WO2004112123A1 - 双極型静電チャック - Google Patents
双極型静電チャック Download PDFInfo
- Publication number
- WO2004112123A1 WO2004112123A1 PCT/JP2004/008679 JP2004008679W WO2004112123A1 WO 2004112123 A1 WO2004112123 A1 WO 2004112123A1 JP 2004008679 W JP2004008679 W JP 2004008679W WO 2004112123 A1 WO2004112123 A1 WO 2004112123A1
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- WO
- WIPO (PCT)
- Prior art keywords
- electrode member
- electrostatic chuck
- mounting surface
- chuck
- annular
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
Definitions
- the present invention relates to a bipolar electrostatic chuck used in a semiconductor manufacturing apparatus, a liquid crystal manufacturing apparatus, and the like.
- the present invention relates to a bipolar electrostatic chuck in which a chuck main body and an electrode member constituting an electrostatic chuck can be easily separated and reused after use. Background technology
- the dry process has rapidly progressed, and semiconductor manufacturing such as plasma etching equipment, plasma CVD equipment, ion implantation equipment, associating equipment, electron beam lithography equipment, and X-ray lithography equipment have been performed.
- An apparatus is used, and in such an apparatus, a sample such as a semiconductor wafer is often processed in a vacuum.
- a mechanical chuck by a mechanical method as a means for holding the sample, a mechanical chuck by a mechanical method, a vacuum chuck using a pressure difference from the atmospheric pressure, an electrostatic chuck using an electrostatic attraction force, and the like are used.
- the electrostatic chuck is advantageous in keeping the sample and the holder thermally uniform and highly reliable in a vacuum.
- a bipolar electrostatic chuck is used as one of such electrostatic chucks.
- the bipolar electrostatic chuck includes, for example, a first electrode which is a larger portion and serves as a base, and a second electrode which is disposed on the upper surface of the first electrode and has a central opening and has an annular shape. And two electrodes.
- a DC power source is connected between the first electrode and the second electrode, and a sample such as a semiconductor wafer is placed on a sample adsorption surface formed by the upper surface of the first electrode and the upper surface of the second electrode. Then, between the bottom surface of the sample and the sample adsorption surface, The sample is attracted and held by the generated electrostatic attraction.
- a first electrode serving as a base has an electrode recess formed by machining on an upper surface thereof, and a second electrode having an annular shape is provided with an electrode recess. It is held in the electrode recess (for example, Patent No. 261011, Patent No. 261011, Patent No. 2614, 21 and See Japanese Patent Publication No. 26144442).
- a small gap is formed between the second electrode provided in the electrode recess and the first electrode, and the gap is set to be small. Accurate manufacturing is important in reliably holding samples such as wafers by electrostatic attraction.
- a roundness having a predetermined radius of curvature is provided to the corner of the bottom of the recess (for example, see Patent No. 2,610,112 and Patent No. 2,610,113).
- an electrode member provided in a concave groove provided near the center of a main member serving as a base an electrode member formed outside the concave groove near the center of the main member.
- a DC power supply is connected to an outer electrode member provided in a concave groove (for example, see US Pat. No. 5,213,439).
- the bipolar electrostatic chuck of the type in which the electrode recess is formed on the upper surface of the first electrode and the second electrode is held in the electrode recess as described above a slight gap between the electrodes is provided. Forming and rounding the corners of the electrode recesses require complex machining that requires processing accuracy.
- a groove is formed near the center of the main member serving as the base and outside thereof, and a DC power supply is connected to two electrode members provided in these grooves to form a bipolar type.
- highly precise and complicated machining is required for forming the above-mentioned concave groove and assembling the main member and the electrode member.
- Electrostatic chucks are intended to protect against plasma irradiation when used in plasma etching equipment, etc., or to function as a dielectric film. Therefore, an oxide film is often formed on the surface.
- the above-mentioned oxide film is affected by corrosion or reduction due to electrochemical action of ions, electrons and radicals contained in the plasma.
- a tool or the like may erroneously damage an oxide film on a sample adsorption surface or the like by a tool or the like.
- Deterioration or scratching of the oxide film of the electrostatic chuck causes a decrease in electrical insulation and an increase in leakage current between the bipolar electrodes, or a decrease in adsorption force to a sample such as a wafer. Cause. Therefore, even if the surface of the electrostatic chuck that has deteriorated as a result of its use is completely healthy except for the oxide film on the surface, it will be discarded as it is, or if it is reused without being discarded, it will be deteriorated or damaged. It is necessary to regenerate the oxide film that has been lost.
- the adhesive layer fixing the circular electrode inside the concave or concave groove must be disassembled.
- it is difficult to disassemble the bipolar electrostatic chuck once assembled for example, it is necessary to perform a heat treatment or remove the annular electrode by mechanical means.
- the separated first electrode and main member, etc. Due to the complicated shape of the surface on which the poles and electrode members are attached, the polishing and regenerating of the oxide film required for reuse are complicated and diversified, and are used again as electrostatic chucks. Requires a large number of processing steps, resulting in high regeneration costs.
- the regenerated oxide film may have insufficient film strength at the interface of the regenerated electrode, resulting in poor durability.
- the electrodes etc. that have undergone the various processes required for regeneration will have a greater amount of dimensional reduction than those before regeneration, and will be assembled again as an electrostatic chuck.
- the number of times that the reproduction process can be performed is very limited even if it is reused, and it is often difficult to reuse the used electrostatic chuck. Disclosure of the invention
- the present inventors can easily manufacture the electrostatic chuck compared with the conventional bipolar electrostatic chuck, and can easily separate and assemble the electrostatic chuck after use.
- a sample adsorption surface that adsorbs the sample is formed by the electrode members attached to the attachment surface of the chuck body via an adhesive layer, and after use, Has completed the present invention which solves the above-mentioned problems by enabling each electrode member to be easily separated from the mounting surface.
- an object of the present invention is to make it easier to manufacture than a conventional bipolar electrostatic chuck, and to easily separate the chuck body and the electrode member constituting the electrostatic chuck after use.
- An object of the present invention is to provide a bipolar electrostatic chuck capable of performing efficient reuse.
- the present invention provides a chuck body having a mounting surface, an annular electrode member formed in a ring shape having a central opening, and being fixed to a mounting surface of the chuck body via a bonding layer.
- the electrode member is disposed within the central opening of the electrode member at a predetermined distance from the annular electrode member.
- An inner electrode member fixed to the outer surface of the annular electrode member at a predetermined distance from the annular electrode member, and an outer electrode fixed to the mounting surface via the adhesive layer.
- a bipolar electrode wherein the inner electrode member and the outer electrode member form a first electrode, and the annular electrode member forms a second electrode.
- the present invention also provides a chuck body having a mounting surface, a ring-shaped electrode member having a central opening and formed in a ring shape, and being fixed to a mounting surface of the chuck body with an adhesive layer interposed therebetween.
- An inner electrode member disposed in the center opening of the member at a predetermined distance from the annular electrode member and fixed to the mounting surface via a bonding layer; and a predetermined outer ring member outside the annular electrode member.
- an outer electrode member fixed to the mounting surface via an adhesive layer.
- the chuck body, the inner electrode member, and the outer electrode member constitute a first electrode, A bipolar electrostatic chuck, wherein the annular electrode member constitutes a second electrode.
- the chuck body only needs to have a mounting surface on which the annular electrode member, the inner electrode member, and the outer electrode member can be mounted.
- the shape of the chuck body is a general bipolar electrostatic chuck.
- a flange or the like may be provided on the outer peripheral surface of the chuck main body so that the chuck main body can be attached to and detached from a semiconductor manufacturing apparatus or the like.
- the annular electrode member fixed to the mounting surface of the chuck body via an adhesive layer may be a member formed in an annular shape having a central opening. It can be formed according to the size and shape of the sample. That is, since this annular electrode member constitutes the second electrode in the bipolar electrostatic chuck of the present invention, its shape, area, and the like are set so that the electrostatic attraction force to the sample can be optimally exhibited. It can be designed and formed. For example, if the sample to be adsorbed is a circular sample such as a semiconductor wafer, this ring
- the shape of the polar member is preferably an annular electrode member in which both the outer peripheral shape and the center opening shape are circular.
- the outer peripheral shape is It is preferable to use a rectangular ring-shaped electrode member having a square shape and a central opening shape.
- the inner electrode member fixed to the attachment surface of the chuck body via an adhesive layer is disposed within the central opening of the annular electrode member at a predetermined distance from the annular electrode member. Any material can be used, and it can be formed according to the size and shape of the sample to be absorbed. That is, in the bipolar electrostatic chuck according to the present invention, the inner electrode member constitutes the first electrode together with the outer electrode member or the outer electrode member and the chuck main body.
- the sample to be adsorbed is a circular sample such as a semiconductor wafer
- a circular shape having an outer diameter slightly smaller than the center opening diameter in correspondence with the shape of the center opening of the annular electrode member as described above.
- the shape of the center opening of the annular electrode member is set to be smaller than the shape of the center opening. It is preferable to use a slightly smaller square inner electrode member.
