JPH08330405A - 高温ポリイミド静電チャック - Google Patents

高温ポリイミド静電チャック

Info

Publication number
JPH08330405A
JPH08330405A JP1616496A JP1616496A JPH08330405A JP H08330405 A JPH08330405 A JP H08330405A JP 1616496 A JP1616496 A JP 1616496A JP 1616496 A JP1616496 A JP 1616496A JP H08330405 A JPH08330405 A JP H08330405A
Authority
JP
Japan
Prior art keywords
electrostatic chuck
polyimide
film
layer
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP1616496A
Other languages
English (en)
Japanese (ja)
Inventor
Aihua Chen
チェン アイファ
Vijay Parkhe
パークエ ヴィジェイ
Sergio Edelstein
エデルスタイン セルジオ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JPH08330405A publication Critical patent/JPH08330405A/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
JP1616496A 1995-01-31 1996-01-31 高温ポリイミド静電チャック Withdrawn JPH08330405A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/381258 1995-01-31
US08/381,258 US5691876A (en) 1995-01-31 1995-01-31 High temperature polyimide electrostatic chuck

Publications (1)

Publication Number Publication Date
JPH08330405A true JPH08330405A (ja) 1996-12-13

Family

ID=23504320

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1616496A Withdrawn JPH08330405A (ja) 1995-01-31 1996-01-31 高温ポリイミド静電チャック

Country Status (4)

Country Link
US (2) US5691876A (enExample)
EP (1) EP0725426A2 (enExample)
JP (1) JPH08330405A (enExample)
KR (1) KR960030365A (enExample)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001043961A (ja) * 1999-07-28 2001-02-16 Keihin Sokki Kk 半導体ウエハーにおけるヒータ装置およびその製造方法
JP2001126851A (ja) * 1999-10-26 2001-05-11 Keihin Sokki Kk 半導体ウエハーにおけるヒータ装置およびその製造方法
JP2002064134A (ja) * 2000-08-16 2002-02-28 Creative Technology:Kk 静電チャック及びその製造方法
WO2004112123A1 (ja) * 2003-06-17 2004-12-23 Creative Technology Corporation 双極型静電チャック
JP2011512034A (ja) * 2008-02-11 2011-04-14 アプライド マテリアルズ インコーポレイテッド 半導体ウエハ処理用高効率静電チャック
JP2012235095A (ja) * 2011-04-27 2012-11-29 Asml Netherlands Bv 基板ホルダ、リソグラフィ装置、デバイス製造方法、及び基板ホルダの製造方法
KR20150082271A (ko) * 2012-11-02 2015-07-15 엔테그리스, 아이엔씨. 포토패터닝-가능 연성 돌기 접촉면을 갖는 정전 척
US9520276B2 (en) 2005-06-22 2016-12-13 Tokyo Electron Limited Electrode assembly and plasma processing apparatus
US9787222B2 (en) 2014-05-29 2017-10-10 Tokyo Electron Limited Electrostatic attraction apparatus, electrostatic chuck and cooling treatment apparatus
KR20200083517A (ko) * 2017-11-24 2020-07-08 도카로 가부시키가이샤 발열부재
TWI852942B (zh) * 2018-09-14 2024-08-21 日商東京威力科創股份有限公司 基板支持體及基板處理裝置

Families Citing this family (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5729423A (en) * 1994-01-31 1998-03-17 Applied Materials, Inc. Puncture resistant electrostatic chuck
US5801915A (en) * 1994-01-31 1998-09-01 Applied Materials, Inc. Electrostatic chuck having a unidirectionally conducting coupler layer
US6278600B1 (en) * 1994-01-31 2001-08-21 Applied Materials, Inc. Electrostatic chuck with improved temperature control and puncture resistance
US5822171A (en) * 1994-02-22 1998-10-13 Applied Materials, Inc. Electrostatic chuck with improved erosion resistance
US6099939A (en) * 1995-04-13 2000-08-08 International Business Machines Corporation Enhanced adhesion between a vapor deposited metal and an organic polymer surface exhibiting tailored morphology
JPH0955420A (ja) * 1995-08-11 1997-02-25 Anelva Corp 静電吸着機構
TW406346B (en) * 1996-08-26 2000-09-21 Applied Materials Inc Method and apparatus for cooling a workpiece using an electrostatic chuck
US6184158B1 (en) * 1996-12-23 2001-02-06 Lam Research Corporation Inductively coupled plasma CVD
US6117246A (en) * 1997-01-31 2000-09-12 Applied Materials, Inc. Conductive polymer pad for supporting a workpiece upon a workpiece support surface of an electrostatic chuck
JPH10275752A (ja) * 1997-03-28 1998-10-13 Ube Ind Ltd 張合わせウエハ−及びその製造方法、基板
USD406852S (en) * 1997-11-14 1999-03-16 Applied Materials, Inc. Electrostatic chuck with improved spacing mask and workpiece detection device
US5953200A (en) * 1998-02-05 1999-09-14 Vlsi Technology, Inc. Multiple pole electrostatic chuck with self healing mechanism for wafer clamping
EP0948042A1 (de) * 1998-03-06 1999-10-06 VenTec Gesellschaft für Venturekapital und Unternehmensberatung Elektrostatische Vorrichtung zum Halten von Wafern und anderen Bauteilen
US5905626A (en) * 1998-04-12 1999-05-18 Dorsey Gage, Inc. Electrostatic chuck with ceramic pole protection
US6104596A (en) * 1998-04-21 2000-08-15 Applied Materials, Inc. Apparatus for retaining a subtrate in a semiconductor wafer processing system and a method of fabricating same
US6072685A (en) * 1998-05-22 2000-06-06 Applied Materials, Inc. Electrostatic chuck having an electrical connector with housing
US6159055A (en) * 1998-07-31 2000-12-12 Applied Materials, Inc. RF electrode contact assembly for a detachable electrostatic chuck
US6258228B1 (en) 1999-01-08 2001-07-10 Tokyo Electron Limited Wafer holder and clamping ring therefor for use in a deposition chamber
USD420023S (en) * 1999-01-09 2000-02-01 Applied Materials, Inc. Electrostatic chuck with improved spacing mask and workpiece detection device
US6094334A (en) * 1999-03-02 2000-07-25 Applied Materials, Inc. Polymer chuck with heater and method of manufacture
US6268994B1 (en) 1999-07-09 2001-07-31 Dorsey Gage, Inc. Electrostatic chuck and method of manufacture
US6490144B1 (en) * 1999-11-29 2002-12-03 Applied Materials, Inc. Support for supporting a substrate in a process chamber
US6377437B1 (en) 1999-12-22 2002-04-23 Lam Research Corporation High temperature electrostatic chuck
KR20010066139A (ko) * 1999-12-31 2001-07-11 황인길 척을 가지고 있는 반도체 제조 장치
TW507312B (en) * 2000-02-04 2002-10-21 Philips Electron Optics Bv Particle-optical apparatus, and object carrier therefor
KR100796749B1 (ko) 2001-05-16 2008-01-22 삼성전자주식회사 액정 표시 장치용 박막 트랜지스터 어레이 기판
US6669783B2 (en) 2001-06-28 2003-12-30 Lam Research Corporation High temperature electrostatic chuck
US7334443B2 (en) 2002-02-22 2008-02-26 Master Lock Company Llc Radio frequency electronic lock
US6660665B2 (en) * 2002-05-01 2003-12-09 Japan Fine Ceramics Center Platen for electrostatic wafer clamping apparatus
DE10332325A1 (de) * 2003-07-16 2005-02-03 Schaltbau Gmbh Druckkontakt-Steckverbinder
DE10332298B4 (de) * 2003-07-16 2018-09-27 Schaltbau Gmbh Wasserdichter Druckkontakt-Steckverbinder, Kontaktelement für einen wasserdichten Druckkontakt-Steckverbinder und Verfahren zur Herstellung eines Kontaktelements
TWI377224B (en) * 2004-07-27 2012-11-21 Kaneka Corp Polyimide film having high adhesiveness and production method therefor
KR20100017883A (ko) * 2004-09-24 2010-02-16 가부시키가이샤 가네카 높은 접착성을 갖는 폴리이미드 필름의 제조 방법
WO2006077780A1 (ja) * 2005-01-18 2006-07-27 Kaneka Corporation 接着性の改良された新規なポリイミドフィルム
KR101045149B1 (ko) 2005-08-04 2011-06-30 가부시키가이샤 가네카 금속 피복 폴리이미드 필름
US20070034957A1 (en) * 2005-08-12 2007-02-15 Wagner Richard J Electrostatic foot for non-permanent attachment
DE102006055618B4 (de) * 2006-11-24 2011-05-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Mobiler elektrostatischer Trägerwafer mit elektrisch isoliertem Ladungsspeicher, Anordnung zur Halterung und Verfahren zum Halten und Lösen eines scheibenförmigen Bauteils
US9147588B2 (en) * 2007-03-09 2015-09-29 Tel Nexx, Inc. Substrate processing pallet with cooling
US7989022B2 (en) * 2007-07-20 2011-08-02 Micron Technology, Inc. Methods of processing substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto
TWI475594B (zh) 2008-05-19 2015-03-01 Entegris Inc 靜電夾頭
US20090325340A1 (en) * 2008-06-30 2009-12-31 Mohd Aslami Plasma vapor deposition system and method for making multi-junction silicon thin film solar cell modules and panels
US8064185B2 (en) * 2008-09-05 2011-11-22 Applied Materials, Inc. Electrostatic chuck electrical balancing circuit repair
SG176059A1 (en) 2009-05-15 2011-12-29 Entegris Inc Electrostatic chuck with polymer protrusions
US8861170B2 (en) 2009-05-15 2014-10-14 Entegris, Inc. Electrostatic chuck with photo-patternable soft protrusion contact surface
WO2011149918A2 (en) 2010-05-28 2011-12-01 Entegris, Inc. High surface resistivity electrostatic chuck
US20120154974A1 (en) * 2010-12-16 2012-06-21 Applied Materials, Inc. High efficiency electrostatic chuck assembly for semiconductor wafer processing
US9543184B2 (en) * 2012-01-26 2017-01-10 Kyocera Corporation Electrostatic chuck
US9281226B2 (en) * 2012-04-26 2016-03-08 Applied Materials, Inc. Electrostatic chuck having reduced power loss
KR101784227B1 (ko) 2013-03-15 2017-10-11 어플라이드 머티어리얼스, 인코포레이티드 정전 척의 수리 및 복원을 위한 방법 및 장치
US9868272B2 (en) * 2014-09-30 2018-01-16 Illinois Tool Works Inc. Card assembly and method of manufacturing the same
WO2016135565A1 (en) 2015-02-23 2016-09-01 M Cubed Technologies, Inc. Film electrode for electrostatic chuck
DE102015210736B3 (de) * 2015-06-11 2016-10-27 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung mit folie zum elektrostatischen koppeln eines substrats mit einem substratträger
JP6226092B2 (ja) * 2016-03-14 2017-11-08 Toto株式会社 静電チャック
JP6784527B2 (ja) * 2016-07-12 2020-11-11 株式会社ディスコ 静電チャックテーブル、レーザー加工装置及び被加工物の加工方法
JP6238097B1 (ja) * 2016-07-20 2017-11-29 Toto株式会社 静電チャック
US11887878B2 (en) * 2019-06-28 2024-01-30 Applied Materials, Inc. Detachable biasable electrostatic chuck for high temperature applications
US20210035767A1 (en) * 2019-07-29 2021-02-04 Applied Materials, Inc. Methods for repairing a recess of a chamber component
US11587817B2 (en) 2020-10-21 2023-02-21 Applied Materials, Inc. High temperature bipolar electrostatic chuck
JP7725614B2 (ja) * 2021-05-14 2025-08-19 アプライド マテリアルズ インコーポレイテッド 高速排熱能力を備えた高温サセプタ
US12014906B2 (en) 2021-11-19 2024-06-18 Applied Materials, Inc. High temperature detachable very high frequency (VHF) electrostatic chuck (ESC) for PVD chamber
US12101920B2 (en) 2022-04-14 2024-09-24 Entegris, Inc. Conductive polymeric layers for charge dissipation
JP2024002793A (ja) * 2022-06-24 2024-01-11 新光電気工業株式会社 基板固定装置
US20250128477A1 (en) * 2023-10-18 2025-04-24 The Boeing Company Electrostatic tacking membrane assembly

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4252394A (en) * 1979-05-16 1981-02-24 Tecumseh Products Company Hermetic compressor motor terminal
JPS6060060A (ja) * 1983-09-12 1985-04-06 株式会社日立製作所 鉄道車両の扉開閉装置
JPS60157232A (ja) * 1984-01-27 1985-08-17 Toshiba Corp 静電チヤツク装置
JPS6131636U (ja) * 1984-07-31 1986-02-26 株式会社 徳田製作所 静電チヤツク
US4733632A (en) * 1985-09-25 1988-03-29 Tokyo Electron Limited Wafer feeding apparatus
GB2181057B (en) * 1985-10-23 1989-09-27 Blagoveshchensk G Med Inst Prosthetic valve holder
JPH0697676B2 (ja) * 1985-11-26 1994-11-30 忠弘 大見 ウエハサセプタ装置
JPS6372877A (ja) * 1986-09-12 1988-04-02 Tokuda Seisakusho Ltd 真空処理装置
JPH0834205B2 (ja) * 1986-11-21 1996-03-29 株式会社東芝 ドライエツチング装置
US4724510A (en) * 1986-12-12 1988-02-09 Tegal Corporation Electrostatic wafer clamp
JPH0643629B2 (ja) * 1987-01-22 1994-06-08 日本真空技術株式会社 静電チャック部品の製造方法
US4846929A (en) * 1988-07-13 1989-07-11 Ibm Corporation Wet etching of thermally or chemically cured polyimide
US5255153A (en) * 1990-07-20 1993-10-19 Tokyo Electron Limited Electrostatic chuck and plasma apparatus equipped therewith
JPH0478133A (ja) * 1990-07-20 1992-03-12 Tokyo Electron Ltd プラズマ処理装置
US5221403A (en) * 1990-07-20 1993-06-22 Tokyo Electron Limited Support table for plate-like body and processing apparatus using the table
JP3238925B2 (ja) * 1990-11-17 2001-12-17 株式会社東芝 静電チャック
EP0493089B1 (en) * 1990-12-25 1998-09-16 Ngk Insulators, Ltd. Wafer heating apparatus and method for producing the same
KR100188455B1 (ko) * 1991-05-20 1999-06-01 이노우에 아키라 드라이 에칭방법
US5275683A (en) * 1991-10-24 1994-01-04 Tokyo Electron Limited Mount for supporting substrates and plasma processing apparatus using the same
JPH05166757A (ja) * 1991-12-13 1993-07-02 Tokyo Electron Ltd 被処理体の温調装置
US5310453A (en) * 1992-02-13 1994-05-10 Tokyo Electron Yamanashi Limited Plasma process method using an electrostatic chuck
US5348497A (en) * 1992-08-14 1994-09-20 Applied Materials, Inc. High voltage vaccum feed-through electrical connector
JP3306677B2 (ja) * 1993-05-12 2002-07-24 東京エレクトロン株式会社 自己バイアス測定方法及び装置並びに静電吸着装置
US5486975A (en) * 1994-01-31 1996-01-23 Applied Materials, Inc. Corrosion resistant electrostatic chuck
US5515167A (en) * 1994-09-13 1996-05-07 Hughes Aircraft Company Transparent optical chuck incorporating optical monitoring
US5528451A (en) * 1994-11-02 1996-06-18 Applied Materials, Inc Erosion resistant electrostatic chuck

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001043961A (ja) * 1999-07-28 2001-02-16 Keihin Sokki Kk 半導体ウエハーにおけるヒータ装置およびその製造方法
JP2001126851A (ja) * 1999-10-26 2001-05-11 Keihin Sokki Kk 半導体ウエハーにおけるヒータ装置およびその製造方法
JP2002064134A (ja) * 2000-08-16 2002-02-28 Creative Technology:Kk 静電チャック及びその製造方法
WO2004112123A1 (ja) * 2003-06-17 2004-12-23 Creative Technology Corporation 双極型静電チャック
JPWO2004112123A1 (ja) * 2003-06-17 2006-09-28 株式会社クリエイティブ テクノロジー 双極型静電チャック
CN100365795C (zh) * 2003-06-17 2008-01-30 创意科技股份有限公司 双极型静电卡盘
US7567421B2 (en) 2003-06-17 2009-07-28 Creative Technology Corporation Bipolar electrostatic chuck
JP4532410B2 (ja) * 2003-06-17 2010-08-25 株式会社クリエイティブ テクノロジー 双極型静電チャック
US9520276B2 (en) 2005-06-22 2016-12-13 Tokyo Electron Limited Electrode assembly and plasma processing apparatus
JP2011512034A (ja) * 2008-02-11 2011-04-14 アプライド マテリアルズ インコーポレイテッド 半導体ウエハ処理用高効率静電チャック
US9354528B2 (en) 2011-04-27 2016-05-31 Asml Netherlands B.V. Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder
JP2012235095A (ja) * 2011-04-27 2012-11-29 Asml Netherlands Bv 基板ホルダ、リソグラフィ装置、デバイス製造方法、及び基板ホルダの製造方法
KR20150082271A (ko) * 2012-11-02 2015-07-15 엔테그리스, 아이엔씨. 포토패터닝-가능 연성 돌기 접촉면을 갖는 정전 척
JP2015536568A (ja) * 2012-11-02 2015-12-21 インテグリス・インコーポレーテッド 光パターン化可能な軟質突出部接触面を有する静電チャック
US9787222B2 (en) 2014-05-29 2017-10-10 Tokyo Electron Limited Electrostatic attraction apparatus, electrostatic chuck and cooling treatment apparatus
KR20200083517A (ko) * 2017-11-24 2020-07-08 도카로 가부시키가이샤 발열부재
TWI852942B (zh) * 2018-09-14 2024-08-21 日商東京威力科創股份有限公司 基板支持體及基板處理裝置
US12165896B2 (en) 2018-09-14 2024-12-10 Tokyo Electron Limited Substrate support and substrate processing apparatus

