JP2008260830A - Heat-conductive resin composition - Google Patents
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本発明は、伝熱性樹脂組成物に関する。さらに詳しくは伝熱性、絶縁性及び靭性に優れ、高放熱性電子部品等として好適な樹脂組成物に関するものである。 The present invention relates to a heat conductive resin composition. More specifically, the present invention relates to a resin composition that is excellent in heat conductivity, insulation, and toughness and that is suitable as a high heat dissipation electronic component.
集積回路の処理速度や実装密度は、年々向上しており、その結果として半導体素子等からの発熱量も増大しつつある。このため、種々の高放熱性電子部品の需要が高まっており、これら高放熱性電子部品に用いる高伝熱性材料の需要も高まっている。また、上記電子部品に加えて、モーターコイル、ハロゲンランプ等においても、高伝熱性材料の需要が高まってきている。 The processing speed and packaging density of integrated circuits are improving year by year, and as a result, the amount of heat generated from semiconductor elements and the like is also increasing. For this reason, the demand for various high heat dissipation electronic components is increasing, and the demand for high heat transfer materials used for these high heat dissipation electronic components is also increasing. In addition to the electronic components described above, there is an increasing demand for highly heat-conductive materials in motor coils, halogen lamps, and the like.
高伝熱性材料としては、銅、アルミニウム等の金属が広く知られている。しかし、電子部品に用いる材料の多くは絶縁性を有する必要があり、これら金属を電子部品の材料として用いるには、絶縁被覆等を施す必要があった。 Metals such as copper and aluminum are widely known as high heat transfer materials. However, many of the materials used for electronic parts need to have insulating properties. In order to use these metals as materials for electronic parts, it is necessary to provide an insulating coating or the like.
この課題に対し、金属の代わりに、高伝熱性及び絶縁性を有するフィラーを樹脂に添加した樹脂組成物を高伝熱性材料として用いる技術が知られている。
例えば、特許文献１では、ポリフェニレンサルファイド樹脂及びフッ化カルシウム粒子からなる複合材料が開示されている。また、特許文献２では、ポリアリーレンサルファイド樹脂、リン含有被覆酸化マグネシウム及びアルコキシシラン化合物を含む樹脂組成物が開示されている。
In order to solve this problem, a technique is known in which a resin composition in which a filler having high heat conductivity and insulating properties is added to a resin instead of metal is used as a high heat transfer material.
For example, Patent Document 1 discloses a composite material made of polyphenylene sulfide resin and calcium fluoride particles. Patent Document 2 discloses a resin composition containing a polyarylene sulfide resin, a phosphorus-containing coated magnesium oxide and an alkoxysilane compound.
しかし、特許文献１及び２に記載の高伝熱性材料は、その伝熱性を十分に高めるためには、フィラーを大量に添加する必要があり、高伝熱性材料の靭性低下及びコスト増加という欠点を有していた。樹脂組成物の靭性を向上させる方法として、樹脂組成物にエラストマー及び／又は繊維状フィラーを添加する方法が知られているが、フィラーを大量に含む樹脂組成物には、十分な効果が得られなかった。
本発明は、上記の事情に鑑みなされたものであり、高い伝熱性を有し、絶縁性及び靭性にも優れた伝熱性樹脂組成物を提供することを目的とする。 This invention is made | formed in view of said situation, and it aims at providing the heat-transfer resin composition which has high heat conductivity and was excellent also in insulation and toughness.
本発明者らは、上記目的を達成するために鋭意研究を重ねた結果、ポリアリーレンサルファイド、タルク、及び扁平形状の断面を有するガラス繊維を特定の配合比率で含む樹脂組成物が、高い伝熱性を有し、絶縁性及び靭性にも優れることを見出した。本発明は、かかる知見に基づいて完成したものである。
本発明によれば、以下の伝熱性樹脂組成物等が提供される。
１． 以下の成分（Ａ）〜（Ｃ）を含む伝熱性樹脂組成物。
（Ａ）ポリアリーレンサルファイド：１５〜４５重量％
（Ｂ）タルク：１５〜５５重量％
（Ｃ）扁平形状の断面を有するガラス繊維：１５〜６０重量％
（前記各成分の配合量は、成分（Ａ）〜（Ｃ）の合計量に対する重量分率である）
２． 前記成分（Ａ）〜（Ｃ）からなる１に記載の伝熱性樹脂組成物。
３． 前記ガラス繊維の扁平率が２〜２０である１又は２に記載の伝熱性樹脂組成物。
４． １〜３のいずれかに記載の伝熱性樹脂組成物からなる伝熱性樹脂成形品。
５． ４に記載の伝熱性樹脂成形品からなる電子部品。
As a result of intensive studies to achieve the above object, the present inventors have found that a resin composition containing polyarylene sulfide, talc, and glass fibers having a flat cross section at a specific blending ratio has high heat conductivity. And have been found to be excellent in insulation and toughness. The present invention has been completed based on such findings.
According to the present invention, the following heat transfer resin composition and the like are provided.
1. The heat conductive resin composition containing the following components (A)-(C).
(A) Polyarylene sulfide: 15 to 45% by weight
(B) Talc: 15-55 wt%
(C) Glass fiber having a flat cross section: 15 to 60% by weight
(The amount of each component is a weight fraction with respect to the total amount of components (A) to (C))
2. 2. The heat conductive resin composition according to 1, comprising the components (A) to (C).
3. The heat transfer resin composition according to 1 or 2, wherein the flatness of the glass fiber is 2 to 20.
4). A heat conductive resin molded article comprising the heat conductive resin composition according to any one of 1 to 3.
5. 4. An electronic component comprising the heat conductive resin molded product according to 4.
本発明によれば、高い伝熱性を有し、絶縁性及び靭性にも優れた伝熱性樹脂組成物を提供することができる。 ADVANTAGE OF THE INVENTION According to this invention, it can provide the heat conductive resin composition which has high heat conductivity and was excellent also in insulation and toughness.
本発明の伝熱性樹脂組成物は下記成分（Ａ）〜（Ｃ）を含み、好ましくは成分（Ａ）〜（Ｃ）からなる。
（Ａ）ポリアリーレンサルファイド：１５〜４５重量％
（Ｂ）タルク：１５〜５５重量％
（Ｃ）扁平形状の断面を有するガラス繊維：１５〜６０重量％
（各成分の配合量は、成分（Ａ）〜（Ｃ）の合計量に対する重量分率である）
The heat conductive resin composition of the present invention contains the following components (A) to (C), and preferably comprises components (A) to (C).
(A) Polyarylene sulfide: 15 to 45% by weight
(B) Talc: 15-55 wt%
(C) Glass fiber having a flat cross section: 15 to 60% by weight
(The amount of each component is a weight fraction with respect to the total amount of components (A) to (C))
ポリアリーレンサルファイド（成分（Ａ））の配合量は成分（Ａ）〜（Ｃ）の合計量に対して１５〜４５重量％であり、好ましくは２０〜４５重量％、より好ましくは２０〜４０重量％である。
成分（Ａ）の配合量が１５重量％以上であると、得られる樹脂組成物は実用的な加工性を有する。また、成分（Ａ）の配合量が４５重量％以下であると、得られる樹脂組成物は実用的な伝熱性及び靭性を有する。
The blending amount of polyarylene sulfide (component (A)) is 15 to 45% by weight, preferably 20 to 45% by weight, more preferably 20 to 40% by weight based on the total amount of components (A) to (C). %.
When the amount of component (A) is 15% by weight or more, the resulting resin composition has practical processability. Moreover, the resin composition obtained as a compounding quantity of a component (A) is 45 weight% or less has practical heat conductivity and toughness.
タルク（成分（Ｂ））の配合量は成分（Ａ）〜（Ｃ）の合計量に対して１５〜５５重量％であり、好ましくは２０〜５５重量％である。
成分（Ｂ）の配合量が１５重量％以上であると、得られる樹脂組成物は実用的な伝熱性を有する。また、成分（Ｂ）の配合量が５５重量％以下であると、得られる樹脂組成物は実用的な靭性を有する。
The blending amount of talc (component (B)) is 15 to 55% by weight, preferably 20 to 55% by weight, based on the total amount of components (A) to (C).
When the blending amount of the component (B) is 15% by weight or more, the obtained resin composition has practical heat conductivity. Moreover, the resin composition obtained as a compounding quantity of a component (B) is 55 weight% or less has practical toughness.
扁平形状の断面を有するガラス繊維（成分（Ｃ））の配合量は、成分（Ａ）〜（Ｃ）の合計量に対して１５〜６０重量％であり、好ましくは２０〜６０重量％である。
成分（Ｃ）の配合量が１５重量％以上であると、得られる樹脂組成物は実用的な靭性を有する。また、成分（Ｃ）の配合量が６０重量％以下であると、得られる樹脂組成物は実用的な加工性を有する。
The compounding quantity of the glass fiber (component (C)) which has a flat cross section is 15-60 weight% with respect to the total amount of a component (A)-(C), Preferably it is 20-60 weight%. .
When the blending amount of component (C) is 15% by weight or more, the resulting resin composition has practical toughness. Moreover, the resin composition obtained as a compounding quantity of a component (C) is 60 weight% or less has practical workability.
本発明で用いられるポリアリーレンサルファイドは、繰り返し単位が下記式
−（Ａｒ−Ｓ）−
（式中、Ａｒはアリーレン基、Ｓは硫黄を示す。）
で示される重合体である。
The polyarylene sulfide used in the present invention has a repeating unit represented by the following formula:
-(Ar-S)-
(In the formula, Ar represents an arylene group, and S represents sulfur.)
It is a polymer shown by.
上記式において、アリーレン基としては、下記式で表されるアリーレン基が挙げられる。これらのアリーレン基からなるポリアリーレンサルファイドは、同一の繰り返し単位からなるホモポリマー、２種以上の異なるアリーレン基からなるコポリマー及びこれらの混合物のいずれでもよい。
また、本発明のポリアリーレンサルファイドは、本発明の効果を損なわない範囲で、そのポリマー鎖の一部が他のポリマーで置換されていてもよい。
置換するポリマーとしては、ポリアミド系ポリマー、ポリエステル系ポリマー、ポリアリーレンエーテル系ポリマー、ポリスチレン系ポリマー、ポリオレフィン系ポリマー、含フッ素ポリマー、ポリオレフィン系エラストマー、ポリアミド系エラストマー、シリコーン系エラストマー等が挙げられる。
In addition, in the polyarylene sulfide of the present invention, a part of the polymer chain may be substituted with another polymer as long as the effects of the present invention are not impaired.
Examples of the polymer to be substituted include polyamide polymers, polyester polymers, polyarylene ether polymers, polystyrene polymers, polyolefin polymers, fluorine-containing polymers, polyolefin elastomers, polyamide elastomers, and silicone elastomers.
本発明のポリアリーレンサルファイドは、例えば特公昭４５−３３６８号公報、特公昭５２−１２２４０号公報等に記載の方法で製造することができる。
尚、本発明のポリアリーレンサルファイドは、空気中で加熱して高分子量化してもよく、また、酸無水物等の化合物を用いて化学修飾してもよい。
The polyarylene sulfide of the present invention can be produced by the method described in, for example, Japanese Patent Publication No. 45-3368 and Japanese Patent Publication No. 52-12240.
The polyarylene sulfide of the present invention may be heated to increase the molecular weight in air, or may be chemically modified with a compound such as an acid anhydride.
本発明で用いられるタルクとは、天然鉱物の一種であり、その化学式は３ＭｇＯ・４ＳｉＯ２・Ｈ２Ｏで表される。タルクは、通常、産地等に応じた不純物を含むが、本発明のタルクは、産地、不純物の種類及びその量について特に制限は無い。 Talc used in the present invention is a kind of natural mineral, and its chemical formula is represented by 3MgO.4SiO 2 .H 2 O. Talc usually contains impurities according to the production area, etc., but the talc of the present invention is not particularly limited with respect to the production area, the type of impurities and the amount thereof.