- the outer electrode member fixed to the attachment surface of the chuck body via an adhesive layer is provided outside the annular electrode member at a predetermined distance from the annular electrode member. It can be formed according to the size and shape of the sample to be adsorbed. That is, in the bipolar electrostatic chuck of the present invention, the outer electrode member constitutes the first electrode together with the inner electrode member or the inner electrode member and the chuck main body. It can be designed and formed in a shape, area, etc. that can optimally exhibit the electro-adsorption force.
- the sample to be adsorbed is a circular sample such as a semiconductor wafer or the like, a circle having a central opening slightly larger than the outer diameter of the annular electrode member corresponding to the outer shape of the annular electrode member described above.
- a circle having a central opening slightly larger than the outer diameter of the annular electrode member corresponding to the outer shape of the annular electrode member described above.
- the sample is a square sample such as a square liquid crystal glass substrate, it is slightly larger than the annular electrode member corresponding to the outer peripheral shape of the annular electrode member. It is preferable to use a rectangular annular outer electrode member having a rectangular central opening.
- An oxide film is formed on each surface of the annular electrode member, the inner electrode member, and the outer electrode member, and an oxide film is formed on at least the mounting surface and the outer peripheral surface of the chuck body. Then, when the annular electrode member, the inner electrode member, and the outer electrode member are fixed to the mounting surface of the chuck body via an adhesive layer, the upper surfaces of the annular electrode member, the inner electrode member, and the outer electrode member (the chuck body).
- a sample adsorption surface for adsorbing a sample such as a semiconductor wafer or the like is formed on the surface opposite to the mounting surface side.
- the predetermined interval formed between the annular electrode member and the inner electrode member and the predetermined interval formed between the annular electrode member and the outer electrode member are determined based on the optimum static distance for the sample. It can be appropriately designed so as to exhibit the electroadsorption force.
- the gap at a predetermined interval formed between these electrode members is such that a part of the adhesive layer left when the electrode members are fixed to the mounting surface enters even though the space is formed. It is good.
- the mounting surface of the chuck body according to the present invention includes an outer convex portion for positioning the outer electrode member in the height direction with respect to the mounting surface and / or a height position of the inner electrode member with respect to the mounting surface. It is preferable to provide an inner convex portion for determining, and more preferably, to provide both the outer convex portion and the inner convex portion.
- the outer convex portion is provided at a position corresponding to the bottom surface (the surface opposite to the surface forming the sample adsorption surface) of the outer electrode member fixed to the mounting surface of the chuck body via an adhesive layer. When fixing the member to the mounting surface, it becomes the standard for mounting in the height direction with respect to the mounting surface.
- the inner convex portion is provided at a position corresponding to the bottom surface (the surface opposite to the surface forming the sample adsorption surface) of the inner electrode member fixed to the mounting surface of the chuck body via an adhesive layer.
- the electrode member When attaching the electrode member to the mounting surface, it becomes the mounting reference in the height direction to the mounting surface ⁇ PC Lan Listen 08679
- the shape of the outer convex portion and the inner convex portion there is no particular limitation on the shape of the outer convex portion and the inner convex portion.
- the convex portion provided on the ridge may be used. There may be.
- the adhesive layer is provided in a space partitioned by the outer convex portion and / or the inner convex portion on this mounting surface.
- the outer convex portion is provided with a ridge convex portion provided at a position corresponding to the outer peripheral edge of the outer electrode member on the mounting surface, so that the outer electrode member is mounted on the mounting surface of the check body.
- the adhesive layer since the adhesive layer is no longer exposed between the main body of the chuck and the outer electrode member, when the electrostatic chuck is used in a plasma etching apparatus or the like, the adhesive layer may be directly exposed to plasma. Absent.
- the inner convex portion is a ridge convex portion provided at a position corresponding to a peripheral edge which is an outer periphery of the inner electrode member on the mounting surface, and a ridge convex portion provided at a position corresponding to the outer electrode member.
- the height of the ridge protrusion corresponding to the outer electrode member and the height of the ridge protrusion corresponding to the inner electrode member can be aligned with high accuracy.
- the height position of the upper surface of the outer electrode member and the height position of the upper surface of the inner electrode member are accurately matched with respect to the mounting reference.
- a positioning pin is provided.
- the shape of the pin is not limited as long as each electrode member is positioned horizontally with respect to the mounting surface of the chuck body. For example, if one end of the pin is A positioning pin that engages with the mounting surface of the main body and has the other end engaged with the electrode member may be used.
- the positioning pins provided between the chuck body and the annular electrode member it is preferable to provide two or more pins so that they are arranged at equal angles on the same circumference on the mounting surface.
