results shown in the following table were obtained.
なお、金属との密着性は第１図に表した１６ｐｉｎのＩ
Ｃリードフレームを封止し、成形品を１２１℃２気圧下
で赤インク中に浸漬し２４時間保持し、金属表面の赤イ
ンク侵透度合を観察した。ＩＣのリードは銀メッキされ
た調合金製を用いた。Note that the adhesion to metal is determined by the 16-pin I shown in Figure 1.
The C lead frame was sealed, and the molded product was immersed in red ink at 121° C. and under 2 atmospheric pressures and held for 24 hours, and the degree of penetration of the red ink into the metal surface was observed. The IC leads were made of silver-plated prepared alloy.
注）
１．添加量は４リフ二二しンサルファイド樹脂１００重
量部に対する重量部である。Note) 1. The amount added is parts by weight based on 100 parts by weight of the 4-refine sulfide resin.
２、有機シランの種類
Ａ：ビニルトリメトキシシラン
Ｂ：ｒ−７ミノグロビルトリエトキシシランＣ：γ−メ
ルカプトプロピルトリメトキシシラン
３、未変性シリコーンオイルの種類
Ｐ：ポリジメチルシロキサン（５０ｃｔｓｋ ）Ｑ ：
（１０，０００ｃｔｓｋ ）
Ｒ” （６００，０００ｃｔａｋ ）Ｓ；ポ
リジメチル−フェニルメチルシロキサンコポリマ（３０
，０００ｅｔｓｋ ）
４、耐湿性
ブレラシャークツカ−試験（１２１℃、２気圧１００時
間）後の体積固有抵抗率（Ω・儂、２３℃）
５、 メルトフロー値
メルトインデクサ−にて２ｍ直径、８■長さのオリフィ
スを用いて１．２ ｋｌｉ！荷重で測定した値（Ｐ／１
０分、３３０℃）
実施例８〜１３、比較例２．３
実施例１〜７における未変性シリコーンオイルの代ＤＫ
各種の変性シリコーンオイルを用いて同様に実験を行い
、第２表の結果をえた。2. Type of organic silane A: Vinyltrimethoxysilane B: r-7 minoglobyltriethoxysilane C: γ-mercaptopropyltrimethoxysilane 3. Type of unmodified silicone oil P: Polydimethylsiloxane (50ctsk) Q:
(10,000ctsk)
R” (600,000ctak) S; polydimethyl-phenylmethylsiloxane copolymer (30
,000etsk) 4. Volume resistivity after moisture resistance Brella Shark test (121°C, 2 atm 100 hours) (Ω・儂, 23°C) 5. Melt flow value 2m diameter with melt indexer, 8■ 1.2 kli using a length orifice! Value measured under load (P/1
0 min, 330°C) Examples 8 to 13, Comparative Example 2.3 DK of unmodified silicone oil in Examples 1 to 7
Similar experiments were conducted using various modified silicone oils, and the results shown in Table 2 were obtained.
注）変性シリコーンオイルの椙類
Ｄ：末端７ラノールポリジメチルシロキサン（５０，０
００ｃｔｓｋ ）
Ｅ：末端アミノグロピルポリジメチルシロキサン
（２，０００ｃｔ
ｓｋ ）Ｆ：末端グリシドキシ！ロピルポリジメチル
ンロキテン （１９，０００ｃｔｓｋ）Ｇ
：ポリメルカプトプロピルメチル−ジメチルシロキサン
（１５０ｃｔｓｋ ）Note) Modified silicone oil type D: 7-terminal lanol polydimethylsiloxane (50,0
00ctsk) E: Terminal aminoglopyl polydimethylsiloxane
(2,000ct
sk) F: Terminal glycidoxy! Lopyrupolydimethylronlokitene (19,000ctsk)G
:Polymercaptopropylmethyl-dimethylsiloxane (150ctsk)
第１図は、６．２ ｍ Ｘ １９． ＯｍのＩＣ封土成
形品の右上部分のみを具体的に示した図であシ、図中■
〜■の数字はリード線金属表面の赤インク浸透度合を示
す。
代理人 弁理士 高 橋 勝 利
第１ 図Figure 1 is 6.2 m x 19. This is a diagram specifically showing only the upper right part of Om's IC fief molded product.
The numbers ~■ indicate the degree of penetration of the red ink into the lead wire metal surface. Agent Patent Attorney Katsutoshi Takahashi Figure 1
Claims (1)
部に対して、（Ｂ）アスペクト比９以下の無機充填材２
５〜４００重量部および（Ｃ）有機シランと未変性およ
び又は変性シリコーンオイル０．２〜２５重量部からな
る電子部品封止用樹脂組成物。 ２、有機シランと未変性および又は変性シリコーンオイ
ル（Ｃ）の添加量の割合が９５対５〜５対９５（重量比
）であることを特徴とする特許請求の範囲第１項記載の
電子部品封止用樹脂組成物。 ３、変性シリコーンオイルがヒドロキシル基、アミノ基
、カルボキシル基、エポキシ基、メタクリロキシ基、メ
ルカプト基から任意に選択される官能基で変性されたシ
リコーンオイルであることを特徴とする特許請求の範囲
第１項及び２項記載の電子部品封止用樹脂組成物。[Claims] 1. (A) 100 parts by weight of polyphenylene sulfide resin, (B) an inorganic filler with an aspect ratio of 9 or less 2
A resin composition for encapsulating electronic components, comprising 5 to 400 parts by weight and (C) organic silane and 0.2 to 25 parts by weight of unmodified and/or modified silicone oil. 2. The electronic component according to claim 1, characterized in that the ratio of the amounts of organic silane and unmodified and/or modified silicone oil (C) added is from 95:5 to 5:95 (weight ratio). Sealing resin composition. 3. Claim 1, wherein the modified silicone oil is a silicone oil modified with a functional group arbitrarily selected from a hydroxyl group, an amino group, a carboxyl group, an epoxy group, a methacryloxy group, and a mercapto group. The resin composition for encapsulating electronic components according to Items 1 and 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61037482A JPH075836B2 (en) | 1986-02-24 | 1986-02-24 | Resin composition for electronic component encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61037482A JPH075836B2 (en) | 1986-02-24 | 1986-02-24 | Resin composition for electronic component encapsulation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62197451A true JPS62197451A (en) | 1987-09-01 |
| JPH075836B2 JPH075836B2 (en) | 1995-01-25 |
Family
ID=12498739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61037482A Expired - Fee Related JPH075836B2 (en) | 1986-02-24 | 1986-02-24 | Resin composition for electronic component encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH075836B2 (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01163257A (en) * | 1987-09-11 | 1989-06-27 | Polyplastics Co | Sealing material with low stress |
| JPH01190749A (en) * | 1988-01-26 | 1989-07-31 | Toyobo Co Ltd | Thermoplastic resin composition |
| JPH0291158A (en) * | 1988-09-29 | 1990-03-30 | Hitachi Maxell Ltd | Composite resin composition, and molded product and tape reel molded therefrom |
| EP0369244A2 (en) * | 1988-11-04 | 1990-05-23 | Mitsubishi Rayon Co., Ltd. | Polyarylene sulfide resin composition |
| JPH02153712A (en) * | 1988-12-06 | 1990-06-13 | Polyplastics Co | Pre-molded package |
| EP0435427A2 (en) * | 1989-12-28 | 1991-07-03 | Kureha Kagaku Kogyo Kabushiki Kaisha | Electronic device sealing resin compositions and sealed electronic devices |
| US5332770A (en) * | 1988-11-12 | 1994-07-26 | Kureha Kagaku Kogyo K.K. | Electronic device sealing resin compositions and sealed electronic devices |
| JPH07224223A (en) * | 1993-12-16 | 1995-08-22 | Toray Ind Inc | Polyphenylene sulfide resin composition |
| JP2000103967A (en) * | 1998-07-01 | 2000-04-11 | Dow Corning Corp | Polymer composition |
| WO2002000794A1 (en) * | 2000-06-29 | 2002-01-03 | Idemitsu Petrochemical Co., Ltd. | Polyarylene sulfide resin composition |
| JP2002012763A (en) * | 2000-06-29 | 2002-01-15 | Idemitsu Petrochem Co Ltd | Polyarylene sulfide resin composition |
| WO2016093309A1 (en) * | 2014-12-12 | 2016-06-16 | Dic株式会社 | Polyarylene sulfide resin composition, molded article, composite molded article, and method for producing composite molded article |
| JP2019089925A (en) * | 2017-11-14 | 2019-06-13 | 帝人株式会社 | Polyarylene sulfide resin composition |
| CN113817318B (en) * | 2021-09-10 | 2023-10-20 | 安徽元琛环保科技股份有限公司 | Corrosion-resistant, high-temperature-resistant and super-hydrophobic polyphenylene sulfide composite material and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0166451A2 (en) * | 1984-06-29 | 1986-01-02 | Kureha Kagaku Kogyo Kabushiki Kaisha | Para-phenylene sulfide block copolymers; process for the production of the same and use thereof |
| JPS6155148A (en) * | 1984-08-27 | 1986-03-19 | Kureha Chem Ind Co Ltd | Composition for sealing electronic part and use thereof |
-
1986
- 1986-02-24 JP JP61037482A patent/JPH075836B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0166451A2 (en) * | 1984-06-29 | 1986-01-02 | Kureha Kagaku Kogyo Kabushiki Kaisha | Para-phenylene sulfide block copolymers; process for the production of the same and use thereof |
| JPS6155148A (en) * | 1984-08-27 | 1986-03-19 | Kureha Chem Ind Co Ltd | Composition for sealing electronic part and use thereof |
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0689224B2 (en) * | 1987-09-11 | 1994-11-09 | ポリプラスチックス株式会社 | Low stress encapsulant |
| JPH01163257A (en) * | 1987-09-11 | 1989-06-27 | Polyplastics Co | Sealing material with low stress |
| JPH01190749A (en) * | 1988-01-26 | 1989-07-31 | Toyobo Co Ltd | Thermoplastic resin composition |
| JPH0291158A (en) * | 1988-09-29 | 1990-03-30 | Hitachi Maxell Ltd | Composite resin composition, and molded product and tape reel molded therefrom |
| EP0369244A2 (en) * | 1988-11-04 | 1990-05-23 | Mitsubishi Rayon Co., Ltd. | Polyarylene sulfide resin composition |
| US5474828A (en) * | 1988-11-12 | 1995-12-12 | Kureha Kagaku Kogyo K.K. | Electronic device sealing resin compositions and sealed electronic devices |
| US5332770A (en) * | 1988-11-12 | 1994-07-26 | Kureha Kagaku Kogyo K.K. | Electronic device sealing resin compositions and sealed electronic devices |
| JPH02153712A (en) * | 1988-12-06 | 1990-06-13 | Polyplastics Co | Pre-molded package |
| JPH0722943B2 (en) * | 1988-12-06 | 1995-03-15 | ポリプラスチックス株式会社 | Pre-molded package |
| EP0435427A2 (en) * | 1989-12-28 | 1991-07-03 | Kureha Kagaku Kogyo Kabushiki Kaisha | Electronic device sealing resin compositions and sealed electronic devices |
| US5223557A (en) * | 1989-12-28 | 1993-06-29 | Kureha Kagaku Kogyo K.K. | Electronic device sealing resin compositions and sealed electronic devices |
| JPH07224223A (en) * | 1993-12-16 | 1995-08-22 | Toray Ind Inc | Polyphenylene sulfide resin composition |
| JP2000103967A (en) * | 1998-07-01 | 2000-04-11 | Dow Corning Corp | Polymer composition |
| WO2002000794A1 (en) * | 2000-06-29 | 2002-01-03 | Idemitsu Petrochemical Co., Ltd. | Polyarylene sulfide resin composition |
| JP2002012763A (en) * | 2000-06-29 | 2002-01-15 | Idemitsu Petrochem Co Ltd | Polyarylene sulfide resin composition |
| WO2016093309A1 (en) * | 2014-12-12 | 2016-06-16 | Dic株式会社 | Polyarylene sulfide resin composition, molded article, composite molded article, and method for producing composite molded article |
| JPWO2016093309A1 (en) * | 2014-12-12 | 2017-10-12 | Dic株式会社 | Polyarylene sulfide resin composition, molded product, composite molded product, and method for producing composite molded product |
| EP3231844A4 (en) * | 2014-12-12 | 2018-07-25 | DIC Corporation | Polyarylene sulfide resin composition, molded article, composite molded article, and method for producing composite molded article |
| JP2020037708A (en) * | 2014-12-12 | 2020-03-12 | Dic株式会社 | Polyarylene sulfide resin composition, molding, composite molding and method for producing composite molding |
| JP2019089925A (en) * | 2017-11-14 | 2019-06-13 | 帝人株式会社 | Polyarylene sulfide resin composition |
| CN113817318B (en) * | 2021-09-10 | 2023-10-20 | 安徽元琛环保科技股份有限公司 | Corrosion-resistant, high-temperature-resistant and super-hydrophobic polyphenylene sulfide composite material and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH075836B2 (en) | 1995-01-25 |
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