本発明のタルクはそのサイズについて特に制限はないが、製造上の利便性の観点から、好ましくは重量メジアン粒子径が１μｍ〜５０μｍであり、より好ましくは３〜３０μｍである。
上記重量メジアン粒子径は、一般にＤ５０と表され、例えばレーザー回折法等で測定することができる。
The size of the talc of the present invention is not particularly limited, but from the viewpoint of convenience in production, the weight median particle diameter is preferably 1 μm to 50 μm, more preferably 3 to 30 μm.
The weight median particle diameter is generally expressed as D50, and can be measured by, for example, a laser diffraction method.
本発明のタルクは、ポリアリーレンサルファイドとの接着強度を高める目的等で、その表面を有機化合物でコーティングする等の処理を施してもよい。 The talc of the present invention may be subjected to a treatment such as coating its surface with an organic compound for the purpose of increasing the adhesive strength with polyarylene sulfide.
本発明の伝熱性樹脂組成物は、本発明の効果を損なわない範囲で、タルクの他に非繊維状のフィラーを含んでもよい。非繊維状フィラーとしては、例えばマイカ、カオリン、パイロフィライト、ベントナイト、珪藻土、酸化マグネシウム、酸化アルミニウム、酸化亜鉛、シリカ、酸化チタン、炭酸カルシウム、炭酸マグネシウム、窒化ホウ素、窒化アルミニウム、炭化珪素、ガラスビーズ、ガラスフレーク、黒鉛、カーボンブラック、アルミニウム、銅等が挙げられる。 The heat conductive resin composition of the present invention may contain a non-fibrous filler in addition to talc as long as the effects of the present invention are not impaired. Non-fibrous fillers include, for example, mica, kaolin, pyrophyllite, bentonite, diatomaceous earth, magnesium oxide, aluminum oxide, zinc oxide, silica, titanium oxide, calcium carbonate, magnesium carbonate, boron nitride, aluminum nitride, silicon carbide, glass Examples include beads, glass flakes, graphite, carbon black, aluminum, and copper.
本発明で用いられるガラス繊維は扁平形状の断面を有し、好ましくは扁平率が２〜２０である。
扁平率とは、図１に示すように、ガラス繊維の断面の短径をＤ１、断面の長径をＤ２としたとき、Ｄ２／Ｄ１で表される。
The glass fiber used in the present invention has a flat cross section, and preferably has a flatness ratio of 2-20.
As shown in FIG. 1, the flatness ratio is expressed by D2 / D1, where D1 is the minor axis of the cross section of the glass fiber and D2 is the major axis of the cross section.
本発明のガラス繊維は、その繊維長について特に制限はないが、製造上の利便性の観点から、好ましくは繊維長が１ｍｍ〜５ｍｍである。 The fiber length of the glass fiber of the present invention is not particularly limited, but the fiber length is preferably 1 mm to 5 mm from the viewpoint of manufacturing convenience.
本発明のガラス繊維は、ポリアリーレンサルファイドとの接着強度を高める目的等で、その表面を有機化合物でコーティングする、多数のガラス繊維を有機化合物で収束する等の処理を施してもよい。 The glass fiber of the present invention may be subjected to a treatment such as coating the surface with an organic compound or converging a number of glass fibers with an organic compound for the purpose of increasing the adhesive strength with polyarylene sulfide.
本発明の伝熱性樹脂組成物は、本発明の効果を損なわない範囲で、扁平形状の断面を有するガラス繊維の他に繊維状フィラーを含んでもよい。繊維状フィラーとしては、例えば扁平ガラス繊維でないガラス繊維、チタン酸カリウムウィスカー、ホウ酸アルミニウムウィスカー、アラミド繊維、酸化アルミニウム繊維、炭素繊維、銅繊維等が挙げられる。 The heat conductive resin composition of the present invention may contain a fibrous filler in addition to the glass fiber having a flat cross section within a range not impairing the effects of the present invention. Examples of the fibrous filler include glass fibers that are not flat glass fibers, potassium titanate whiskers, aluminum borate whiskers, aramid fibers, aluminum oxide fibers, carbon fibers, and copper fibers.
また、本発明の伝熱性樹脂組成物は、本発明の効果を損なわない範囲で常用の樹脂添加剤を加えることができる。樹脂添加剤としては、例えば離型剤、可塑剤、難燃剤、酸化防止剤、金属不活性化剤、相容化剤等が挙げられる。 Moreover, the heat-transfer resin composition of this invention can add a usual resin additive in the range which does not impair the effect of this invention. Examples of the resin additive include a mold release agent, a plasticizer, a flame retardant, an antioxidant, a metal deactivator, and a compatibilizer.
本発明の伝熱性樹脂組成物は、公知の溶融混練法によって製造できる。
例えば成分（Ａ）及び（Ｂ）を所定の割合でドライブレンドした後、市販の二軸混練押出機にトップフィードし、成分（Ｃ）をサイドフィードする方法が挙げられる。
The heat conductive resin composition of the present invention can be produced by a known melt-kneading method.
For example, there is a method in which components (A) and (B) are dry blended at a predetermined ratio, then top-fed to a commercially available twin-screw kneading extruder, and component (C) is side-fed.
本発明の伝熱性樹脂組成物は、高い伝熱性を有し、絶縁性及び靭性にも優れる。このため、高放熱性を必要とする電子部品に好適である。
上記電子部品の具体例としては、基板封止材、コイル封止材、基板ケース、電池ケース、抵抗素子ケース、ＨＩＤランプの電子バラストケース、コイルボビン、ヒートシンク、ソレノイド、モーターファン、イオン発生デバイスの誘電体、ランプリフレクター、ランプソケット、ランプホルダー、ＬＥＤパッケージ、ＬＥＤスペーサー、ＬＥＤソケット、ＬＥＤ台座コネクタ及びＬＥＤ素子フレーム等が挙げられる。
The heat transfer resin composition of the present invention has high heat transfer properties and is excellent in insulation and toughness. For this reason, it is suitable for the electronic component which requires high heat dissipation.
Specific examples of the electronic components include a substrate sealing material, a coil sealing material, a substrate case, a battery case, a resistance element case, an electronic ballast case for a HID lamp, a coil bobbin, a heat sink, a solenoid, a motor fan, and a dielectric for an ion generating device. Examples include a body, a lamp reflector, a lamp socket, a lamp holder, an LED package, an LED spacer, an LED socket, an LED base connector, and an LED element frame.
以下、本発明を実施例によって、さらに具体的に説明する。
本発明の実施例及び比較例において、成分（Ａ）〜（Ｃ）として下記（Ａ１）、（Ｂ１）及び（Ｃ１）を用い、その他の成分として下記（Ｄ）〜（Ｈ）を用いた。
（Ａ１）：Ｃ−２０１（ポリフェニレンサルファイド樹脂、大日本インキ化学工業株式会社製）
（Ｂ１）：ＳＷ−ＡＣ（タルク、重量メジアン粒子径１５μｍ、浅田製粉株式会社製）
（Ｃ１）：ＣＳＧ ３ＰＡ−８３０（扁平形状の断面を有するガラス繊維、扁平率４、日東紡績株式会社製）
（Ｄ）：０３ＪＡＦＴ５９１（ガラス繊維、扁平率１、オーウェンス・コーニング社製）
（Ｅ）：♯５００（酸化マグネシウム粉、タテホ化学工業株式会社製）
（Ｆ）：酸化亜鉛１種（酸化亜鉛粉、堺化学工業株式会社製）
（Ｇ）：ＳＣ２０Ｈ（シリカ粉、株式会社マイクロン製）
（Ｈ）：ホワイトンＰ−３０（炭酸カルシウム粉、白石カルシウム株式会社製）
Hereinafter, the present invention will be described more specifically with reference to examples.
In Examples and Comparative Examples of the present invention, the following (A1), (B1) and (C1) were used as the components (A) to (C), and the following (D) to (H) were used as the other components.
(A1): C-201 (polyphenylene sulfide resin, manufactured by Dainippon Ink & Chemicals, Inc.)
(B1): SW-AC (talc, weight median particle diameter 15 μm, manufactured by Asada Flour Milling Co., Ltd.)
(C1): CSG 3PA-830 (glass fiber having a flat cross section,
(D): 03JAFT591 (glass fiber, flatness ratio 1, manufactured by Owens Corning)
(E): # 500 (magnesium oxide powder, manufactured by Tateho Chemical Co., Ltd.)
(F): 1 type of zinc oxide (zinc oxide powder, manufactured by Sakai Chemical Industry Co., Ltd.)
(G): SC20H (silica powder, manufactured by Micron Corporation)
(H): Whiten P-30 (calcium carbonate powder, manufactured by Shiroishi Calcium Co., Ltd.)
実施例１
（Ａ１）及び（Ｂ１）を、重量比が２０対４０となるようにそれぞれ量りとった。この原料をドライブレンドし、二軸混練押出機ＴＥＭ３７ＢＳ（東芝機械株式会社製）のトップフィーダーに投入し、また適量の（Ｃ１）をサイドフィーダーに投入した。（Ａ１）及び（Ｂ１）の混合物を６．０ｋｇ／ｈｒのフィード速度で供給し、（Ｃ１）を４．０ｋｇ／ｈｒのフィード速度で供給し、混練した。尚、混練の際にバレルとダイスの設定温度は３２０℃とした。ダイスから出た組成物のストランドを水冷し、ペレット状にカットした。得られた組成物は、成分の凝集等は見られず良好であった。得られた組成物を分析した結果、成分（Ａ）〜（Ｃ）の合計量に対する各成分の重量分率が、（Ａ１）が２０重量％、（Ｂ１）が４０重量％、（Ｃ１）が４０重量％であった。尚、各成分の配合量の測定方法としては、得られた組成物を坩堝に入れ、６００℃の炉で６時間燃焼し、燃焼前の組成物及び燃焼残渣の重量減少率から樹脂の割合を求めた。さらに、燃焼残渣についてＸ線回折法を用いてタルクの割合を求めた。
得られた樹脂組成物のペレットについて、ＡＳＴＭ Ｄ２５６に準拠してノッチ付Ｉｚｏｄ強度を測定した。結果を表１に示す。
Example 1
(A1) and (B1) were weighed so that the weight ratio was 20:40. This raw material was dry blended and charged into a top feeder of a twin screw kneading extruder TEM37BS (manufactured by Toshiba Machine Co., Ltd.), and an appropriate amount of (C1) was charged into a side feeder. The mixture of (A1) and (B1) was supplied at a feed rate of 6.0 kg / hr, and (C1) was supplied at a feed rate of 4.0 kg / hr and kneaded. The kneading temperature was set to 320 ° C. for the barrel and the die. The strand of the composition coming out of the die was cooled with water and cut into pellets. The obtained composition was good with no aggregation of components or the like. As a result of analyzing the obtained composition, the weight fraction of each component with respect to the total amount of the components (A) to (C) is (A1) is 20% by weight, (B1) is 40% by weight, and (C1) is It was 40% by weight. In addition, as a measuring method of the compounding amount of each component, the obtained composition is put into a crucible and burned in a furnace at 600 ° C. for 6 hours, and the ratio of the resin is determined from the weight reduction rate of the composition and combustion residue before combustion. Asked. Furthermore, the ratio of talc was calculated | required about the combustion residue using the X ray diffraction method.
About the pellet of the obtained resin composition, Izod intensity | strength with a notch was measured based on ASTMD256. The results are shown in Table 1.
得られた樹脂組成物のペレットを用いて、８０ｍｍ角×３ｍｍ厚の平板を射出成形した。この平板成形品について、ＴＰＡ−５０１（京都電子工業株式会社製）を用いて熱伝導率を測定した。測定条件はセンサー直径を２０ｍｍ、測定モードを“Ｓｌａｂ Ｓｈｅｅｔｓ”とした。また、この平板成形品について、ＡＳＴＭ Ｄ２５７に準拠して体積抵抗率を測定した。結果を表１に示す。 A 80 mm square × 3 mm thick flat plate was injection molded using the pellets of the obtained resin composition. About this flat plate molded product, thermal conductivity was measured using TPA-501 (made by Kyoto Electronics Industry Co., Ltd.). The measurement conditions were a sensor diameter of 20 mm and a measurement mode of “Slab Sheets”. Moreover, about this flat plate molded article, the volume resistivity was measured based on ASTMD257. The results are shown in Table 1.