- the positioning pins provided between the inner body and the inner electrode member it is preferable that two or more pins are provided on the same circumference on the mounting surface so as to be arranged at an equal angle to each other.
- the positioning pins provided between the outer electrode member and the outer electrode member it is preferable that two or more pins are provided so as to be arranged at equal angles on the same circumference on the mounting surface. Provision of the pins as described above is advantageous in that horizontal positioning of the inner electrode member, the annular electrode member, and the outer electrode member fixed to the mounting surface of the chuck body can be easily performed. .
- the first electrode when the first electrode is formed from the chuck body, the inner electrode member, and the outer electrode member, the first electrode is provided between the chuck body and the inner electrode member.
- at least one of the positioning pins also serves as a conduction pin that enables electrical connection between the chuck body and the inner electrode member.
- the positioning pin is provided between the chuck body and the outer electrode member. It is preferable that at least one of the positioning pins also serves as a conduction pin that enables electrical conduction between the chuck body and the outer electrode member.
- at least one of the positioning pins provided between the chuck body and the inner electrode member and at least one of the positioning pins provided between the chuck body and the outer electrode member are provided.
- the first electrode composed of the chuck body, the inner electrode member, and the outer electrode member can be configured by also serving as the conduction pin.
- All of the positioning pins provided therebetween need to be formed of a material that can keep the annular electrode member and the chuck body electrically insulated.
- the first electrode when the first electrode is composed of the inner electrode member and the outer electrode member, the first electrode is formed between the chuck body and the inner electrode member, and the chuck body and the annular electrode are formed.
- the member and each positioning pin provided between the chuck body and the outer electrode member are formed of a material that can keep these electrode members electrically insulated from the chuck body. There is a need.
- the inner electrode member, the annular electrode member, and the outer electrode member fixed to the attachment surface of the chuck body via an adhesive layer is provided on the attachment surface of the chuck body.
- the inner electrode member, the annular electrode member, and the outer electrode member are preferably fixed in a complementary shape to the mounting surface of the chuck body. Is good. For example, when an annular electrode member is described as an example, a part of a vertical cross section of the annular electrode member is formed such that two surfaces intersect at a bottom portion (a portion opposite to the sample adsorption surface) of the annular electrode member.
- a tapered groove corresponding to the shape of the bottom portion of the annular electrode member may be formed on the attachment surface of the chuck body to which the annular electrode member is fixed.
- the bottom surface portion of the annular electrode member fixed to the mounting surface of the chuck body via the adhesive layer is mounted in a shape complementary to the mounting surface of the chuck body, thereby forming an annular shape.
- the annular electrode member can perform horizontal positioning of the annular electrode member with respect to the mounting surface instead of using the above-described positioning pin.
- the inner electrode member and the outer electrode member and by having complementary shapes in relation to the corresponding mounting surfaces, it is possible to position each electrode member in the horizontal direction with respect to the mounting surface. it can.
- a positioning for positioning the annular electrode member in the height direction with respect to the mounting surface is provided between the chuck body and the annular electrode member.
- a spacer may be interposed.
- the positioning spacer must be electrically insulating so that the annular electrode member and the chuck body can be kept electrically insulated from each other.
- the upper surface of the annular electrode member fixed to the mounting surface by interposition should be flush with the upper surface of the inner electrode member and the outer electrode member similarly fixed to the mounting surface via an adhesive layer. is there.
- the adhesive layer for fixing the inner electrode member, the annular electrode member, and the outer electrode member to the mounting surface of the chuck body is preferably a silicone-based adhesive or a polyvinyl butyral-based adhesive.
- the adhesive layer is preferably made of one or two selected from agents, more preferably an adhesive layer made of a silicone-based adhesive.
- each electrode member of the present invention when each electrode member of the present invention is fixed to the mounting surface of the chuck body to form an electrostatic chuck, the electrostatic chuck is disassembled.
- such heating may cause annealing of a material (for example, aluminum material or the like) constituting the electrostatic chuck, and may decrease mechanical strength as the material.
- the electrostatic chuck of the present invention is configured using a silicone-based adhesive as an adhesive layer
- the release agent made of toluene, xylene, or the like can be used without using heat treatment or mechanical means.
- Each electrode member fixed to the mounting surface can be easily separated, without reducing the mechanical strength of the material that forms the electrostatic chuck after separation, and because no mechanical treatment is required.
- the electrostatic chuck can be separated without damaging it.
- the silicone-based adhesive it is preferable to use a gel-based adhesive or an elastomer-based adhesive, and more preferably an elastomer-based adhesive from the viewpoint of more excellent plasma resistance.
- TJP2004 / 008679 a gel-based adhesive or an elastomer-based adhesive, and more preferably an elastomer-based adhesive from the viewpoint of more excellent plasma resistance.
