JPH1117169A5 - - Google Patents
Info
- Publication number
- JPH1117169A5 JPH1117169A5 JP1997185854A JP18585497A JPH1117169A5 JP H1117169 A5 JPH1117169 A5 JP H1117169A5 JP 1997185854 A JP1997185854 A JP 1997185854A JP 18585497 A JP18585497 A JP 18585497A JP H1117169 A5 JPH1117169 A5 JP H1117169A5
- Authority
- JP
- Japan
- Prior art keywords
- region
- impurity
- semiconductor device
- drain
- channel forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18585497A JP4104701B2 (ja) | 1997-06-26 | 1997-06-26 | 半導体装置 |
| US09/103,473 US6232642B1 (en) | 1997-06-26 | 1998-06-24 | Semiconductor device having impurity region locally at an end of channel formation region |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18585497A JP4104701B2 (ja) | 1997-06-26 | 1997-06-26 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH1117169A JPH1117169A (ja) | 1999-01-22 |
| JPH1117169A5 true JPH1117169A5 (enExample) | 2005-03-10 |
| JP4104701B2 JP4104701B2 (ja) | 2008-06-18 |
Family
ID=16178049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18585497A Expired - Fee Related JP4104701B2 (ja) | 1997-06-26 | 1997-06-26 | 半導体装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US6232642B1 (enExample) |
| JP (1) | JP4104701B2 (enExample) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6590230B1 (en) | 1996-10-15 | 2003-07-08 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| JP4017706B2 (ja) * | 1997-07-14 | 2007-12-05 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US20030165888A1 (en) * | 2001-07-18 | 2003-09-04 | Brown Bob D. | Oligonucleotide probes and primers comprising universal bases for diagnostic purposes |
| US6686623B2 (en) | 1997-11-18 | 2004-02-03 | Semiconductor Energy Laboratory Co., Ltd. | Nonvolatile memory and electronic apparatus |
| JP4236722B2 (ja) * | 1998-02-05 | 2009-03-11 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| EP1003222A1 (en) * | 1998-11-19 | 2000-05-24 | STMicroelectronics S.r.l. | Improved field-effect transistor and corresponding manufacturing method |
| JP2001068564A (ja) * | 1999-08-30 | 2001-03-16 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
| JP4686829B2 (ja) * | 1999-09-17 | 2011-05-25 | ソニー株式会社 | 半導体装置および半導体装置の製造方法 |
| JP2001203347A (ja) | 2000-01-18 | 2001-07-27 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
| US6724037B2 (en) | 2000-07-21 | 2004-04-20 | Semiconductor Energy Laboratory Co., Ltd. | Nonvolatile memory and semiconductor device |
| EP1233453A3 (en) * | 2001-02-19 | 2005-03-23 | Kawasaki Microelectronics, Inc. | Semiconductor integrated circuit having anti-fuse, method of fabricating, and method of writing data in the same |
| US6921690B2 (en) * | 2001-12-20 | 2005-07-26 | Intersil Americas Inc. | Method of fabricating enhanced EPROM structures with accentuated hot electron generation regions |
| US6566705B1 (en) | 2001-12-20 | 2003-05-20 | Intersil Americas, Inc. | Enhanced EPROM structures with accentuated hot electron generation regions |
| US6621116B2 (en) * | 2001-12-20 | 2003-09-16 | Michael David Church | Enhanced EPROM structures with accentuated hot electron generation regions |
| US6847065B1 (en) * | 2003-04-16 | 2005-01-25 | Raytheon Company | Radiation-hardened transistor fabricated by modified CMOS process |
| US7141841B2 (en) | 2003-07-03 | 2006-11-28 | Micron Technology, Inc. | Image sensor having a transistor for allowing increased dynamic range |
| US7880202B2 (en) * | 2006-11-27 | 2011-02-01 | Infineon Technologies Ag | Modulated-Vt transistor |
| JP5555864B2 (ja) * | 2009-12-22 | 2014-07-23 | 株式会社ブルックマンテクノロジ | 絶縁ゲート型半導体素子及び絶縁ゲート型半導体集積回路 |
| JP5367651B2 (ja) * | 2010-06-28 | 2013-12-11 | 日立オートモティブシステムズ株式会社 | 電流制御用半導体素子、およびそれを用いた制御装置 |
| JP5897910B2 (ja) | 2011-01-20 | 2016-04-06 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US8742481B2 (en) | 2011-08-16 | 2014-06-03 | Micron Technology, Inc. | Apparatuses and methods comprising a channel region having different minority carrier lifetimes |
| US8969867B2 (en) | 2012-01-18 | 2015-03-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| KR102097171B1 (ko) | 2012-01-20 | 2020-04-03 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| JP2016081950A (ja) * | 2014-10-10 | 2016-05-16 | ソニー株式会社 | 画素回路および撮像装置 |
| US9406771B1 (en) * | 2015-09-15 | 2016-08-02 | United Microelectronics Corp. | Semiconductor structure and manufacturing method thereof |
| CN107968123B (zh) * | 2017-11-29 | 2019-04-16 | 中国电子科技集团公司第十三研究所 | 一种增强型场效应晶体管 |
| US11031395B2 (en) * | 2018-07-13 | 2021-06-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of forming high performance MOSFETs having varying channel structures |
| US20250241004A1 (en) * | 2024-01-18 | 2025-07-24 | Psemi Corporation | Low-Leakage NEDMOS and LDMOS Devices |
Family Cites Families (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4454524A (en) | 1978-03-06 | 1984-06-12 | Ncr Corporation | Device having implantation for controlling gate parasitic action |
| US5859443A (en) | 1980-06-30 | 1999-01-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US4549336A (en) | 1981-12-28 | 1985-10-29 | Mostek Corporation | Method of making MOS read only memory by specified double implantation |
| US5350940A (en) | 1984-02-02 | 1994-09-27 | Fastran, Inc. | Enhanced mobility metal oxide semiconductor devices |
| US4697198A (en) | 1984-08-22 | 1987-09-29 | Hitachi, Ltd. | MOSFET which reduces the short-channel effect |
| DE3542482A1 (de) | 1985-11-30 | 1987-06-04 | Licentia Gmbh | Modulationsdotierter feldeffekttransistor |
| JPH01501272A (ja) | 1986-10-27 | 1989-04-27 | ヒユーズ・エアクラフト・カンパニー | ストライプ状のチャンネルのトランジスタおよびその製造方法 |
| US4999682A (en) | 1987-08-14 | 1991-03-12 | Regents Of The University Of Minnesota | Electronic and optoelectronic laser devices utilizing light hole properties |
| US4959697A (en) | 1988-07-20 | 1990-09-25 | Vtc Incorporated | Short channel junction field effect transistor |
| JP2507567B2 (ja) | 1988-11-25 | 1996-06-12 | 三菱電機株式会社 | 絶縁体基板上の半導体層に形成されたmos型電界効果トランジスタ |
| JP3194941B2 (ja) | 1990-03-19 | 2001-08-06 | 富士通株式会社 | 半導体装置 |
| US5272365A (en) | 1990-03-29 | 1993-12-21 | Kabushiki Kaisha Toshiba | Silicon transistor device with silicon-germanium electron gas hetero structure channel |
| US5210437A (en) * | 1990-04-20 | 1993-05-11 | Kabushiki Kaisha Toshiba | MOS device having a well layer for controlling threshold voltage |
| US5196367A (en) | 1991-05-08 | 1993-03-23 | Industrial Technology Research Institute | Modified field isolation process with no channel-stop implant encroachment |
| JPH0555566A (ja) * | 1991-08-28 | 1993-03-05 | Nec Corp | 半導体装置 |
| TW222345B (en) | 1992-02-25 | 1994-04-11 | Semicondustor Energy Res Co Ltd | Semiconductor and its manufacturing method |
| JP3301116B2 (ja) | 1992-07-20 | 2002-07-15 | ソニー株式会社 | 半導体装置及びその製造方法 |
| US5461250A (en) | 1992-08-10 | 1995-10-24 | International Business Machines Corporation | SiGe thin film or SOI MOSFET and method for making the same |
| JP3456242B2 (ja) * | 1993-01-07 | 2003-10-14 | セイコーエプソン株式会社 | 半導体装置及びその製造方法 |
| US5324960A (en) | 1993-01-19 | 1994-06-28 | Motorola, Inc. | Dual-transistor structure and method of formation |
| JP2848757B2 (ja) | 1993-03-19 | 1999-01-20 | シャープ株式会社 | 電界効果トランジスタおよびその製造方法 |
| KR960008735B1 (en) | 1993-04-29 | 1996-06-29 | Samsung Electronics Co Ltd | Mos transistor and the manufacturing method thereof |
| US5426325A (en) | 1993-08-04 | 1995-06-20 | Siliconix Incorporated | Metal crossover in high voltage IC with graduated doping control |
| US5792679A (en) | 1993-08-30 | 1998-08-11 | Sharp Microelectronics Technology, Inc. | Method for forming silicon-germanium/Si/silicon dioxide heterostructure using germanium implant |
| US5831294A (en) | 1993-09-30 | 1998-11-03 | Sony Corporation | Quantum box structure and carrier conductivity modulating device |
| JP3635683B2 (ja) | 1993-10-28 | 2005-04-06 | ソニー株式会社 | 電界効果トランジスタ |
| JPH07226446A (ja) * | 1994-02-12 | 1995-08-22 | Toshiba Corp | 半導体装置及びその製造方法 |
| US5516711A (en) | 1994-12-16 | 1996-05-14 | Mosel Vitelic, Inc. | Method for forming LDD CMOS with oblique implantation |
| US5478763A (en) | 1995-01-19 | 1995-12-26 | United Microelectronics Corporation | High performance field effect transistor and method of manufacture thereof |
| KR0161398B1 (ko) | 1995-03-13 | 1998-12-01 | 김광호 | 고내압 트랜지스터 및 그 제조방법 |
| US5532175A (en) | 1995-04-17 | 1996-07-02 | Motorola, Inc. | Method of adjusting a threshold voltage for a semiconductor device fabricated on a semiconductor on insulator substrate |
| US5661059A (en) | 1995-04-18 | 1997-08-26 | Advanced Micro Devices | Boron penetration to suppress short channel effect in P-channel device |
| US5619053A (en) | 1995-05-31 | 1997-04-08 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device having an SOI structure |
| US5674788A (en) | 1995-06-06 | 1997-10-07 | Advanced Micro Devices, Inc. | Method of forming high pressure silicon oxynitride gate dielectrics |
| US5670389A (en) | 1996-01-11 | 1997-09-23 | Motorola, Inc. | Semiconductor-on-insulator device having a laterally-graded channel region and method of making |
| US5698884A (en) | 1996-02-07 | 1997-12-16 | Thunderbird Technologies, Inc. | Short channel fermi-threshold field effect transistors including drain field termination region and methods of fabricating same |
| JP3522441B2 (ja) | 1996-03-12 | 2004-04-26 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US5786618A (en) | 1996-03-21 | 1998-07-28 | United Microelectronics, Corp. | ROM memory cell with non-uniform threshold voltage |
| US5702967A (en) * | 1996-07-22 | 1997-12-30 | Vanguard International Semiconductor Corporation | Method of fabricating a deep submicron MOSFET device using a recessed, narrow polysilicon gate structure |
| TW304278B (en) * | 1996-09-17 | 1997-05-01 | Nat Science Council | The source-drain distributed implantation method |
-
1997
- 1997-06-26 JP JP18585497A patent/JP4104701B2/ja not_active Expired - Fee Related
-
1998
- 1998-06-24 US US09/103,473 patent/US6232642B1/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH1117169A5 (enExample) | ||
| JP4130486B2 (ja) | パワーmosfet | |
| JPH11233789A5 (enExample) | ||
| JP3602751B2 (ja) | 高耐圧半導体装置 | |
| KR950034767A (ko) | Mis형 반도체장치 | |
| JPH1093100A5 (enExample) | ||
| KR840008537A (ko) | 반도체장치 | |
| KR970013429A (ko) | 높은 브리크다운 전압을 갖는 탄화실리콘 트랜지스터 | |
| JPH1065163A5 (enExample) | ||
| JPH1065165A5 (enExample) | ||
| JPH1140815A5 (ja) | 半導体装置 | |
| JP4014659B2 (ja) | 半導体装置 | |
| JP2961525B2 (ja) | 半導体装置及びその製造方法 | |
| JPH06104438A (ja) | 薄膜トランジスタ | |
| JPH11233785A5 (enExample) | ||
| KR102273935B1 (ko) | 음성 트랜스 컨덕턴스 기반의 터널링 트랜지스터 | |
| JP3963151B2 (ja) | 炭化珪素半導体装置 | |
| JPH10107160A5 (ja) | 半導体装置 | |
| JP5246638B2 (ja) | 半導体装置 | |
| JPH11289089A5 (enExample) | ||
| KR101709541B1 (ko) | 들려진 드레인 영역을 갖는 터널링 전계효과 트랜지스터 | |
| US5345103A (en) | Gate controlled avalanche bipolar transistor | |
| KR20180049569A (ko) | 듀얼 게이트를 갖는 무접합 터널링 전계효과 트랜지스터 | |
| JP7405230B2 (ja) | スイッチング素子 | |
| KR102583088B1 (ko) | 터널링 전계 효과 트랜지스터 |