比較例１
（Ｃ１）の代わりに（Ｄ）を用いた他は、実施例１と同様にして樹脂組成物及び成形品を製造し、同様の評価を行った。結果を表１に示す。
Comparative Example 1
A resin composition and a molded product were produced in the same manner as in Example 1 except that (D) was used instead of (C1), and the same evaluation was performed. The results are shown in Table 1.
実施例１の樹脂組成物は比較例１に比べて、ノッチ付Ｉｚｏｄ強度が６２％高くなっており、靭性が著しく向上していることが確認された。また、実施例１の樹脂組成物からなる成形品は、実用に耐えうる十分な伝熱性及び絶縁性を有することが確認された。 The resin composition of Example 1 had a notched Izod strength of 62% higher than that of Comparative Example 1, and it was confirmed that the toughness was remarkably improved. Moreover, it was confirmed that the molded article which consists of a resin composition of Example 1 has sufficient heat conductivity and insulation which can be practically used.
実施例２
（Ａ１）及び（Ｂ１）を、重量比が２５対２０となるようにそれぞれ量りとった。この原料をドライブレンドし、二軸混練押出機ＴＥＭ３７ＢＳ（東芝機械株式会社製）のトップフィーダーに投入し、また適量の（Ｃ１）をサイドフィーダーに投入した。（Ａ１）及び（Ｂ１）の混合物を４．５ｋｇ／ｈｒのフィード速度で供給し、（Ｃ１）を５．５ｋｇ／ｈｒのフィード速度で供給し、混練した。尚、混練の際にバレルとダイスの設定温度は３２０℃とした。ダイスから出た組成物のストランドを水冷し、ペレット状にカットした。得られた組成物は、成分の凝集等は見られず良好であった。得られた組成物を分析した結果、成分（Ａ）〜（Ｃ）の合計量に対する各成分の重量分率が、（Ａ１）が２５重量％、（Ｂ１）が２０重量％、（Ｃ１）が５５重量％であった。
Example 2
(A1) and (B1) were weighed so that the weight ratio was 25:20. This raw material was dry blended and charged into a top feeder of a twin screw kneading extruder TEM37BS (manufactured by Toshiba Machine Co., Ltd.), and an appropriate amount of (C1) was charged into a side feeder. The mixture of (A1) and (B1) was supplied at a feed rate of 4.5 kg / hr, and (C1) was supplied at a feed rate of 5.5 kg / hr and kneaded. The kneading temperature was set to 320 ° C. for the barrel and the die. The strand of the composition coming out of the die was cooled with water and cut into pellets. The obtained composition was good with no aggregation of components or the like. As a result of analyzing the obtained composition, the weight fraction of each component with respect to the total amount of components (A) to (C) is (A1) is 25% by weight, (B1) is 20% by weight, and (C1) is It was 55% by weight.
得られた樹脂組成物のペレットについて、実施例１と同様の評価を行った。また、得られた樹脂組成物のペレットを用いて実施例１と同様にして成形品を製造し、実施例１と同様にして評価した。結果を表１に示す。 About the pellet of the obtained resin composition, evaluation similar to Example 1 was performed. Further, a molded product was produced in the same manner as in Example 1 using the obtained pellets of the resin composition, and evaluated in the same manner as in Example 1. The results are shown in Table 1.
比較例２
（Ｃ１）の代わりに（Ｄ）を用いた他は、実施例２と同様にして樹脂組成物及び成形品を製造し、実施例１と同様にして評価を行った。結果を表１に示す。
Comparative Example 2
A resin composition and a molded product were produced in the same manner as in Example 2 except that (D) was used instead of (C1), and evaluation was performed in the same manner as in Example 1. The results are shown in Table 1.
実施例２の樹脂組成物は比較例２に比べて、ノッチ付Ｉｚｏｄ強度が７１％高くなっており、靭性が著しく向上していることが確認された。また、実施例２の樹脂組成物からなる成形品は、実用に耐えうる十分な伝熱性及び絶縁性を有することが確認された。 The resin composition of Example 2 had a notched Izod strength of 71% higher than that of Comparative Example 2, and it was confirmed that the toughness was remarkably improved. Moreover, it was confirmed that the molded article which consists of a resin composition of Example 2 has sufficient heat conductivity and insulation which can be practically used.
実施例３
（Ａ１）及び（Ｂ１）を、重量比が２５対５０となるようにそれぞれ量りとった。この原料をドライブレンドし、二軸混練押出機ＴＥＭ３７ＢＳ（東芝機械株式会社製）のトップフィーダーに投入し、また適量の（Ｃ１）をサイドフィーダーに投入した。（Ａ１）及び（Ｂ１）の混合物を７．５ｋｇ／ｈｒのフィード速度で供給し、（Ｃ１）を２．５ｋｇ／ｈｒのフィード速度で供給し、混練した。尚、混練の際にバレルとダイスの設定温度は３２０℃とした。ダイスから出た組成物のストランドを水冷し、ペレット状にカットした。得られた組成物は、成分の凝集等は見られず良好であった。得られた組成物を分析した結果、成分（Ａ）〜（Ｃ）の合計量に対する各成分の重量分率が、（Ａ１）が２５重量％、（Ｂ１）が５０重量％、（Ｃ１）が２５重量％であった。
Example 3
(A1) and (B1) were weighed so that the weight ratio was 25:50. This raw material was dry blended and charged into a top feeder of a twin screw kneading extruder TEM37BS (manufactured by Toshiba Machine Co., Ltd.), and an appropriate amount of (C1) was charged into a side feeder. The mixture of (A1) and (B1) was supplied at a feed rate of 7.5 kg / hr, and (C1) was supplied at a feed rate of 2.5 kg / hr and kneaded. The kneading temperature was set to 320 ° C. for the barrel and the die. The strand of the composition coming out of the die was cooled with water and cut into pellets. The obtained composition was good with no aggregation of components or the like. As a result of analyzing the obtained composition, the weight fraction of each component with respect to the total amount of components (A) to (C) is (A1) is 25% by weight, (B1) is 50% by weight, and (C1) is It was 25% by weight.
得られた樹脂組成物のペレットについて、実施例１と同様の評価を行った。また、得られた樹脂組成物のペレットを用いて実施例１と同様にして成形品を製造し、実施例１と同様にして評価した。結果を表１に示す。 About the pellet of the obtained resin composition, evaluation similar to Example 1 was performed. Further, a molded product was produced in the same manner as in Example 1 using the obtained pellets of the resin composition, and evaluated in the same manner as in Example 1. The results are shown in Table 1.
比較例３
（Ｃ１）の代わりに（Ｄ）を用いた他は、実施例３と同様にして樹脂組成物及び成形品を製造し、実施例１と同様にして評価を行った。結果を表１に示す。
Comparative Example 3
A resin composition and a molded product were produced in the same manner as in Example 3 except that (D) was used instead of (C1), and evaluation was performed in the same manner as in Example 1. The results are shown in Table 1.
実施例３の樹脂組成物は比較例３に比べて、ノッチ付Ｉｚｏｄ強度が５２％高くなっており、靭性が著しく向上していることが確認された。また、実施例３の樹脂組成物からなる成形品は、実用に耐えうる十分な伝熱性及び絶縁性を有することが確認された。 The resin composition of Example 3 had a notched Izod strength of 52% higher than that of Comparative Example 3, and it was confirmed that the toughness was remarkably improved. Moreover, it was confirmed that the molded article which consists of a resin composition of Example 3 has sufficient heat conductivity and insulation which can be practically used.
実施例４
（Ａ１）及び（Ｂ１）を、重量比が４０対３０となるようにそれぞれ量りとった。この原料をドライブレンドし、二軸混練押出機ＴＥＭ３７ＢＳ（東芝機械株式会社製）のトップフィーダーに投入し、また適量の（Ｃ１）をサイドフィーダーに投入した。（Ａ１）及び（Ｂ１）の混合物を７．０ｋｇ／ｈｒのフィード速度で供給し、（Ｃ１）を３．０ｋｇ／ｈｒのフィード速度で供給し、混練した。尚、混練の際にバレルとダイスの設定温度は３２０℃とした。ダイスから出た組成物のストランドを水冷し、ペレット状にカットした。得られた組成物は、成分の凝集等は見られず良好であった。得られた組成物を分析した結果、成分（Ａ）〜（Ｃ）の合計量に対する各成分の重量分率が、（Ａ１）が４０重量％、（Ｂ１）が３０重量％、（Ｃ１）が３０重量％であった。
Example 4
(A1) and (B1) were weighed so that the weight ratio was 40:30. This raw material was dry blended and charged into a top feeder of a twin screw kneading extruder TEM37BS (manufactured by Toshiba Machine Co., Ltd.), and an appropriate amount of (C1) was charged into a side feeder. The mixture of (A1) and (B1) was supplied at a feed rate of 7.0 kg / hr, and (C1) was supplied at a feed rate of 3.0 kg / hr and kneaded. The kneading temperature was set to 320 ° C. for the barrel and the die. The strand of the composition coming out of the die was cooled with water and cut into pellets. The obtained composition was good with no aggregation of components or the like. As a result of analyzing the obtained composition, the weight fraction of each component with respect to the total amount of the components (A) to (C) is (A1) is 40% by weight, (B1) is 30% by weight, and (C1) is It was 30% by weight.
得られた樹脂組成物のペレットについて、実施例１と同様の評価を行った。また、得られた樹脂組成物のペレットを用いて実施例１と同様にして成形品を製造し、実施例１と同様にして評価した。結果を表１に示す。 About the pellet of the obtained resin composition, evaluation similar to Example 1 was performed. Further, a molded product was produced in the same manner as in Example 1 using the obtained pellets of the resin composition, and evaluated in the same manner as in Example 1. The results are shown in Table 1.
比較例４
（Ｃ１）の代わりに（Ｄ）を用いた他は、実施例４と同様にして樹脂組成物及び成形品を製造し、実施例１と同様にして評価を行った。結果を表１に示す。
Comparative Example 4
A resin composition and a molded product were produced in the same manner as in Example 4 except that (D) was used instead of (C1), and evaluation was performed in the same manner as in Example 1. The results are shown in Table 1.
実施例４の樹脂組成物は比較例４に比べて、ノッチ付Ｉｚｏｄ強度が６７％高くなっており、靭性が著しく向上していることが確認された。また、実施例４の樹脂組成物からなる成形品は、実用に耐えうる十分な伝熱性及び絶縁性を有することが確認された。 The resin composition of Example 4 had a notched Izod strength of 67% higher than that of Comparative Example 4, and it was confirmed that the toughness was remarkably improved. Moreover, it was confirmed that the molded article which consists of a resin composition of Example 4 has sufficient heat conductivity and insulation which can be practically used.
比較例５
（Ａ１）及び（Ｂ１）を、重量比が４０対５０となるようにそれぞれ量りとった。この原料をドライブレンドし、二軸混練押出機ＴＥＭ３７ＢＳ（東芝機械株式会社製）のトップフィーダーに投入し、また適量の（Ｃ１）をサイドフィーダーに投入した。（Ａ１）及び（Ｂ１）の混合物を９．０ｋｇ／ｈｒのフィード速度で供給し、（Ｃ１）を１．０ｋｇ／ｈｒのフィード速度で供給し、混練した。尚、混練の際にバレルとダイスの設定温度は３２０℃とした。ダイスから出た組成物のストランドを水冷し、ペレット状にカットした。得られた組成物は、成分の凝集等は見られず良好であった。得られた組成物を分析した結果、成分（Ａ）〜（Ｃ）の合計量に対する各成分の重量分率が、（Ａ１）が４０重量％、（Ｂ１）が５０重量％、（Ｃ１）が１０重量％であった。
Comparative Example 5
(A1) and (B1) were weighed so that the weight ratio was 40:50. This raw material was dry blended and charged into a top feeder of a twin screw kneading extruder TEM37BS (manufactured by Toshiba Machine Co., Ltd.), and an appropriate amount of (C1) was charged into a side feeder. The mixture of (A1) and (B1) was supplied at a feed rate of 9.0 kg / hr, and (C1) was supplied at a feed rate of 1.0 kg / hr and kneaded. The kneading temperature was set to 320 ° C. for the barrel and the die. The strand of the composition coming out of the die was cooled with water and cut into pellets. The obtained composition was good with no aggregation of components or the like. As a result of analyzing the obtained composition, the weight fraction of each component with respect to the total amount of the components (A) to (C) was (A1) 40% by weight, (B1) 50% by weight, and (C1) It was 10% by weight.