- the gel type has a hardness of 20 to 80 (mm / 10) in penetration (JISK2207), and the elastomer type has a hardness of 50 to 120 in JIS type A. It can be used preferably.
- the silicone-based adhesive a type containing a heat transfer filler is preferable.
- any type that includes a heat transfer filler is suitable for the electrostatic chuck of the present invention, which has high thermal conductivity and is configured by mounting each electrode member on the mounting surface of the chuck body.
- the thermal conductivity is usually about 0.1 to 0.5 (W / m'K), and can be said to be high at about 0.8 to 4 (W / m'K).
- those having a thermal conductivity of 0.1 (W / m'K) or more can be suitably used.
- each electrode member fixed to the mounting surface can be easily heated by heating at a relatively low temperature of about 150 ° C. Because they can be separated, they do not reduce the mechanical strength of the material that forms the electrostatic chuck.
- At least one of the inner electrode member, the annular electrode member, and the outer electrode member, preferably, the three electrode members of the inner electrode member, the annular electrode member, and the outer electrode member are made of pure aluminum. It is good to form. Specific examples of such pure aluminum include JIS A1050, JIS A1060, JIS A1070, JIS A1080, and JIS AllOO, and preferably HS A1100.
- Each of the above electrode members forms an oxide film on the surface by a commonly performed anodic oxidation treatment or the like. However, when each of the electrode members is formed of pure aluminum as described above, the oxide film formed on the surface thereof is formed.
- the electrostatic chuck according to the present invention When the electrostatic chuck according to the present invention is configured by using the inner electrode member, the annular electrode member, and the outer electrode member formed using pure aluminum as described above, when used in a semiconductor manufacturing apparatus or the like, it has a problem such as plasma resistance. It has excellent surface performance and the electrical insulation performance of the oxide film is stable for a long period of time, extending the life of the product as an electrostatic chuck.
- the chuck body in the present invention is required to have high mechanical strength, and is therefore preferably formed using a wrought structural material.
- a wrought material for structure examples include I IS A606L @ IS A5056 and J IS A505.
- the chuck body formed of the above-mentioned material forms an oxide film on at least each of the mounting surface and the outer peripheral surface to which the above-mentioned electrode members are fixed by an anodic oxidation treatment or the like generally performed.
- the inner electrode member and the outer electrode member are equal.
- a DC power supply is connected between the first electrode composed of the inner electrode member and the outer electrode member and the annular electrode member of the second electrode to form a bipolar electrostatic chuck. .
- the inner electrode member and the outer electrode member need to be electrically connected to the chuck body, respectively, as described above.
- the respective positioning pins provided between the inner electrode member and the chuck body and between the outer electrode member and the chuck body at least one of the positioning pins may also serve as a conduction pin.
- a separate conduction pin may be provided between the chuck body and the inner electrode member and between the chuck body and the outer electrode member.
- an inner electrode member fixed to the mounting surface of the chuck body via an adhesive layer has a portion that directly contacts the chuck body, and the chuck body and the inner electrode at this contact portion are provided.
- the chuck main body and the inner electrode member may be electrically connected via the contact portion.
- a portion of the oxide film may be removed at a portion that comes into contact with the chuck body, so that the outer electrode member may be electrically connected to the chuck body.
- the bipolar electrostatic chuck of the present invention is formed by a chuck body having a mounting surface, an annular electrode member fixed to the mounting surface via an adhesive layer, an inner electrode member, and an outer electrode member. It is easier to manufacture than a conventional bipolar electrostatic chuck.
- the adhesive layer as an adhesive layer made of a silicone adhesive or a polyvinyl butyral adhesive
- the annular electrode member, the inner electrode member, and The bipolar electrostatic chuck of the present invention formed by fixing the outer electrode member is used in a semiconductor manufacturing apparatus or the like, and then easily used as a chuck body, an annular electrode member, an inner electrode member, and an outer electrode using a release agent. It can be separated from the electrode member.
- the annular electrode member, the inner electrode member, and the outer electrode member fixed to the mounting surface of the chuck body via a silicone-based adhesive can be easily removed from the mounting surface without heating or mechanical processing. Can be removed. For this reason, there is no problem such as a decrease in mechanical material strength of the chuck body or the like due to heating or a problem such as damage due to machining.
- the separated electrostatic chuck can be reused as an electrostatic chuck again.
- each electrode member is fixed to the chuck main body.
- the oxide film on the mounting surface is less directly affected by the effects of plasma irradiation and the like than the electrode members forming the sample adsorption surface.