Also Published As

Publication number Publication date
EP0725426A3 (enExample) 1996-08-28
KR960030365A (ko) 1996-08-17
EP0725426A2 (en) 1996-08-07
US5908334A (en) 1999-06-01
US5691876A (en) 1997-11-25

Similar Documents

Publication Publication Date Title
JPH08330405A (ja) 高温ポリイミド静電チャック
US5745331A (en) Electrostatic chuck with conformal insulator film
KR100691098B1 (ko) 정전 척 및 그 제조방법
KR100572975B1 (ko) 정전 척 장치
TW399281B (en) Electrostatic chuck having a unidirectionally conducting coupler layer
TWI836092B (zh) 基板固定裝置及其製造方法
KR100290264B1 (ko) 정전처크장치 및 그 제조방법
JPH06216224A (ja) 静電チャック及びその作製方法並びに基板処理装置及び基板搬送装置
CN108604569B (zh) 静电卡盘装置
JP3484107B2 (ja) 静電チャック装置
JP3978011B2 (ja) ウエハ載置ステージ
JP2836986B2 (ja) 静電チャック及びその製造方法
JP3789586B2 (ja) 静電チャック
JPH10116887A (ja) ワークピースの冷却装置及び方法
JPH09260473A (ja) 静電チャック
JP2984164B2 (ja) 半導体製造用サセプター
JPH10209257A (ja) 静電チャック装置およびその製造方法
JPH10209256A (ja) 静電チャック装置およびその製造方法
JP2008537461A (ja) フレキシブル膜上に導体を備える圧電ダイヤフラムアセンブリ
KR20220092383A (ko) 정전 척, 그 제조 방법, 및 기판 고정 장치
JPH10173317A (ja) 転写方法および圧着装置
TWI900715B (zh) 靜電夾盤、其製造方法及基板固定裝置
CN120423490A (zh) 数字微流控芯片的制备方法
JP4182630B2 (ja) ダイヤフラム構造体、微小トランスジューサ、およびこれらの製造方法
JPH04304942A (ja) 静電チャック基板および静電チャック

Legal Events

Date Code Title Description
A300 Application deemed to be withdrawn because no request for examination was validly filed

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20030401