GB1309299A - Process for encasing electrical and electronic components - Google Patents

Process for encasing electrical and electronic components

Info

Publication number
GB1309299A
GB1309299A GB2509570A GB2509570A GB1309299A GB 1309299 A GB1309299 A GB 1309299A GB 2509570 A GB2509570 A GB 2509570A GB 2509570 A GB2509570 A GB 2509570A GB 1309299 A GB1309299 A GB 1309299A
Authority
GB
United Kingdom
Prior art keywords
organopolysiloxane
electronic components
curable
encapsulated
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2509570A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wacker Chemie AG
Original Assignee
Wacker Chemie AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Chemie AG filed Critical Wacker Chemie AG
Publication of GB1309299A publication Critical patent/GB1309299A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/12—Protection against corrosion
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Details Of Resistors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

1309299 Organopolysiloxane encapsulation WACKER-CHEMIE GmbH 26 May 1970 [23 May 1969] 25095/70 Heading B5A Electrical and/or electronic components are encapsulated by transfer- or injection-moulding using a composition based on an organopolysiloxane containing alkenyl groups and siliconbonded hydrogen having a viscosity less than 500,000 cS. at 25� C. and a platinum catalyst and which is curable to a flexible structure. The component may be a resistor, a semi-conductor, a condenser, a module or an integrated circuit and is preferably coated with primer; e.g. an ethylpolysilicate or a solution of an organopolysiloxane resin, before encapsulation. The encapsulated component may be further encased in a conventional encasing resin, e.g. epoxy or polystyrene or an organopolysiloxane. The initially applied, curable organopolysiloxane may contain a blowing agent, fillers or other conventional additives.
GB2509570A 1969-05-23 1970-05-26 Process for encasing electrical and electronic components Expired GB1309299A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691926575 DE1926575A1 (en) 1969-05-23 1969-05-23 Process for wrapping electrical and electronic components

Publications (1)

Publication Number Publication Date
GB1309299A true GB1309299A (en) 1973-03-07

Family

ID=5735099

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2509570A Expired GB1309299A (en) 1969-05-23 1970-05-26 Process for encasing electrical and electronic components

Country Status (11)

Country Link
JP (1) JPS5328471B1 (en)
AT (1) AT307044B (en)
BE (1) BE750805A (en)
CA (1) CA953869A (en)
CH (1) CH559412A5 (en)
DE (1) DE1926575A1 (en)
ES (1) ES379888A1 (en)
FR (1) FR2044817B1 (en)
GB (1) GB1309299A (en)
NO (1) NO128134B (en)
SE (1) SE368293B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2134029A (en) * 1982-11-22 1984-08-08 Olin Corp Adhesion primers for encapsulating epoxies
US4521469A (en) * 1982-11-22 1985-06-04 Olin Corporation Casing for electronic components
US4582556A (en) * 1982-11-22 1986-04-15 Olin Corporation Adhesion primers for encapsulating epoxies
US4584361A (en) * 1985-06-03 1986-04-22 Dow Corning Corporation Storage stable, one part polyorganosiloxane compositions
WO2013109338A1 (en) * 2012-01-19 2013-07-25 Raytheon Company Polysiloxane skinned fleece

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2746296C3 (en) * 1977-10-13 1980-05-22 Siemens Ag, 1000 Berlin Und 8000 Muenchen Cable set for plastic-insulated power cables
US4352119A (en) * 1979-09-17 1982-09-28 Beckman Instruments, Inc. Electrical device and method for particle entrapment device for an electrical component

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2134029A (en) * 1982-11-22 1984-08-08 Olin Corp Adhesion primers for encapsulating epoxies
US4521469A (en) * 1982-11-22 1985-06-04 Olin Corporation Casing for electronic components
US4525422A (en) * 1982-11-22 1985-06-25 Olin Corporation Adhesion primers for encapsulating epoxies
US4582556A (en) * 1982-11-22 1986-04-15 Olin Corporation Adhesion primers for encapsulating epoxies
US4584361A (en) * 1985-06-03 1986-04-22 Dow Corning Corporation Storage stable, one part polyorganosiloxane compositions
WO2013109338A1 (en) * 2012-01-19 2013-07-25 Raytheon Company Polysiloxane skinned fleece

Also Published As

Publication number Publication date
AT307044B (en) 1973-05-10
FR2044817A1 (en) 1971-02-26
FR2044817B1 (en) 1973-07-13
JPS5328471B1 (en) 1978-08-15
CH559412A5 (en) 1975-02-28
CA953869A (en) 1974-09-03
NO128134B (en) 1973-10-01
BE750805A (en) 1970-11-23
DE1926575A1 (en) 1970-11-26
SE368293B (en) 1974-06-24
ES379888A1 (en) 1972-09-16

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees