JPH11289089A5 - - Google Patents
Info
- Publication number
- JPH11289089A5 JPH11289089A5 JP1999029969A JP2996999A JPH11289089A5 JP H11289089 A5 JPH11289089 A5 JP H11289089A5 JP 1999029969 A JP1999029969 A JP 1999029969A JP 2996999 A JP2996999 A JP 2996999A JP H11289089 A5 JPH11289089 A5 JP H11289089A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor substrate
- metal electrode
- conductivity type
- semiconductor device
- source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02996999A JP4024954B2 (ja) | 1998-02-06 | 1999-02-08 | 半導体装置及びその製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10-25712 | 1998-02-06 | ||
| JP2571298 | 1998-02-06 | ||
| JP02996999A JP4024954B2 (ja) | 1998-02-06 | 1999-02-08 | 半導体装置及びその製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007239588A Division JP2008053739A (ja) | 1998-02-06 | 2007-09-14 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH11289089A JPH11289089A (ja) | 1999-10-19 |
| JPH11289089A5 true JPH11289089A5 (enExample) | 2005-10-06 |
| JP4024954B2 JP4024954B2 (ja) | 2007-12-19 |
Family
ID=26363375
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP02996999A Expired - Fee Related JP4024954B2 (ja) | 1998-02-06 | 1999-02-08 | 半導体装置及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4024954B2 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4592649B2 (ja) * | 2000-07-11 | 2010-12-01 | 株式会社東芝 | 半導体装置の製造方法 |
| KR100975523B1 (ko) * | 2003-12-30 | 2010-08-13 | 삼성전자주식회사 | 조절된 이동도를 가지는 반도체 소자 및 이를 적용한 tft |
| JP5091403B2 (ja) * | 2005-12-15 | 2012-12-05 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
| WO2009090974A1 (ja) * | 2008-01-16 | 2009-07-23 | Nec Corporation | 半導体装置及びその製造方法 |
| US9817928B2 (en) | 2012-08-31 | 2017-11-14 | Synopsys, Inc. | Latch-up suppression and substrate noise coupling reduction through a substrate back-tie for 3D integrated circuits |
| US9190346B2 (en) | 2012-08-31 | 2015-11-17 | Synopsys, Inc. | Latch-up suppression and substrate noise coupling reduction through a substrate back-tie for 3D integrated circuits |
| US8847324B2 (en) * | 2012-12-17 | 2014-09-30 | Synopsys, Inc. | Increasing ION /IOFF ratio in FinFETs and nano-wires |
| US9379018B2 (en) | 2012-12-17 | 2016-06-28 | Synopsys, Inc. | Increasing Ion/Ioff ratio in FinFETs and nano-wires |
-
1999
- 1999-02-08 JP JP02996999A patent/JP4024954B2/ja not_active Expired - Fee Related
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