AT307044B - Process for encasing electrical and electronic components - Google Patents

Process for encasing electrical and electronic components

Info

Publication number
AT307044B
AT307044B AT460970A AT460970A AT307044B AT 307044 B AT307044 B AT 307044B AT 460970 A AT460970 A AT 460970A AT 460970 A AT460970 A AT 460970A AT 307044 B AT307044 B AT 307044B
Authority
AT
Austria
Prior art keywords
electronic components
encasing electrical
encasing
electrical
electronic
Prior art date
Application number
AT460970A
Other languages
German (de)
Original Assignee
Wacker Chemie Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Chemie Gmbh filed Critical Wacker Chemie Gmbh
Application granted granted Critical
Publication of AT307044B publication Critical patent/AT307044B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/12—Protection against corrosion
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
AT460970A 1969-05-23 1970-05-22 Process for encasing electrical and electronic components AT307044B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691926575 DE1926575A1 (en) 1969-05-23 1969-05-23 Process for wrapping electrical and electronic components

Publications (1)

Publication Number Publication Date
AT307044B true AT307044B (en) 1973-05-10

Family

ID=5735099

Family Applications (1)

Application Number Title Priority Date Filing Date
AT460970A AT307044B (en) 1969-05-23 1970-05-22 Process for encasing electrical and electronic components

Country Status (11)

Country Link
JP (1) JPS5328471B1 (en)
AT (1) AT307044B (en)
BE (1) BE750805A (en)
CA (1) CA953869A (en)
CH (1) CH559412A5 (en)
DE (1) DE1926575A1 (en)
ES (1) ES379888A1 (en)
FR (1) FR2044817B1 (en)
GB (1) GB1309299A (en)
NO (1) NO128134B (en)
SE (1) SE368293B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2746296C3 (en) * 1977-10-13 1980-05-22 Siemens Ag, 1000 Berlin Und 8000 Muenchen Cable set for plastic-insulated power cables
US4352119A (en) * 1979-09-17 1982-09-28 Beckman Instruments, Inc. Electrical device and method for particle entrapment device for an electrical component
US4521469A (en) * 1982-11-22 1985-06-04 Olin Corporation Casing for electronic components
US4525422A (en) * 1982-11-22 1985-06-25 Olin Corporation Adhesion primers for encapsulating epoxies
US4582556A (en) * 1982-11-22 1986-04-15 Olin Corporation Adhesion primers for encapsulating epoxies
US4584361A (en) * 1985-06-03 1986-04-22 Dow Corning Corporation Storage stable, one part polyorganosiloxane compositions
US20130189475A1 (en) * 2012-01-19 2013-07-25 Raytheon Company Polysiloxane skinned fleece

Also Published As

Publication number Publication date
NO128134B (en) 1973-10-01
FR2044817A1 (en) 1971-02-26
JPS5328471B1 (en) 1978-08-15
CH559412A5 (en) 1975-02-28
SE368293B (en) 1974-06-24
GB1309299A (en) 1973-03-07
ES379888A1 (en) 1972-09-16
BE750805A (en) 1970-11-23
FR2044817B1 (en) 1973-07-13
DE1926575A1 (en) 1970-11-26
CA953869A (en) 1974-09-03

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Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee