JPH11243208A - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法

Info

Publication number
JPH11243208A
JPH11243208A JP10045459A JP4545998A JPH11243208A JP H11243208 A JPH11243208 A JP H11243208A JP 10045459 A JP10045459 A JP 10045459A JP 4545998 A JP4545998 A JP 4545998A JP H11243208 A JPH11243208 A JP H11243208A
Authority
JP
Japan
Prior art keywords
semiconductor substrate
semiconductor device
electrode
semiconductor
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10045459A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11243208A5 (enExample
Inventor
Shigenobu Maeda
茂伸 前田
Tadashi Nishimura
正 西村
Kazuhito To
一仁 塘
Shigeto Maekawa
繁登 前川
Yuichi Hirano
有一 平野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP10045459A priority Critical patent/JPH11243208A/ja
Priority to TW087112003A priority patent/TW382817B/zh
Priority to US09/122,863 priority patent/US6459125B2/en
Priority to DE19842441A priority patent/DE19842441B4/de
Priority to FR9811927A priority patent/FR2775387B1/fr
Priority to KR1019980044987A priority patent/KR19990071421A/ko
Publication of JPH11243208A publication Critical patent/JPH11243208A/ja
Priority to KR10-2001-0004231A priority patent/KR100377893B1/ko
Priority to US10/122,322 priority patent/US20020110954A1/en
Publication of JPH11243208A5 publication Critical patent/JPH11243208A5/ja
Pending legal-status Critical Current

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Classifications

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Thin Film Transistor (AREA)
  • Wire Bonding (AREA)
JP10045459A 1998-02-26 1998-02-26 半導体装置及びその製造方法 Pending JPH11243208A (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP10045459A JPH11243208A (ja) 1998-02-26 1998-02-26 半導体装置及びその製造方法
TW087112003A TW382817B (en) 1998-02-26 1998-07-23 Semiconductor device and method of fabricating same
US09/122,863 US6459125B2 (en) 1998-02-26 1998-07-27 SOI based transistor inside an insulation layer with conductive bump on the insulation layer
DE19842441A DE19842441B4 (de) 1998-02-26 1998-09-16 Halbleiterbauelement und Verfahren zu seiner Herstellung
FR9811927A FR2775387B1 (fr) 1998-02-26 1998-09-24 Dispositif a semiconducteur ayant une structure soi et procede de fabrication
KR1019980044987A KR19990071421A (ko) 1998-02-26 1998-10-27 반도체 장치 및 그 제조 방법
KR10-2001-0004231A KR100377893B1 (ko) 1998-02-26 2001-01-30 반도체 장치 및 그 제조 방법
US10/122,322 US20020110954A1 (en) 1998-02-26 2002-04-16 Semiconductor device and method of fabricating same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10045459A JPH11243208A (ja) 1998-02-26 1998-02-26 半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
JPH11243208A true JPH11243208A (ja) 1999-09-07
JPH11243208A5 JPH11243208A5 (enExample) 2005-09-02

Family

ID=12719953

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10045459A Pending JPH11243208A (ja) 1998-02-26 1998-02-26 半導体装置及びその製造方法

Country Status (6)

Country Link
US (2) US6459125B2 (enExample)
JP (1) JPH11243208A (enExample)
KR (2) KR19990071421A (enExample)
DE (1) DE19842441B4 (enExample)
FR (1) FR2775387B1 (enExample)
TW (1) TW382817B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003045958A (ja) * 2001-07-27 2003-02-14 Denso Corp 半導体装置及びその製造方法
JP2017135214A (ja) * 2016-01-26 2017-08-03 株式会社東芝 半導体装置

Families Citing this family (13)

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US6459125B2 (en) 2002-10-01
US20020110954A1 (en) 2002-08-15
FR2775387B1 (fr) 2002-09-06
US20020003259A1 (en) 2002-01-10
KR19990071421A (ko) 1999-09-27
DE19842441B4 (de) 2004-07-29
KR20010072669A (ko) 2001-07-31
TW382817B (en) 2000-02-21

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