得られた樹脂組成物のペレットについて、実施例１と同様の評価を行った。また、得られた樹脂組成物のペレットを用いて実施例１と同様にして成形品を製造し、実施例１と同様にして評価した。結果を表１に示す。 About the pellet of the obtained resin composition, evaluation similar to Example 1 was performed. Further, a molded product was produced in the same manner as in Example 1 using the obtained pellets of the resin composition, and evaluated in the same manner as in Example 1. The results are shown in Table 1.
比較例６
（Ｃ１）の代わりに（Ｄ）を用いた他は、比較例５と同様にして樹脂組成物及び成形品を製造し、実施例１と同様にして評価を行った。結果を表１に示す。
Comparative Example 6
A resin composition and a molded product were produced in the same manner as in Comparative Example 5 except that (D) was used instead of (C1), and evaluation was performed in the same manner as in Example 1. The results are shown in Table 1.
比較例５の樹脂組成物は比較例６に比べて、ノッチ付Ｉｚｏｄ強度が２３％高くなっているものの、その靭性は不十分であった。 Although the resin composition of Comparative Example 5 had a notched Izod strength of 23% higher than that of Comparative Example 6, its toughness was insufficient.
比較例７
（Ａ１）及び（Ｂ１）を、重量比が１０対４０となるようにそれぞれ量りとった。この原料をドライブレンドし、二軸混練押出機ＴＥＭ３７ＢＳ（東芝機械株式会社製）のトップフィーダーに投入し、また適量の（Ｃ１）をサイドフィーダーに投入した。（Ａ１）及び（Ｂ１）の混合物を５．０ｋｇ／ｈｒのフィード速度で供給し、（Ｃ１）を５．０ｋｇ／ｈｒのフィード速度で供給し、混練した。尚、混練の際にバレルとダイスの設定温度は３２０℃とした。しかし、供給物がバレル内に詰まり、樹脂組成物を得ることができなかった。このため、実施例１で行った評価が実施できなかった。
良好なペレットが得られなかった理由としては、マトリックスとなる成分（Ａ）が少なすぎることが考えられる。
Comparative Example 7
(A1) and (B1) were weighed so that the weight ratio was 10:40. This raw material was dry blended and charged into a top feeder of a twin screw kneading extruder TEM37BS (manufactured by Toshiba Machine Co., Ltd.), and an appropriate amount of (C1) was charged into a side feeder. The mixture of (A1) and (B1) was supplied at a feed rate of 5.0 kg / hr, and (C1) was supplied at a feed rate of 5.0 kg / hr and kneaded. The kneading temperature was set to 320 ° C. for the barrel and the die. However, the supply was clogged in the barrel, and a resin composition could not be obtained. For this reason, the evaluation performed in Example 1 could not be performed.
The reason why a good pellet could not be obtained may be that the component (A) serving as a matrix is too small.
比較例８
（Ｂ１）の代わりに（Ｅ）を用いた他は、実施例１と同様にして樹脂組成物及び成形品を製造し、実施例１と同様にして評価を行った。結果を表１に示す。
Comparative Example 8
A resin composition and a molded product were produced in the same manner as in Example 1 except that (E) was used instead of (B1), and evaluation was performed in the same manner as in Example 1. The results are shown in Table 1.
比較例９
（Ｃ１）の代わりに（Ｄ）を用いた他は、比較例８と同様にして樹脂組成物及び成形品を製造し、実施例１と同様にして評価を行った。結果を表１に示す。
Comparative Example 9
A resin composition and a molded product were produced in the same manner as in Comparative Example 8, except that (D) was used instead of (C1), and evaluation was performed in the same manner as in Example 1. The results are shown in Table 1.
比較例８の樹脂組成物は比較例９に比べて、ノッチ付Ｉｚｏｄ強度が１９％高くなっているものの、その靭性は不十分であった。 The resin composition of Comparative Example 8 had a notched Izod strength of 19% higher than that of Comparative Example 9, but its toughness was insufficient.
比較例１０
（Ｂ１）の代わりに（Ｆ）を用いた他は、実施例１と同様にして樹脂組成物及び成形品を製造し、実施例１と同様にして評価を行った。結果を表１に示す。
Comparative Example 10
A resin composition and a molded product were produced in the same manner as in Example 1 except that (F) was used instead of (B1), and evaluation was performed in the same manner as in Example 1. The results are shown in Table 1.
比較例１１
（Ｃ１）の代わりに（Ｄ）を用いた他は、比較例１０と同様にして樹脂組成物及び成形品を製造し、実施例１と同様にして評価を行った。結果を表１に示す。
Comparative Example 11
A resin composition and a molded product were produced in the same manner as in Comparative Example 10 except that (D) was used instead of (C1), and evaluation was performed in the same manner as in Example 1. The results are shown in Table 1.
比較例１０の樹脂組成物は比較例１１に比べて、ノッチ付Ｉｚｏｄ強度が２４％高くなっているものの、その伝熱性は不十分であった。 The resin composition of Comparative Example 10 had a notched Izod strength of 24% higher than that of Comparative Example 11, but its heat transfer was insufficient.
比較例１２
（Ｂ１）の代わりに（Ｇ）を用いた他は、実施例１と同様にして樹脂組成物及び成形品を製造し、実施例１と同様にして評価を行った。結果を表１に示す。
Comparative Example 12
A resin composition and a molded product were produced in the same manner as in Example 1 except that (G) was used instead of (B1), and evaluation was performed in the same manner as in Example 1. The results are shown in Table 1.
