JP2009185151A - Heat conductive resin composition - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin composition being excellent in heat conductive property, insulation property, toughness and sliding property and preferable as a high heat release electronic part or the like, and a resin molded article obtained by molding the resin composition. <P>SOLUTION: The heat conductive resin composition contains (A) 10-40% mass of a polyamide based resin, (B) 15-60% mass of talc, and (C) 15-65% mass of a glass fiber having a cross section of flat shape based on the total amount of the components (A)-(C). <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

  The present invention relates to a heat conductive resin composition and a resin molded body thereof. More specifically, the present invention relates to a resin composition that is excellent in heat transfer properties, insulation properties, toughness, and slidability, and is suitable as a highly heat-dissipating electronic component, and a resin molded body formed by molding the resin composition.

The processing speed and packaging density of integrated circuits are improving year by year, and as a result, the amount of heat generated from semiconductor elements and the like is also increasing. For this reason, the demand for various high heat dissipation electronic components is increasing, and the demand for high heat transfer materials used for these high heat dissipation electronic components is also increasing. In addition to the electronic components described above, there is an increasing demand for highly heat-conductive materials in motor coils, halogen lamps, and the like.
Metals such as copper and aluminum are widely known as high heat transfer materials. However, many of the materials used for electronic parts need to have insulating properties, and in order to use these metals as materials for electronic parts, it is necessary to provide an insulating coating or the like.
Therefore, it has been attempted to use, as a high heat transfer material, a resin composition in which a filler having high heat transfer properties and insulating properties is added to a resin instead of metal. For example, in Patent Document 1, polyphenylene sulfide resin and calcium fluoride are used. A composite material comprising particles is disclosed. Patent Document 2 discloses a resin composition containing a polyarylene sulfide resin, a phosphorus-containing coated magnesium oxide and an alkoxysilane compound.

JP 2002-188007 A JP 2006-28283A

However, the high heat transfer materials described in Patent Documents 1 and 2 have a large amount of filler added in order to obtain sufficient heat transfer, and have the disadvantages of reduced toughness and increased cost of the high heat transfer materials. . As a method for improving the toughness of the resin composition, a method of adding an elastomer and / or a fibrous filler to the resin composition is known, but a sufficient effect is obtained for a resin composition containing a large amount of filler. There wasn't.
In addition, since the high heat transfer materials described in Patent Documents 1 and 2 both use a polyarylene sulfide resin, it is difficult to say that they are particularly excellent in the slidability required for drive system components and the like.

  The present invention has been made under such circumstances, and is excellent in heat transfer properties, insulation properties, toughness, and slidability, and is suitable as a highly heat-dissipating electronic component and the like, and molding the resin composition It aims at providing the resin molding which becomes.

  As a result of intensive studies to achieve the above object, the present inventors have achieved the object with a resin composition containing a polyamide-based resin, talc, and glass fibers having a flat cross section in specific ratios. The present invention was completed.

That is, the present invention
[1] Glass fiber having (A) polyamide-based resin 10 to 40% by mass, (B) talc 15 to 60% by mass, and (C) a flat cross section with respect to the total amount of components (A) to (C). A heat transfer resin composition comprising 15 to 65% by mass;
[2] The heat conductive resin composition according to [1], wherein the (A) polyamide-based resin is at least one selected from the group consisting of nylon 6, nylon 66, nylon 12, nylon MXD6, and nylon 9T. ,
[3] The heat conductive resin composition according to the above [1] or [2], wherein the average flatness of the glass fiber having a flat cross section (C) is 2 to 20,
[4] A heat conductive resin molded article obtained by molding the resin composition according to any one of [1] to [3], and [5] a heat conductive resin molded article according to [4]. Electronic parts used,
Is to provide.

  ADVANTAGE OF THE INVENTION According to this invention, it is excellent in heat conductivity, insulation, toughness, and slidability, and can provide a resin composition especially suitable as a high heat dissipation electronic component etc., and a resin molding using the same.

  The heat conductive resin composition of the present invention (hereinafter sometimes simply referred to as a resin composition) is a resin comprising (A) a polyamide-based resin, (B) talc, and (C) a glass fiber having a flat cross section. It is a composition.

[(A) Polyamide resin]
There is no restriction | limiting in particular as a component (A), Commercially available polyamide-type resin, for example, nylon 6, nylon 66, nylon 12, nylon MXD6, nylon 9T etc., can be used conveniently. A component (A) may be used individually by 1 type, and may be used in combination of 2 or more type.
Although there is no restriction | limiting in particular about the physical property of a component (A), A thing with high fluidity | liquidity is preferable from a viewpoint of molding processability. For example, the relative viscosity is preferably 4 or less, more preferably 3 or less, and such relative viscosity is particularly preferable when nylon 6 and / or nylon 66 is used. For the relative viscosity, a value measured by a method defined in JIS K6810 can be referred to.

  In addition, in the component (A), a part of the polymer chain may be substituted with another polymer as long as the effects of the present invention are not impaired. Examples of such other polymers include polyester resins, polyarylene ether resins, polyarylene sulfide resins, polystyrene resins, polyolefin resins, fluorine-containing resins, polyolefin elastomers, polyamide elastomers, and silicone elastomers. Can be mentioned.

  The compounding quantity of a component (A) is 10-40 mass% with respect to the total amount of a component (A)-(C), From viewpoints, such as workability, heat conductivity, and toughness, Preferably it is 15-40 mass. %, More preferably 15 to 35% by mass. When the blending amount of the component (A) is less than 10% by mass with respect to the total amount of the components (A) to (C), the processability of the resulting resin composition is poor and not practical. Moreover, when the compounding quantity of a component (A) exceeds 40 mass% with respect to the total amount of a component (A)-(C), the heat conductivity and toughness of the resin composition obtained will become low, and it cannot endure practically.

[(B) Talc]
The talc of the component (B) is a kind of natural mineral, and its chemical formula is represented by 3MgO.4SiO ₂ .H ₂ O or Mg ₃ Si ₄ O ₁₀ (OH) ₂ . Talc usually contains impurities according to the production area, etc., but the talc used in the present invention is not particularly limited with respect to the production area, the type of impurities and the amount thereof.
Although there is no restriction | limiting in particular about the magnitude | size of talc, From a viewpoint of the convenience on manufacture, Preferably a weight median particle diameter (D50) is 1-50 micrometers, More preferably, it is 3-30 micrometers. In the present specification, the weight median particle diameter is a value measured by a laser diffraction method. In addition, talc may use what gave the process of coating the surface with an organic compound, etc. for the purpose of improving affinity with a component (A) and improving the dispersibility in a resin composition. .
Component (B) may be a commercially available product. Examples of commercially available products include “SW-AC” (D50 = 15 μm, manufactured by Asada Flour Milling Co., Ltd.), “MS-T” (D50 = 20 μm, Nippon Talc Co., Ltd.). Company-made), “D-1000” (D50 = 1 μm, manufactured by Nippon Talc Co., Ltd.), “SP-38” (D50 = 48 μm, manufactured by Fuji Talc Industrial Co., Ltd.), and the like.

  The compounding quantity of a component (B) is 15-60 mass% with respect to the total amount of a component (A)-(C), From viewpoints, such as heat conductivity and toughness, Preferably it is 20-60 mass%. More preferably, it is 20-55 mass%. When the blending amount of the component (B) is less than 15% by mass with respect to the total amount of the components (A) to (C), the resulting resin composition has poor heat conductivity and is not practical. Moreover, when the compounding quantity of a component (B) exceeds 60 mass% with respect to the total amount of a component (A)-(C), the toughness of the resin composition obtained will become low and it is not practical.

(Other non-fibrous fillers)
The heat transfer resin composition of the present invention may contain a non-fibrous filler other than the component (B) together with the component (B) as long as the effects of the present invention are not impaired. Examples of the non-fibrous filler include mica, kaolin, pyrophyllite, bentonite, diatomaceous earth, magnesium oxide, aluminum oxide, zinc oxide, silica, titanium oxide, calcium carbonate, magnesium carbonate, boron nitride, aluminum nitride, silicon carbide, and glass. Examples include beads, glass flakes, graphite, carbon black, aluminum, and copper.

[(C) Glass fiber]
The glass fiber of component (C) has a flat (elliptical) cross section, and the average flatness is preferably 2 to 20, more preferably 2 to 12, and 2 to 6. Further preferred. When the average flatness is 2 or more, the resin composition has good toughness, fluidity and dimensional accuracy, and when it is 20 or less, the resin composition has good strength. Such flatness is obtained by dividing the long diameter (longest diameter) of the cross section of the glass fiber by the short diameter (shortest diameter). The major axis is preferably 5 to 60 μm, more preferably 10 to 40 μm.
The “average flatness” is because all the glass fibers need not have the flatness in the above range, and the average flatness of each glass fiber may be in the above range. Thus, by using the glass fiber having a flat cross section, the toughness of the resin composition is remarkably improved as compared with the case of using the glass fiber having a circular cross section, and the fluidity and dimensional accuracy are increased. Will also improve. A resin composition is obtained.
In addition, the long diameter (longest diameter) and short diameter (shortest diameter) of the said glass fiber are the values measured according to the method shown below.
<Measurement method of major axis and minor axis>
The glass fiber is ground with an epoxy resin and then polished to expose a cross section of the glass fiber. Next, the cross section is enlarged and observed with a transmission electron microscope or the like to obtain the flatness.

As the flat glass fiber of the component (C), any of raw materials made of alkali-containing glass, low alkali glass, non-alkali glass or the like can be suitably used.
Moreover, although there is no restriction | limiting in particular in the fiber length of glass fiber, From a viewpoint of the convenience on manufacture, it is preferable that average fiber length is 1-5 mm. As the form of the glass fiber, the form of chopped strand can be suitably used from the viewpoint of convenience during mixing. In addition, the surface of the glass fiber is improved with an organic compound or a silane coupling agent for the purpose of increasing the affinity with the component (A) to improve the adhesion and suppressing the strength reduction of the molded product due to void formation. It may be coated, or a treatment such as converging a large number of glass fibers with an organic compound may be performed.

