JPH09512677A - 電子デバイスのカプセル化装置 - Google Patents

電子デバイスのカプセル化装置

Info

Publication number
JPH09512677A
JPH09512677A JP7528011A JP52801195A JPH09512677A JP H09512677 A JPH09512677 A JP H09512677A JP 7528011 A JP7528011 A JP 7528011A JP 52801195 A JP52801195 A JP 52801195A JP H09512677 A JPH09512677 A JP H09512677A
Authority
JP
Japan
Prior art keywords
support
encapsulation device
encapsulation
substrate
covers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7528011A
Other languages
English (en)
Japanese (ja)
Inventor
フユールバツヒアー、ブルーノ
ルツプ、フリードリツヒ
パール、ウオルフガング
トラウシユ、ギユンター
Original Assignee
シーメンス マツシタ コンポーネンツ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング ウント コンパニ コマンデイート ゲゼルシヤフト
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シーメンス マツシタ コンポーネンツ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング ウント コンパニ コマンデイート ゲゼルシヤフト filed Critical シーメンス マツシタ コンポーネンツ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング ウント コンパニ コマンデイート ゲゼルシヤフト
Publication of JPH09512677A publication Critical patent/JPH09512677A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/08—Holders with means for regulating temperature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Casings For Electric Apparatus (AREA)
JP7528011A 1994-05-02 1995-05-02 電子デバイスのカプセル化装置 Pending JPH09512677A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE4415411 1994-05-02
DE4432566 1994-09-13
DE4415411.9 1994-09-13
DE4432566.5 1994-09-13
PCT/EP1995/001658 WO1995030276A1 (de) 1994-05-02 1995-05-02 Verkapselung für elektronische bauelemente

Publications (1)

Publication Number Publication Date
JPH09512677A true JPH09512677A (ja) 1997-12-16

Family

ID=25936202

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7528011A Pending JPH09512677A (ja) 1994-05-02 1995-05-02 電子デバイスのカプセル化装置

Country Status (9)

Country Link
US (2) US5831369A (zh)
EP (1) EP0759231B1 (zh)
JP (1) JPH09512677A (zh)
KR (1) KR100648751B1 (zh)
CN (1) CN1099158C (zh)
DE (1) DE59504639D1 (zh)
FI (2) FI952093A0 (zh)
RU (1) RU2153221C2 (zh)
WO (1) WO1995030276A1 (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007173284A (ja) * 2005-12-19 2007-07-05 Matsushita Electric Ind Co Ltd 電子部品パッケージ
JP2010135959A (ja) * 2008-12-03 2010-06-17 Panasonic Corp 弾性表面波デバイス
JP2013232992A (ja) * 2013-08-19 2013-11-14 Panasonic Corp 弾性表面波デバイス
JP2014192782A (ja) * 2013-03-28 2014-10-06 Japan Radio Co Ltd 封止部材、封止補助部材、封止方法および封止補助方法
JP2015092774A (ja) * 2015-02-05 2015-05-14 スカイワークス・パナソニック フィルターソリューションズ ジャパン株式会社 弾性表面波デバイスを製造する方法

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WO1995030276A1 (de) * 1994-05-02 1995-11-09 Siemens Matsushita Components Gmbh & Co. Kg Verkapselung für elektronische bauelemente
DE19548048C2 (de) 1995-12-21 1998-01-15 Siemens Matsushita Components Elektronisches Bauelement, insbesondere mit akustischen Oberflächenwellen arbeitendes Bauelement (OFW-Bauelement)
DE19548046C2 (de) * 1995-12-21 1998-01-15 Siemens Matsushita Components Verfahren zur Herstellung von für eine Flip-Chip-Montage geeigneten Kontakten von elektrischen Bauelementen
DE19820049C2 (de) * 1998-05-05 2001-04-12 Epcos Ag Thermomechanisches Verfahren zum Planarisieren einer fototechnisch strukturierbaren Schicht, insbesondere Verkapselung für elektronische Bauelemente
JP2000114918A (ja) * 1998-10-05 2000-04-21 Mitsubishi Electric Corp 表面弾性波装置及びその製造方法
JP4151164B2 (ja) * 1999-03-19 2008-09-17 株式会社デンソー 半導体装置の製造方法
US6287894B1 (en) 1999-10-04 2001-09-11 Andersen Laboratories, Inc. Acoustic device packaged at wafer level
DE10006446A1 (de) * 2000-02-14 2001-08-23 Epcos Ag Verkapselung für ein elektrisches Bauelement und Verfahren zur Herstellung
US6653762B2 (en) * 2000-04-19 2003-11-25 Murata Manufacturing Co., Ltd. Piezoelectric type electric acoustic converter
WO2002005424A1 (en) * 2000-07-06 2002-01-17 Kabushiki Kaisha Toshiba Surface acoustic wave device and method of manufacturing the device
JP2004514316A (ja) * 2000-11-09 2004-05-13 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 電子デバイス、電子デバイスを有する半導体デバイス、及び電子デバイスを製造する方法
JP3974346B2 (ja) * 2001-03-30 2007-09-12 富士通メディアデバイス株式会社 弾性表面波装置
US6930364B2 (en) * 2001-09-13 2005-08-16 Silicon Light Machines Corporation Microelectronic mechanical system and methods
DE10164494B9 (de) 2001-12-28 2014-08-21 Epcos Ag Verkapseltes Bauelement mit geringer Bauhöhe sowie Verfahren zur Herstellung
DE10206919A1 (de) 2002-02-19 2003-08-28 Infineon Technologies Ag Verfahren zur Erzeugung einer Abdeckung, Verfahren zum Herstellen eines gehäusten Bauelements
US6846423B1 (en) 2002-08-28 2005-01-25 Silicon Light Machines Corporation Wafer-level seal for non-silicon-based devices
US6877209B1 (en) 2002-08-28 2005-04-12 Silicon Light Machines, Inc. Method for sealing an active area of a surface acoustic wave device on a wafer
DE10253163B4 (de) 2002-11-14 2015-07-23 Epcos Ag Bauelement mit hermetischer Verkapselung und Waferscale Verfahren zur Herstellung
DE10300958A1 (de) * 2003-01-13 2004-07-22 Epcos Ag Modul mit Verkapselung
US7108344B2 (en) * 2003-11-03 2006-09-19 Hewlett-Packard Devleopment Company, L.P. Printmode for narrow margin printing
DE102004005668B4 (de) * 2004-02-05 2021-09-16 Snaptrack, Inc. Elektrisches Bauelement und Herstellungsverfahren
US7750420B2 (en) * 2004-03-26 2010-07-06 Cypress Semiconductor Corporation Integrated circuit having one or more conductive devices formed over a SAW and/or MEMS device
US7259499B2 (en) 2004-12-23 2007-08-21 Askew Andy R Piezoelectric bimorph actuator and method of manufacturing thereof
US8074622B2 (en) * 2005-01-25 2011-12-13 Borgwarner, Inc. Control and interconnection system for an apparatus
US7288847B2 (en) * 2005-01-25 2007-10-30 Medtronic, Inc. Assembly including a circuit and an encapsulation frame, and method of making the same
DE102005034011B4 (de) * 2005-07-18 2009-05-20 Infineon Technologies Ag Halbleiterbauteil für Hochfrequenzen über 10 GHz und Verfahren zur Herstellung desselben
DE102007058951B4 (de) 2007-12-07 2020-03-26 Snaptrack, Inc. MEMS Package
US8059425B2 (en) * 2008-05-28 2011-11-15 Azurewave Technologies, Inc. Integrated circuit module with temperature compensation crystal oscillator
DE102008030842A1 (de) 2008-06-30 2010-01-28 Epcos Ag Integriertes Modul mit intrinsischem Isolationsbereich und Herstellungsverfahren
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DE102008042106A1 (de) * 2008-09-15 2010-03-18 Robert Bosch Gmbh Verkapselung, MEMS sowie Verfahren zum Verkapseln
WO2012120968A1 (ja) * 2011-03-09 2012-09-13 株式会社村田製作所 電子部品
US9812350B2 (en) 2013-03-06 2017-11-07 Qorvo Us, Inc. Method of manufacture for a silicon-on-plastic semiconductor device with interfacial adhesion layer
US9583414B2 (en) 2013-10-31 2017-02-28 Qorvo Us, Inc. Silicon-on-plastic semiconductor device and method of making the same
CN104604346B (zh) * 2013-08-30 2016-04-20 新电元工业株式会社 电气设备及其制造方法、以及电气设备的设计方法
US9824951B2 (en) 2014-09-12 2017-11-21 Qorvo Us, Inc. Printed circuit module having semiconductor device with a polymer substrate and methods of manufacturing the same
US10085352B2 (en) 2014-10-01 2018-09-25 Qorvo Us, Inc. Method for manufacturing an integrated circuit package
US10431533B2 (en) 2014-10-31 2019-10-01 Ati Technologies Ulc Circuit board with constrained solder interconnect pads
US10121718B2 (en) 2014-11-03 2018-11-06 Qorvo Us, Inc. Printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer
US9960145B2 (en) 2015-03-25 2018-05-01 Qorvo Us, Inc. Flip chip module with enhanced properties
US9613831B2 (en) 2015-03-25 2017-04-04 Qorvo Us, Inc. Encapsulated dies with enhanced thermal performance
US20160343604A1 (en) 2015-05-22 2016-11-24 Rf Micro Devices, Inc. Substrate structure with embedded layer for post-processing silicon handle elimination
US10276495B2 (en) 2015-09-11 2019-04-30 Qorvo Us, Inc. Backside semiconductor die trimming
JP6350510B2 (ja) * 2015-12-24 2018-07-04 株式会社村田製作所 弾性表面波装置
US10020405B2 (en) 2016-01-19 2018-07-10 Qorvo Us, Inc. Microelectronics package with integrated sensors
US10062583B2 (en) 2016-05-09 2018-08-28 Qorvo Us, Inc. Microelectronics package with inductive element and magnetically enhanced mold compound component
US10773952B2 (en) 2016-05-20 2020-09-15 Qorvo Us, Inc. Wafer-level package with enhanced performance
US10784149B2 (en) 2016-05-20 2020-09-22 Qorvo Us, Inc. Air-cavity module with enhanced device isolation
US10103080B2 (en) 2016-06-10 2018-10-16 Qorvo Us, Inc. Thermally enhanced semiconductor package with thermal additive and process for making the same
US10079196B2 (en) 2016-07-18 2018-09-18 Qorvo Us, Inc. Thermally enhanced semiconductor package having field effect transistors with back-gate feature
WO2018031999A1 (en) 2016-08-12 2018-02-15 Qorvo Us, Inc. Wafer-level package with enhanced performance
WO2018031995A1 (en) 2016-08-12 2018-02-15 Qorvo Us, Inc. Wafer-level package with enhanced performance
US10486963B2 (en) 2016-08-12 2019-11-26 Qorvo Us, Inc. Wafer-level package with enhanced performance
US10109502B2 (en) 2016-09-12 2018-10-23 Qorvo Us, Inc. Semiconductor package with reduced parasitic coupling effects and process for making the same
US10090339B2 (en) 2016-10-21 2018-10-02 Qorvo Us, Inc. Radio frequency (RF) switch
US10749518B2 (en) 2016-11-18 2020-08-18 Qorvo Us, Inc. Stacked field-effect transistor switch
US10068831B2 (en) 2016-12-09 2018-09-04 Qorvo Us, Inc. Thermally enhanced semiconductor package and process for making the same
US10755992B2 (en) 2017-07-06 2020-08-25 Qorvo Us, Inc. Wafer-level packaging for enhanced performance
RU2658596C1 (ru) * 2017-08-07 2018-06-21 Акционерное общество "Научно-производственное предприятие "Радар ммс" Чувствительный элемент на поверхностных акустических волнах для измерения давления жидкостей и газов
US10366972B2 (en) 2017-09-05 2019-07-30 Qorvo Us, Inc. Microelectronics package with self-aligned stacked-die assembly
US10784233B2 (en) 2017-09-05 2020-09-22 Qorvo Us, Inc. Microelectronics package with self-aligned stacked-die assembly
US11152363B2 (en) 2018-03-28 2021-10-19 Qorvo Us, Inc. Bulk CMOS devices with enhanced performance and methods of forming the same utilizing bulk CMOS process
WO2019195428A1 (en) 2018-04-04 2019-10-10 Qorvo Us, Inc. Gallium-nitride-based module with enhanced electrical performance and process for making the same
US12046505B2 (en) 2018-04-20 2024-07-23 Qorvo Us, Inc. RF devices with enhanced performance and methods of forming the same utilizing localized SOI formation
US10804246B2 (en) 2018-06-11 2020-10-13 Qorvo Us, Inc. Microelectronics package with vertically stacked dies
CN112534553B (zh) 2018-07-02 2024-03-29 Qorvo美国公司 Rf半导体装置及其制造方法
US11069590B2 (en) 2018-10-10 2021-07-20 Qorvo Us, Inc. Wafer-level fan-out package with enhanced performance
US10964554B2 (en) 2018-10-10 2021-03-30 Qorvo Us, Inc. Wafer-level fan-out package with enhanced performance
US11646242B2 (en) 2018-11-29 2023-05-09 Qorvo Us, Inc. Thermally enhanced semiconductor package with at least one heat extractor and process for making the same
US12046570B2 (en) 2019-01-23 2024-07-23 Qorvo Us, Inc. RF devices with enhanced performance and methods of forming the same
WO2020153983A1 (en) 2019-01-23 2020-07-30 Qorvo Us, Inc. Rf semiconductor device and manufacturing method thereof
US12046483B2 (en) 2019-01-23 2024-07-23 Qorvo Us, Inc. RF devices with enhanced performance and methods of forming the same
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US11387157B2 (en) 2019-01-23 2022-07-12 Qorvo Us, Inc. RF devices with enhanced performance and methods of forming the same
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007173284A (ja) * 2005-12-19 2007-07-05 Matsushita Electric Ind Co Ltd 電子部品パッケージ
JP4760357B2 (ja) * 2005-12-19 2011-08-31 パナソニック株式会社 電子部品パッケージ
JP2010135959A (ja) * 2008-12-03 2010-06-17 Panasonic Corp 弾性表面波デバイス
JP2014192782A (ja) * 2013-03-28 2014-10-06 Japan Radio Co Ltd 封止部材、封止補助部材、封止方法および封止補助方法
JP2013232992A (ja) * 2013-08-19 2013-11-14 Panasonic Corp 弾性表面波デバイス
JP2015092774A (ja) * 2015-02-05 2015-05-14 スカイワークス・パナソニック フィルターソリューションズ ジャパン株式会社 弾性表面波デバイスを製造する方法

Also Published As

Publication number Publication date
FI964394A (fi) 1996-10-31
WO1995030276A1 (de) 1995-11-09
KR100648751B1 (ko) 2007-03-02
FI952093A0 (fi) 1995-05-02
EP0759231A1 (de) 1997-02-26
DE59504639D1 (de) 1999-02-04
EP0759231B1 (de) 1998-12-23
CN1147319A (zh) 1997-04-09
US5831369A (en) 1998-11-03
KR970703062A (ko) 1997-06-10
FI964394A0 (fi) 1996-10-31
CN1099158C (zh) 2003-01-15
RU2153221C2 (ru) 2000-07-20
US6446316B1 (en) 2002-09-10

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