比較例１３
（Ｃ１）の代わりに（Ｄ）を用いた他は、比較例１２と同様にして樹脂組成物及び成形品を製造し、実施例１と同様にして評価を行った。結果を表１に示す。
Comparative Example 13
A resin composition and a molded product were produced in the same manner as in Comparative Example 12 except that (D) was used instead of (C1), and evaluation was performed in the same manner as in Example 1. The results are shown in Table 1.
比較例１２の樹脂組成物は比較例１３に比べて、ノッチ付Ｉｚｏｄ強度が１８％高くなっているものの、その靭性は不十分であった。 Although the resin composition of Comparative Example 12 had a notched Izod strength of 18% higher than that of Comparative Example 13, its toughness was insufficient.
比較例１４
（Ｂ１）の代わりに（Ｈ）を用いた他は、実施例１と同様にして樹脂組成物及び成形品を製造し、実施例１と同様にして評価を行った。結果を表１に示す。
Comparative Example 14
A resin composition and a molded product were produced in the same manner as in Example 1 except that (H) was used instead of (B1), and evaluation was performed in the same manner as in Example 1. The results are shown in Table 1.
比較例１５
（Ｃ１）の代わりに（Ｄ）を用いた他は、比較例１４と同様にして樹脂組成物及び成形品を製造し、実施例１と同様にして評価を行った。結果を表１に示す。
Comparative Example 15
A resin composition and a molded product were produced in the same manner as in Comparative Example 14 except that (D) was used instead of (C1), and evaluation was performed in the same manner as in Example 1. The results are shown in Table 1.
比較例１４の樹脂組成物は比較例１５に比べて、ノッチ付Ｉｚｏｄ強度が１２％高くなっているものの、その靭性は不十分であった。また、比較例１４及び１５の樹脂組成物からなる成形品は、実用に耐えうる伝熱性を有していなかった。 Although the resin composition of Comparative Example 14 had a notched Izod strength of 12% higher than that of Comparative Example 15, its toughness was insufficient. Moreover, the molded article which consists of a resin composition of the comparative examples 14 and 15 did not have heat conductivity which can endure practical use.
本発明の伝熱性樹脂組成物は、高い伝熱性を有し、絶縁性及び靭性にも優れるため、高放熱性が求められる各種電子部品の材料として好適に用いることができる。 Since the heat conductive resin composition of the present invention has high heat conductivity and is excellent in insulation and toughness, it can be suitably used as a material for various electronic components that require high heat dissipation.
Claims (5)
（Ａ）ポリアリーレンサルファイド：１５〜４５重量％
（Ｂ）タルク：１５〜５５重量％
（Ｃ）扁平形状の断面を有するガラス繊維：１５〜６０重量％
（前記各成分の配合量は、成分（Ａ）〜（Ｃ）の合計量に対する重量分率である） The heat conductive resin composition containing the following components (A)-(C).
(A) Polyarylene sulfide: 15 to 45% by weight
(B) Talc: 15-55 wt%
(C) Glass fiber having a flat cross section: 15 to 60% by weight
(The amount of each component is a weight fraction with respect to the total amount of components (A) to (C))
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| JP2007103811A JP2008260830A (en) | 2007-04-11 | 2007-04-11 | Heat-conductive resin composition |
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| JP2007103811A JP2008260830A (en) | 2007-04-11 | 2007-04-11 | Heat-conductive resin composition |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2010043229A (en) * | 2008-08-18 | 2010-02-25 | Idemitsu Kosan Co Ltd | Thermally conductive resin composition and resin molding of the composition |
| JP2010285581A (en) * | 2009-06-15 | 2010-12-24 | Toyota Motor Corp | Insulating resin composition |
| JP2013075996A (en) * | 2011-09-30 | 2013-04-25 | Dic Corp | High heat radiation polyarylene sulfide resin composition and molded product |
| WO2013191207A1 (en) * | 2012-06-21 | 2013-12-27 | Dic株式会社 | Highly heat dissipating polyarylene sulfide resin composition and molded body |
| JP2014145006A (en) * | 2013-01-28 | 2014-08-14 | Tosoh Corp | High-strength polyarylenesulfide-based composition |
| CN104275751A (en) * | 2013-07-12 | 2015-01-14 | 株式会社捷太格特 | Method of manufacturing electrical insulating resin material and rolling bearing |
| WO2015150140A1 (en) * | 2014-04-01 | 2015-10-08 | Dsm Ip Assets B.V. | Thermoconductive composition |
| US10450461B2 (en) | 2015-12-11 | 2019-10-22 | Ticona Llc | Crosslinkable polyarylene sulfide composition |
| US10590273B2 (en) | 2015-12-11 | 2020-03-17 | Ticona Llc | Polyarylene sulfide composition |
| US11118053B2 (en) | 2018-03-09 | 2021-09-14 | Ticona Llc | Polyaryletherketone/polyarylene sulfide composition |
| CN113423775A (en) * | 2019-02-27 | 2021-09-21 | 索尔维特殊聚合物美国有限责任公司 | Poly (arylene sulfide) compositions having high dielectric properties |
| US11383491B2 (en) | 2016-03-24 | 2022-07-12 | Ticona Llc | Composite structure |
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| JP2013075996A (en) * | 2011-09-30 | 2013-04-25 | Dic Corp | High heat radiation polyarylene sulfide resin composition and molded product |
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| US10450461B2 (en) | 2015-12-11 | 2019-10-22 | Ticona Llc | Crosslinkable polyarylene sulfide composition |
| US10590273B2 (en) | 2015-12-11 | 2020-03-17 | Ticona Llc | Polyarylene sulfide composition |
| US11383491B2 (en) | 2016-03-24 | 2022-07-12 | Ticona Llc | Composite structure |
| US11919273B2 (en) | 2016-03-24 | 2024-03-05 | Ticona Llc | Composite structure |
| US11118053B2 (en) | 2018-03-09 | 2021-09-14 | Ticona Llc | Polyaryletherketone/polyarylene sulfide composition |
| CN113423775A (en) * | 2019-02-27 | 2021-09-21 | 索尔维特殊聚合物美国有限责任公司 | Poly (arylene sulfide) compositions having high dielectric properties |
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