Examples of silane coupling agents for coating the surface of glass fiber include triethoxysilane, vinyltris (β-methoxyethoxy) silane, γ-methacryloxypropyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, β- (1,1-epoxycyclohexyl) ethyltrimethoxysilane, N-β- (aminoethyl) -γ-aminopropyltrimethoxysilane, N-β- (aminoethyl) -γ-aminopropylmethyldimethoxysilane, γ -Aminopropyltriethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-chloropropyltrimethoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropyltrimethoxy (2 -Methoxy-eth Xy) silane, N-methyl-γ-aminopropyltrimethoxysilane, N-vinylbenzyl-γ-aminopropyltriethoxysilane, triaminopropyltrimethoxysilane, 3-ureidopropyltrimethoxysilane, 3- (4,5 -Dihydroimidazolyl) propyltriethoxysilane, hexamethyldisilazane, N, O- (bistrimethylsilyl) amide, N, N-bis (trimethylsilyl) urea and the like.
The surface treatment of the glass fiber using such a silane coupling agent can be performed by a generally known method, and there is no particular limitation. For example, a sizing method in which an organic solvent solution or suspension of the silane coupling agent is applied to glass fiber as a so-called sizing agent, or a Henschel mixer, a super mixer, a Laedige mixer, a V-type blender, or the like. It can be done by a method selected appropriately according to the shape of the glass fiber, such as dry mixing method, spray method, integral blend method, dry concentrate method, etc., but it can be done by sizing treatment method, dry mixing method, spray method desirable.

  Component (C) may be a commercially available product. Examples of commercially available products include “CSG 3PA-820” (average flatness ratio 4, average major axis = 28 μm, average minor axis = 7 μm, average fiber length = 3 mm, Nitto. "CSG 3PA-830" (average flatness ratio 4, average major axis = 28 µm, average minor axis = 7 µm, average fiber length = 3 mm, manufactured by Nitto Boseki), "CSH 3PA-870" (average) Flatness ratio 2, average major axis = 20 μm, average minor axis = 10 μm, average fiber length = 3 mm, manufactured by Nitto Boseki Co., Ltd.).

  The compounding quantity of a component (C) is 15-65 mass% with respect to the total amount of a component (A)-(C), Preferably it is 20-65 mass%, More preferably, it is 25-60 mass%. It is. When the blending amount of the component (C) is less than 15% by mass with respect to the total amount of the components (A) to (C), the toughness of the resulting resin composition is poor and not practical. Moreover, when the compounding quantity of a component (C) exceeds 65 mass% with respect to the total amount of a component (A)-(C), the workability of the resin composition obtained will become low and it is not practical.

(Other fibrous fillers)
The heat conductive resin composition of the present invention may contain a fibrous filler other than the component (C) together with the component (C) as long as the effects of the present invention are not impaired. Examples of the fibrous filler include glass fibers other than the component (C), potassium titanate whiskers, aluminum borate whiskers, aramid fibers, aluminum oxide fibers, carbon fibers, copper fibers, and the like.

[Optional components]
Moreover, the usual resin additive can be added to the heat conductive resin composition of this invention in the range which does not impair the effect of this invention. Examples of the resin additive include an antioxidant, an ultraviolet absorber / light stabilizer, a release agent, an antistatic agent, a flame retardant, a plasticizer, a compatibilizer, a colorant such as a dye / pigment, and the above components. Although thermoplastic resins other than (A), thermoplastic elastomers, etc. can be mentioned, it is not limited to these.

As antioxidant, a phenolic antioxidant and phosphorus antioxidant can be used preferably.
Examples of the phenolic antioxidant include triethylene glycol-bis [3- (3-tert-butyl-5-methyl-4-hydroxyphenyl) propionate], 1,6-hexanediol-bis [3- (3 5-di-tert-butyl-4-hydroxyphenyl) propionate], pentaerythritol-tetrakis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate], octadecyl-3- (3,5 -Di-tert-butyl-4-hydroxyphenyl) propionate, 1,3,5-trimethyl-2,4,6-tris (3,5-di-tert-butyl-4-hydroxybenzyl) benzene, N, N Hexamethylene bis (3,5-di-tert-butyl-4-hydroxy-hydrocinnamide), , 5-Di-tert-butyl-4-hydroxy-benzylphosphonate-diethyl ester, tris (3,5-di-tert-butyl-4-hydroxybenzyl) isocyanurate, 3,9-bis {1,1-dimethyl -2- [β- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionyloxy] ethyl} -2,4,8,10-tetraoxaspiro (5,5) undecane and the like.
Among these phenolic antioxidants, pentaerythritol-tetrakis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate] [for example, “Irganox 1010” (trade name, Ciba・ Specialty Chemicals). ] Is preferable.
Examples of phosphorus antioxidants include triphenyl phosphite, trisnonylphenyl phosphite, tris (2,4-di-tert-butylphenyl) phosphite, tridecyl phosphite, trioctyl phosphite, and trioctadecyl phosphite. Didecyl monophenyl phosphite, dioctyl monophenyl phosphite, diisopropyl monophenyl phosphite, monobutyl diphenyl phosphite, monodecyl diphenyl phosphite, monooctyl diphenyl phosphite, bis (2,6-di-tert-butyl- 4-methylphenyl) pentaerythritol diphosphite, 2,2-methylenebis (4,6-di-tert-butylphenyl) octyl phosphite, bis (nonylphenyl) pentaerythritol diphosphite Phosphite, bis (2,4-di -tert- butylphenyl) pentaerythritol diphosphite, and distearyl pentaerythritol phosphite.
Among these phosphorus antioxidants, bis (2,6-di-tert-butyl-4-methylphenyl) pentaerythritol diphosphite [for example, “PEP-36” (trade name, manufactured by ADEKA Corporation) )] Is preferred.
These antioxidants may be used individually by 1 type, and may be used in combination of 2 or more type. Moreover, combined use of a phenol type and a phosphorus type is preferable.

Examples of the UV absorber include benzotriazole UV absorbers, triazine UV absorbers, benzoxazine UV absorbers, and benzophenone UV absorbers.
Examples of the benzotriazole ultraviolet absorber include 2- (2′-hydroxy-5′-methylphenyl) benzotriazole and 2- (2′-hydroxy-3 ′-(3,4,5,6-tetrahydrophthalimidomethyl). ) -5′-methylphenyl) benzotriazole, 2- (2′-hydroxy-3 ′, 5′-di-tert-butylphenyl) benzotriazole, 2- (2′-hydroxy-5′-tert-octylphenyl) ) Benzotriazole, 2- (3'-tert-butyl-5'-methyl-2'-hydroxyphenyl) -5-chlorobenzotriazole, 2,2'-methylenebis (4- (1,1,3,3- Tetramethylbutyl) -6- (2H-benzotriazol-2-yl) phenol), 2- (2′-hydroxy-3 ′, 5′-bis (α, α-dimethylben) L) phenyl) -2H-benzotriazole, 2- (3 ′, 5′-di-tert-amyl-2′-hydroxyphenyl) benzotriazole, 5-trifluoromethyl-2- (2-hydroxy-3- ( 4-methoxy-α-cumyl) -5-tert-butylphenyl) -2H-benzotriazole and the like.

Examples of the triazine-based ultraviolet absorber include hydroxyphenyltriazine-based products such as “Tinuvin 400” (manufactured by Ciba Specialty Chemicals).
Examples of the benzoxazine-based ultraviolet absorber include 2-methyl-3,1-benzoxazin-4-one, 2-butyl-3,1-benzoxazine-4-one, 2-phenyl-3,1-benzoxazine -4-one, 2- (1- or 2-naphthyl) -3,1-benzoxazin-4-one, 2- (4-biphenyl) -3,1-benzoxazin-4-one, 2,2 ′ -Bis (3,1-benzoxazin-4-one), 2,2'-p-phenylenebis (3,1-benzoxazin-4-one), 2,2'-m-phenylenebis (3,1 -Benzoxazin-4-one), 2,2 '-(4,4'-diphenylene) bis (3,1-benzoxazin-4-one), 2,2'-(2,6 or 1,5- Naphthalene) bis (3,1-benzoxazin-4-one), 1, , 5- tris (3,1-benzoxazin-4-one-2-yl) benzene, and the like.

Examples of the benzophenone ultraviolet absorber include 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-n-octoxybenzophenone, 2-hydroxy-4-methoxy-2′-carboxybenzophenone, 2,4-dihydroxybenzophenone, 2,2′-dihydroxy-4-methoxybenzophenone and the like can be mentioned.
These ultraviolet absorbers may be used alone or in combination of two or more.

  The light stabilizer is preferably a hindered amine light stabilizer, such as bis (2,2,6,6-tetramethyl-4-piperidyl) sebacate, dimethyl-1- (2-hydroxyethyl) -4-hydroxy succinate. -2,2,6,6-tetramethylpiperidine polycondensate, tetrakis (2,2,6,6-tetramethyl-4-piperidyl) -1,2,3,4-butanetetracarboxylate, 2,2 , 6,6-tetramethyl-4-piperidylbenzoate, bis (1,2,6,6-pentamethyl-4-piperidyl) -2- (3,5-di-t-butyl-4-hydroxybenzyl) -2 -N-butyl malonate, bis (N-methyl-2,2,6,6-tetramethyl-4-piperidyl) sebacate, 1,1 '-(1,2-ethanediyl) bis (3,3,5, -Tetramethylpiperazine), N, N'-bis (3-aminopropyl) ethylenediamine-2,4-bis [N-butyl-N- (1,2,2,6,6-pentamethyl-4-piperidyl) amino ] -6-chloro-1,3,5-triazine condensate, poly [6-N-morpholyl-1,3,5-triazine-2,4-diyl] [(2,2,6,6-tetramethyl -4-piperidyl) imino] hexamethylene [(2,2,6,6-tetramethyl-4-piperidyl) imide], N, N′-bis (2,2,6,6-tetramethyl-4-piperidyl) ) Condensation product of hexamethylenediamine and 1,2-dibromoethane, [N- (2,2,6,6-tetramethyl-4-piperidyl) -2-methyl-2- (2,2,6,6) -Tetramethyl-4-piperidyl) imino] Pion'amido and the like. These light stabilizers may be used alone or in combination of two or more, and can also be used in combination with the ultraviolet absorber.

As the release agent, a higher fatty acid ester of a monohydric or polyhydric alcohol can be used.
Such higher fatty acid esters are preferably partial esters or complete esters of mono- or polyhydric alcohols having 1 to 20 carbon atoms and saturated fatty acids having 10 to 30 carbon atoms. Examples of partial esters or complete esters of monohydric or polyhydric alcohols and saturated fatty acids include stearic acid monoglyceride, stearic acid monosorbate, pehenic acid monoglyceride, pentaerythritol monostearate, pentaerythritol tetrastearate, propylene glycol monostearate. Examples thereof include rate, stearyl stearate, palmityl palmitate, butyl stearate, methyl laurate, isopropyl palmitate, 2-ethylhexyl stearate and the like.
These mold release agents may be used individually by 1 type, and may be used in combination of 2 or more type.
As the antistatic agent, for example, fatty acid monoglyceride having 14 to 30 carbon atoms, specifically stearic acid monoglyceride, palmitic acid monoglyceride, or a polyamide polyether block copolymer can be used.

As the flame retardant, a non-halogen flame retardant is preferable, and known ones such as nitrogen flame retardants, metal hydroxides, phosphorus flame retardants, organic alkali metal salts, organic alkaline earth metal salts, silicone flame retardants are used according to the purpose. Can be used.
Examples of the nitrogen-based flame retardant include melamine, an alkyl group, or an aromatic group-substituted melamine.
Examples of the metal hydroxide include magnesium hydroxide and aluminum hydroxide.
Examples of phosphorus flame retardants include halogen-free organic phosphorus flame retardants.
As the halogen-free organic phosphorus flame retardant, any organic compound having a phosphorus atom and not containing a halogen can be used without particular limitation. Among these, phosphate ester compounds having one or more ester oxygen atoms directly bonded to the phosphorus atom are preferably used. The phosphate ester compound may be a monomer, dimer, oligomer, polymer, or a mixture thereof.
Examples of halogen-free phosphorus-based flame retardants other than organic phosphorus-based flame retardants include red phosphorus.

Although there is no restriction | limiting in particular as an organic alkali metal salt and an organic alkaline earth metal salt, The alkali metal salt and alkaline earth metal salt of the organic acid or organic acid ester which have at least 1 carbon atom are used suitably. Here, organic sulfonic acid, organic carboxylic acid, etc. are mentioned as an organic acid or organic acid ester.
Examples of the alkali metal salt include salts such as sodium, potassium, lithium, and cesium. Examples of the alkaline earth metal salt include salts such as magnesium, calcium, strontium, and barium. The salt of the organic acid may be substituted with a halogen such as fluorine, chlorine or bromine. Specifically, potassium perfluoromethanesulfonic acid, perfluoroethanesulfonic acid or perfluorobutanesulfonic acid is used. Examples include salts.

Examples of the silicone flame retardant include silicone oil and silicone resin.
Examples of the silicone flame retardant include (poly) organosiloxanes having a functional group. Examples of this functional group include an alkoxy group, aryloxy, polyoxyalkylene group, hydrogen group, hydroxyl group, carboxyl group, cyano group, amino group, mercapto group, and epoxy group.
The said flame retardant may be used individually by 1 type, and may be used in combination of 2 or more type. In addition, flame retardant aids such as polyfluoroolefin and antimony oxide can be used in combination with the flame retardant.

  Examples of the thermoplastic resin / elastomer other than the component (A) include polycarbonate, polybutylene terephthalate, polyester resin, polyarylene ether resin, polyarylene sulfide resin, polystyrene resin, polyolefin resin, fluorine-containing resin, Examples include polyolefin elastomers, polyamide elastomers, and silicone elastomers.

[Preparation of resin composition]
There is no restriction | limiting in particular in the preparation method of the heat conductive resin composition of this invention, A conventionally well-known method can be employ | adopted, for example, a component (A), a component (B), a component (C), and using as needed The above-mentioned components to be prepared can be prepared by blending at a predetermined ratio and kneading at 240 to 320 ° C.
For compounding and kneading, after premixing with commonly used equipment such as a ribbon blender and drum tumbler, Henschel mixer, Banbury mixer, single screw extruder, twin screw extruder, multi screw extruder and It can be performed by a method using a conida or the like.
It should be noted that the components other than the component (A) can be added in advance after being melt-kneaded with a part of the component (A).

[Physical properties of resin composition]
The heat conductive resin composition of the present invention prepared as described above generally has the following physical properties.
About the pellet of the said resin composition, Izod impact strength with a notch measured based on ASTM D256 is about 4-12 kJ / m < ² >, More specifically, it is 6-10 kJ / m < ² >, and has high toughness ing.
The thermal conductivity measured for the flat molded product of the resin composition is about 1 to 4 W / K · m, more specifically 1.5 to 3 W / K · m, and has heat conductivity that can withstand practical use. ing. The method for measuring the thermal conductivity will be described later.
Moreover, the volume resistivity measured in accordance with ASTM D257 for the flat molded article of the resin composition is usually 10 ¹⁴ Ω · cm or more, and has an insulating property that can be practically used.
Further, for the flat molded product of the resin composition, the friction coefficient with SUS304 at a load of 150 N based on JIS K7218A method is usually 0.16 or less, and better is 0.14 or less, and the friction coefficient is low. High slidability.

  The heat transfer resin composition of the present invention thus obtained has high heat transfer properties and is excellent in insulation, toughness and slidability. For this reason, it is suitable for the electronic component which requires high heat dissipation. Specific examples of such electronic components include a substrate sealing material, a coil sealing material, a substrate case, a battery case, a resistance element case, an electronic ballast case for an HID lamp, a coil bobbin, a heat sink, a solenoid, a motor fan, and a dielectric for an ion generating device. Body, lamp reflector, lamp socket, lamp holder, LED package, LED spacer, LED socket, LED pedestal connector, LED element frame, bearing and gear.

EXAMPLES Next, although an Example demonstrates this invention still in detail, this invention is not limited at all by these examples.
As a method for measuring the blending amount of each component, the composition obtained in each example was put in a crucible and burned in a furnace at 600 ° C. for 6 hours. From the mass reduction rate of the composition before combustion and the combustion residue, the resin [component (A ′), (E) or (F)] was determined. Furthermore, the blending ratio of talc [component (B ′)] was determined for the combustion residue using an X-ray diffraction method.

Moreover, the performance evaluation of the resin composition obtained in each example was performed according to the following method.
(1) Izod impact strength with notch About the pellet of the resin composition, the Izod impact strength with a notch was measured based on ASTM D256.
(2) Thermal conductivity About 80 mm square x 3 mm thickness flat plate molded product obtained by injection molding using resin composition pellets, "TPA-501" (manufactured by Kyoto Electronics Industry Co., Ltd.) was used, and the sensor diameter : 20 mm, measurement mode: The thermal conductivity was measured under the conditions of Slab Sheets.
(3) Volume resistivity The volume resistivity was measured based on ASTM D257 about the 80 mm square * 3 mm thickness flat plate molded article obtained by injection molding using the resin composition pellet.
(4) Friction coefficient About the 80 mm square * 3 mm thickness flat plate molded product obtained by injection molding using the resin composition pellets, the friction coefficient with SUS304 at a load of 150 N was measured in accordance with the JIS K7218A method. A smaller coefficient of friction indicates better slidability.

In the examples and comparative examples of the present invention, each component used in the preparation of the resin composition is shown below.
[Component (A)]
A ′: P1010 (nylon 6, relative viscosity 2.1, manufactured by Ube Industries, Ltd.)
[Component (B)]
B ′: SW-AC (talc, weight median particle size 15 μm, manufactured by Asada Flour Milling Co., Ltd.)
[Component (C)]
C ′: CSG 3PA-820 (glass fiber having a flat cross section, average flatness ratio 4, average major axis = 28 μm, average minor axis = 7 μm, average fiber length = 3 mm, manufactured by Nitto Boseki Co., Ltd.)
[Other ingredients]
D: 03JAFT591 (glass fiber, average flatness ratio 1, average major axis = average minor axis = 10 μm, average fiber length = 3 mm, manufactured by Owens Corning)
E: FN1700 (polycarbonate, manufactured by Idemitsu Kosan Co., Ltd.)
F: N1300 (polybutylene terephthalate, manufactured by Mitsubishi Rayon Co., Ltd.)
G: SC20H (silica powder, manufactured by Micron Corporation)
H: 1 type of zinc oxide (Zinc oxide powder, manufactured by Sakai Chemical Industry Co., Ltd.)
I: “Irganox (registered trademark) 1010” (Antioxidant, manufactured by Ciba Specialty Chemicals)
J: PEP-36 (Antioxidant, manufactured by ADEKA Corporation)

Example 1
(A ′), (B ′), (I) and (J) were weighed so that the mass ratio would be 35: 35: 0.035: 0.035. This raw material was dry blended and charged into a top feeder of a twin screw kneading extruder TEM37BS (manufactured by Toshiba Machine Co., Ltd.), and an appropriate amount of (C ′) was charged into a side feeder. The top feeder charge was fed at a feed rate of 7.0 kg / hr, and the side feeder charge was fed at a feed rate of 3.0 kg / hr and kneaded. The kneading temperature was set to 250 ° C. for the barrel and the die. The strand of the composition coming out of the die was cooled with water and cut into pellets. The obtained composition was good with no aggregation of components or the like. As a result of analyzing the obtained composition, the mass fraction of each component with respect to the total amount of components (A ′), (B ′) and (C ′) is (A ′) 35% by mass, (B ′) Was 35% by mass, and (C ′) was 30% by mass.
The performance evaluation results of the obtained resin composition are shown in Table 1.

Comparative Example 1
In Example 1, a resin composition and a molded product were produced in the same manner as in Example 1 except that (D) was used instead of (C ′), and performance evaluation was performed. The results are shown in Table 1.

  Compared with the resin composition of Comparative Example 1, the resin composition of Example 1 had a notched Izod impact strength of about 1.5 times higher, confirming that the toughness was remarkably improved. Moreover, it was confirmed that the molded article which consists of a resin composition of Example 1 has sufficient heat conductivity, insulation, and slidability which can be practically used.

Example 2
(A ′), (B ′), (I) and (J) were weighed so that the mass ratio would be 25: 55: 0.025: 0.025. This raw material was dry blended and charged into a top feeder of a twin screw kneading extruder TEM37BS (manufactured by Toshiba Machine Co., Ltd.), and an appropriate amount of (C ′) was charged into a side feeder. The top feeder charge was fed at a feed rate of 8.0 kg / hr, and the side feeder charge was fed at a feed rate of 2.0 kg / hr and kneaded. The kneading temperature was set to 250 ° C. for the barrel and the die. The strand of the composition coming out of the die was cooled with water and cut into pellets. The obtained composition was good with no aggregation of components or the like. As a result of analyzing the obtained composition, the mass fraction of each component with respect to the total amount of components (A ′), (B ′) and (C ′) is (A ′) being 25 mass%, (B ′) Was 55% by mass and (C ′) was 20% by mass.
The performance evaluation results of the obtained resin composition are shown in Table 1.

Comparative Example 2
In Example 2, a resin composition and a molded product were produced in the same manner as in Example 2 except that (D) was used instead of (C ′), and performance evaluation was performed. The results are shown in Table 1.

  The resin composition of Example 2 had a notched Izod impact strength of about 1.5 times higher than the resin composition of Comparative Example 2, and it was confirmed that the toughness was remarkably improved. Moreover, it was confirmed that the molded article which consists of a resin composition of Example 2 has sufficient heat conductivity, insulation, and slidability which can be practically used.

Example 3
(A ′), (B ′), (I), and (J) were weighed so that the mass ratio was 20: 20: 0.02: 0.02. This raw material was dry blended and charged into a top feeder of a twin screw kneading extruder TEM37BS (manufactured by Toshiba Machine Co., Ltd.), and an appropriate amount of (C ′) was charged into a side feeder. The top feeder charge was fed at a feed rate of 4.0 kg / hr, and the side feeder charge was fed at a feed rate of 6.0 kg / hr and kneaded. The kneading temperature was set to 250 ° C. for the barrel and the die. The strand of the composition coming out of the die was cooled with water and cut into pellets. The obtained composition was good with no aggregation of components or the like. As a result of analyzing the obtained composition, the mass fraction of each component with respect to the total amount of components (A ′), (B ′) and (C ′) is (A ′) being 20 mass%, (B ′) Was 20% by mass, and (C ′) was 60% by mass.
The performance evaluation results of the obtained resin composition are shown in Table 1.

Comparative Example 3
In Example 3, a resin composition and a molded product were produced in the same manner as in Example 3 except that (D) was used instead of (C ′), and performance evaluation was performed. The results are shown in Table 1.

  The resin composition of Example 3 had a notched Izod impact strength of about 1.8 times higher than that of the resin composition of Comparative Example 3, and it was confirmed that the toughness was remarkably improved. Moreover, it was confirmed that the molded article which consists of a resin composition of Example 3 has sufficient heat conductivity which can endure practical use, insulation, and sliding property.

Example 4
(A ′), (B ′), (I) and (J) were weighed so that the mass ratio was 15: 40: 0.015: 0.015. This raw material was dry blended and charged into a top feeder of a twin screw kneading extruder TEM37BS (manufactured by Toshiba Machine Co., Ltd.), and an appropriate amount of (C ′) was charged into a side feeder. The top feeder charge was fed at a feed rate of 5.5 kg / hr, and the side feeder charge was fed at a feed rate of 4.5 kg / hr and kneaded. The kneading temperature was set to 250 ° C. for the barrel and the die. The strand of the composition coming out of the die was cooled with water and cut into pellets. The obtained composition was good with no aggregation of components or the like. As a result of analyzing the obtained composition, the mass fraction of each component with respect to the total amount of the components (A ′), (B ′) and (C ′) is as follows: (A ′) is 15 mass%, (B ′) Was 40% by mass, and (C ′) was 45% by mass.
The performance evaluation results of the obtained resin composition are shown in Table 1.

Comparative Example 4
In Example 4, a resin composition and a molded product were produced in the same manner as in Example 4 except that (D) was used instead of (C ′), and performance evaluation was performed. The results are shown in Table 1.

  The resin composition of Example 4 had a notched Izod impact strength of 1.6 times higher than that of Comparative Example 4, and it was confirmed that the toughness was remarkably improved. Moreover, it was confirmed that the molded article which consists of a resin composition of Example 4 has sufficient heat conductivity, insulation, and slidability which can be practically used.

Comparative Example 5
(A ′), (B ′), (I) and (J) were weighed so that the mass ratio was 40: 50: 0.04: 0.04. This raw material was dry blended and charged into a top feeder of a twin screw kneading extruder TEM37BS (manufactured by Toshiba Machine Co., Ltd.), and an appropriate amount of (C ′) was charged into a side feeder. The top feeder charge was fed at a feed rate of 9.0 kg / hr, and the side feeder charge was fed at a feed rate of 1.0 kg / hr and kneaded. The kneading temperature was set to 250 ° C. for the barrel and the die. The strand of the composition coming out of the die was cooled with water and cut into pellets. The obtained composition was good with no aggregation of components or the like. As a result of analyzing the obtained composition, the mass fraction of each component with respect to the total amount of components (A ′), (B ′) and (C ′) is (A ′) being 40% by mass, (B ′) Was 50% by mass, and (C ′) was 10% by mass.
The performance evaluation results of the obtained resin composition are shown in Table 1.

Comparative Example 6
In Comparative Example 5, a resin composition and a molded product were produced in the same manner as in Comparative Example 5 except that (D) was used instead of (C ′), and performance evaluation was performed. The results are shown in Table 1.

  Although the resin composition of Comparative Example 5 had a notched Izod impact strength of about 1.2 times that of the resin composition of Comparative Example 6, its toughness was insufficient.

Comparative Example 7
(A ′), (B ′), (I) and (J) were weighed so that the mass ratio was 5: 40: 0.005: 0.005. This raw material was dry blended and charged into a top feeder of a twin screw kneading extruder TEM37BS (manufactured by Toshiba Machine Co., Ltd.), and an appropriate amount of (C ′) was charged into a side feeder. The top feeder charge was fed at a feed rate of 4.5 kg / hr, and the side feeder charge was fed at a feed rate of 5.5 kg / hr and kneaded. The kneading temperature was set to 250 ° C. for the barrel and the die. However, the supply was clogged in the barrel, and a resin composition could not be obtained. For this reason, the evaluation performed in Example 1 could not be performed.
The reason why a good pellet could not be obtained may be that the amount of the component (A ′) serving as a matrix is too small.

Comparative Example 8
(E), (B ′), (I), and (J) were weighed so that the mass ratio was 35: 35: 0.035: 0.035. This raw material was dry blended and charged into a top feeder of a twin screw kneading extruder TEM37BS (manufactured by Toshiba Machine Co., Ltd.), and an appropriate amount of (C ′) was charged into a side feeder. The top feeder charge was fed at a feed rate of 7.0 kg / hr, and the side feeder charge was fed at a feed rate of 3.0 kg / hr and kneaded. The kneading temperature was set at 290 ° C. for the barrel and the die. The strand of the composition coming out of the die was cooled with water and cut into pellets. The obtained composition was good with no aggregation of components or the like. As a result of analyzing the obtained composition, the mass fraction of each component with respect to the total amount of components (E), (B ′) and (C ′) is 35 mass% for (E) and 35 for (B ′). % By mass and (C ′) were 30% by mass.
The performance evaluation results of the obtained resin composition are shown in Table 1.

  The resin composition of Comparative Example 8 had a notched Izod impact strength of about 58% that of the resin composition of Example 1, had low toughness, and had a large coefficient of friction.

Comparative Example 9
In Comparative Example 8, a resin composition and a molded product were produced in the same manner as in Comparative Example 8 except that (F) was used instead of (E), and performance evaluation was performed. The results are shown in Table 1.

  The resin composition of Comparative Example 9 had a notched Izod impact strength of about 77% of that of Example 1, the toughness was low, and the coefficient of friction was large.

Comparative Example 10
In Example 1, a resin composition and a molded product were produced in the same manner as in Example 1 except that (G) was used instead of (B ′), and performance evaluation was performed. The results are shown in Table 1.

Comparative Example 11
In Comparative Example 10, a resin composition and a molded product were produced in the same manner as in Comparative Example 10 except that (D) was used instead of (C ′), and performance evaluation was performed. The results are shown in Table 1.

  Molded articles made of the resin compositions of Comparative Examples 10 and 11 did not have heat conductivity that could withstand practical use, had a large friction coefficient, and were poor in slidability.

Comparative Example 12
In Example 1, a resin composition and a molded product were produced in the same manner as in Example 1 except that (H) was used instead of (B ′), and performance evaluation was performed. The results are shown in Table 1.

Comparative Example 13
In Comparative Example 12, a resin composition and a molded product were produced in the same manner as in Comparative Example 12 except that (D) was used instead of (C ′), and performance evaluation was performed. The results are shown in Table 1.

  Molded articles made of the resin compositions of Comparative Examples 12 and 13 did not have heat conductivity that could withstand practical use, had a large coefficient of friction, and were poor in slidability.

  The heat-transfer resin composition of the present invention is excellent in heat transfer, insulation, toughness, and slidability, and is suitably used as a material for electronic parts that require high heat dissipation.

Claims (5)

  Glass fiber 15-65 having a cross section of (A) polyamide-based resin 10-40% by mass, (B) talc 15-60% by mass and (C) flat shape with respect to the total amount of components (A)-(C). A heat transfer resin composition containing mass%.   The heat conductive resin composition according to claim 1, wherein the (A) polyamide-based resin is at least one selected from the group consisting of nylon 6, nylon 66, nylon 12, nylon MXD6, and nylon 9T.   The heat conductive resin composition according to claim 1 or 2, wherein an average flatness ratio of the glass fiber having a flat cross section (C) is 2 to 20.   The heat conductive resin molded object formed by shape | molding the resin composition of any one of Claims 1-3.   The electronic component which uses the heat conductive resin molding of Claim 4.