- the chuck body separated as described above usually needs only to be cleaned by dry ice blast, or only by a cleaning process such as cleaning with an alcohol-based cleaning agent.
- the outer peripheral surface of the check body has relatively large scratches If necessary, a process for regenerating the oxide film on the surface of the chuck body may be performed. In this regeneration treatment, the usual processes such as removal of the oxide film attached to the chuck body, polishing of the chuck body after the removal of the film, and regeneration of the oxide film by anodic oxidation treatment are performed. it can.
- a new annular electrode member, an inner electrode member, and an outer electrode member are fixed to the mounting surface thereof via an adhesive layer.
- the mounting surface of the chuck main body has an outer convex portion and an inner convex portion, and the positioning spacer is used between the chuck main body and the annular electrode member so that the height of each electrode member with respect to the mounting surface can be increased. Since the vertical direction is positioned, it can be reproduced as close as possible to the sample suction surface of the electrostatic chuck before reuse. Similarly, if a positioning pin is provided between the chuck body and each electrode member, the horizontal position with respect to the mounting surface can be reproduced.
- FIG. 1 is an explanatory cross-sectional view of a bipolar electrostatic check X according to Embodiment 1 of the present invention.
- FIG. 2 is an explanatory plan view of the bipolar electrostatic chuck X according to the first embodiment of the present invention.
- FIG. 3 is an explanatory sectional view of a part of the bipolar electrostatic chuck X according to the second embodiment of the present invention.
- X bipolar electrostatic chuck
- W semiconductor wafer
- 1 chuck body
- la mounting surface
- lb flange
- lc base surface
- Id outer ridge
- le inner ridge
- FIG. 1 is a sectional view of a bipolar electrostatic chuck X according to Embodiment 1 of the present invention. Show. FIG. 2 is a plan view of the bipolar electrostatic chuck X according to the embodiment of the present invention.
- This bipolar electrostatic chuck X is formed in a disc shape by JIS A6061 wrought structural material and has a chuck body 1 having a mounting surface la, and a gel-like silicone adhesive on the mounting surface 1a.
- Electrode member 3 made of pure aluminum material JIS A1100 fixed via an adhesive layer 2 made of: and an annular electrode member 3 disposed in the central opening of the annular electrode member 3 and attached to the mounting surface la by the adhesive layer
- An inner circular electrode member 4 made of pure aluminum material J IS A1100 fixed via the second circular electrode member 2 and the outer circular electrode member 3 are disposed and fixed to the mounting surface la via the adhesive layer 2.
- an outer annular electrode member 5 made of pure aluminum material HS A1100.
- the bipolar electrostatic chuck X uses a flange portion 1 b provided on the outer peripheral surface of the chuck body 1, and is connected to a plasma etching apparatus (not shown) through a base surface 1 c of the chuck body 1. Fixed by 6.
- the surface of the annular electrode member 3, the surface of the inner circular electrode member 4, the surface of the outer annular electrode member 5, and the surface of the chuck body 1 (excluding the surface on the base surface lc side) are: Each has an oxide film formed by anodizing. Further, between the annular electrode member 3 and the inner circular electrodes member 4, and the annular electrode member 3 and the outer toric electrode member 5 is disposed so as to respectively a predetermined distance dpd 2.
- As the gel-like silicone adhesive use TSE3251 manufactured by GE Toshiba Silicone Co., Ltd. (viscosity 8.5 (25 ° C Pa's), thermal conductivity 0.18 (W / m'K)). Can be
- an outer ridge convex portion 1d is provided so as to correspond to the outer periphery of the outer annular electrode member 5, and the outer annular electrode member 5 Positioning in the height direction with respect to the mounting surface 1a is performed by the outer ridge projection 1d.
- the mounting surface la is provided with an inner ridge protrusion le at a position corresponding to the outer periphery of the inner circular electrode member 4, and the inner circular electrode member 4 is mounted by the inner ridge protrusion le. Positioning in the height direction with respect to the surface 1a is performed. Also, 8679
- Insulating spacers 7 made of polyimide are provided between the annular electrode member 3 and the chuck body 1 so as to be evenly distributed at 45 ° at positions corresponding to the inner and outer circumferences of the annular electrode member 3. Eight are each interposed, and the annular electrode member 3 is positioned in the height direction with respect to the mounting surface la by the insulating spacers 7.
- the sample-adsorbing surface 8 is formed by the annular electrode member 3, the inner circular electrode member 4, and the outer annular electrode member 5, and a semiconductor wafer "W" is mounted on the sample-adsorbing surface 8.
- a positioning conduction pin 9 made of brass is provided between the chuck body 1 and the inner circular electrode member 4.
- One end of the positioning conduction pin 9 is fitted into a fitting hole 4 a provided on the surface of the inner circular electrode member 4 opposite to the sample suction surface 8, and the other end is made of stainless steel at the tip.
- the conduction panel 9 a is attached, and is fitted so that the conduction panel 9 a is urged in a fitting hole 1 ⁇ ⁇ provided in the chuck body 1.
- the four positioning conduction pins 9 are provided so as to be arranged at 90 ° equidistant positions on the circumference of the inner circular electrode member 4 inside the inner protruding ridge le on the mounting surface la.
- a conduction pin 9 is provided between the main body 1 and the chuck body 1. With these positioning conductive pins 9, the inner circular electrode member 4 and the outer circular electrode member 5 are positioned horizontally with respect to the mounting surface 1a of the chuck body 1, and at the same time, the chuck body 1 and the inner circular electrode member 4 are positioned. And the outer annular electrode member 5 constitutes a first electrode.
- a positioning pin 10 made of polyimide is provided between the chuck body 1 and the annular electrode member 3.
- One end of the positioning pin 10 is fitted into a fitting hole 3 a provided on the surface of the annular electrode member 3 opposite to the sample suction surface 8, and the other end is provided on the chuck body 1. It is fitted in the fitted hole 1 g.
- the positioning pin 10 is located at a substantially intermediate position between the inner outer circumference and the outer outer circumference of the annular electrode member 3 on the mounting surface 1 a.
- the three are arranged on a semicircle at 90 ° intervals. With the positioning pins 10, the annular electrode member 3 is positioned horizontally with respect to the mounting surface 1 a of the chuck body 1.
- a cooling gas passage 11 that connects the chuck body 1 and the inner circular electrode member 4 and a cooling gas passage 12 that connects the chuck body 1 and the outer annular electrode member 5 are formed.
- the cooling gas flow path 11 connecting the chuck body 1 and the inner circular electrode member 4 also serves as a through hole for allowing a push-up pin of the semiconductor wafer W placed on the sample adsorption surface 8 to pass therethrough.
- an inner gas groove 13 connected to the cooling gas channel 11 is formed toward the outer peripheral direction of the inner circular electrode member 4.
- an outer gas groove 14 connected to the cooling gas flow path 12 is formed on the upper surface of the outer annular electrode member 5 forming the sample adsorption surface 8.
- the cooling gas passages 11 and 12 are connected to the gas chambers 15, respectively, and a part of the cooling gas sent from the cooling gas passage 11 is on the upper surface of the inner circular electrode member 4.
- the cooling gas that flows into the gap formed between the circular electrode member 4 and the annular electrode member 3 and is sent from the cooling gas passage 12 is partially formed on the upper surface of the outer annular electrode member 5. It flows into the gap d 2 formed between the outer annular electrode member 5 and the annular electrode member 3. Therefore, the distribution of the cooling gas on the sample adsorption surface 8 is made uniform.
- a through hole is formed in the chuck body 1 so as to penetrate between the mounting surface 1a and the base surface 1c.
- One end of the through hole is formed in the through hole and the lower surface of the annular electrode member 3 (sample adsorption).
- (Insulation bushing 16) is installed so as to reach the surface opposite to surface 8).
- a power supply pin hole 3b is formed on the lower surface of the annular electrode member 3 at a position substantially corresponding to the center of the insulating bush 16, and the insulating bush is formed from the base surface 1c side of the chuck body.
- a power supply terminal 17 that fits into the power supply pin hole 3 b is mounted through the inside of the power supply pin 16, whereby the annular electrode member 3 constitutes a second electrode.
- the power supply terminals 17 are arranged at 90 ° evenly on the same circle as the positioning pins 10 provided between the chuck body 1 and the annular electrode member 3. 9
- the electrostatic chuck mounting seat of the plasma etching apparatus (not shown) is made of a conductive member, and the positive or negative electrode of a DC power supply (not shown) is also connected. Since an oxide film is not formed on the base surface 1 c of the chuck body 1, the base surface lc is brought into contact with and fixed to the electrostatic chuck mounting seat surface on the above-mentioned device side, so that the chuck body 1 and the device side are fixed.
- the electrostatic chuck mounting seat surface is electrically conductive. That is, one electrode of the DC power supply is connected to the chuck body 1.
- a power supply terminal 17 attached to the annular electrode member 3 is connected to an electrode having a polarity opposite to that of the DC power supply electrode connected to the chuck body 1. In this way, the bipolar electrostatic chuck X is formed by separately applying positive and negative voltages to the first electrode and the second electrode.
- the bipolar electrostatic chuck X according to Example 1 After using the bipolar electrostatic chuck X according to Example 1 in a plasma etching apparatus, it was removed from the plasma etching apparatus and immersed in a xylene bath. After immersing for 8 hours while maintaining the temperature of the xylene bath at 15 ° C, the electrostatic chuck X taken out of the xylene bath swells the above-mentioned silicone-based adhesive used as the adhesive layer 2 to form an adhesive force. Because of this weakening, the electrode members of the annular electrode member 3, the inner circular electrode member 4, and the outer annular electrode member 5 can be easily removed from the mounting surface la of the chuck body 1.
- each of the annular electrode member 3, the inner circular electrode member 4, the outer annular electrode member 5, and the conductive panel 9 attached to one end of the positioning conductive pin 9 a is discarded without reuse.
- the surface of the chuck body 1, positioning conduction pins 9, positioning pins 10 and insulating spacers 7 were subjected to dry ice blast irradiation under the conditions of a discharge pressure of 20 Pa and an irradiation time of 5 minutes, respectively. The deposits of were removed.
- each electrode member is formed from the same material as that before replacement, and the thickness of the oxide film formed on the surface is made uniform.
- the fitting holes 3a, 4a, 5a provided in each electrode member are formed in the same position and the same shape as those before replacement.
- the cooling gas flow path 11 and the inner gas groove 13 are formed for the inner circular electrode member 4, and the cooling gas flow path 12 and the outer gas groove 14 are formed for the outer annular electrode member 5.
- the chuck body 1, the positioning conduction pin 9, the positioning pin 10 and the insulating spacer 7, and the new annular electrode member 3, the inner circular electrode member 4, the outer annular electrode member 5, and the conduction By using the panel 9a to assemble the bipolar electrostatic chuck X according to the first embodiment in the same manner as described above, the bipolar electrostatic chuck X by reuse can be obtained.
- FIG. 3 shows a modification of the relationship between the inner circular electrode member 4 in the bipolar electrostatic chuck X according to the first embodiment of the present invention and the mounting surface 1a to which the inner circular electrode member 4 is fixed.
- the inner circular electrode member 4 has a conical bottom surface (opposite to the sample adsorption surface 8) and a conical projection 4h provided on the bottom surface.
- An oxide film 4 i is formed on the surface of the inner circular electrode member 4 in the same manner as in Example 1 except for the surface portion of the projection 41 1 ⁇ .
- a conical groove 1 h corresponding to the shape of the bottom surface of the inner circular electrode member 4 is formed on the mounting surface la of the chuck body 1 to which the inner circular electrode member 4 is fixed via the adhesive layer 2. Yes, Therefore, the conical groove lh and the projection 4h of the inner circular electrode member 4 are fixed in a complementary shape.
- the oxide film 1 was formed in the same manner as in Example 1, except for the portion where the projection 4h of the inner circular electrode member 4 was in contact with the conical groove 1h. i is formed.
- the protrusion 4h of the inner circular electrode member 4 fixed to the mounting surface 1a and the shape complementary to the protrusion 4h are formed. Since the conical groove lh on the mounting surface 1a does not have an oxide film on each other, the inner circular electrode member 4 fixed to the mounting surface la of the chuck body 1 and the chuck body 1 have the above-mentioned protrusion 4h In this case, electrical conduction can be achieved via the contact surface. Therefore, the positioning conduction pin 9 like the electrostatic check X in the first embodiment becomes unnecessary.
- the inner circular electrode member 4 has a protrusion 4 h fixed in a complementary shape to the conical groove 1 11 formed in the mounting surface 1 a, so that the inner circular electrode member 4 The horizontal positioning of 4 is also done. Furthermore, the inner circular electrode member 4 is fixed by the above-mentioned protrusion 4 h being directly in contact with the mounting surface la, so that the chuck body 1 is mounted on the electrostatic chuck X of the first embodiment. Positioning of the inner circular electrode member 4 in the height direction with respect to the mounting surface 1a can be performed without providing the inner ridge convex portion 1e at a position corresponding to the inner circular electrode member 4 like the surface 1a. . In the relationship between the inner circular electrode member 4 according to the second embodiment and the mounting surface 1a of the chuck main body 1, portions other than those described above can be the same as in the first embodiment.
- the disassembly of the bipolar electrostatic chuck X according to the second embodiment and the reuse of the bipolar electrostatic chuck X according to the second embodiment can be performed in the same procedure as in the first embodiment.
- Example 1 As a silicone-based adhesive for forming the adhesive layer 2 of the bipolar electrostatic chuck X in Example 1, an elastomer-based adhesive containing a heat transfer filler was used. The procedure was the same as in Example 1 except that was used.
- This elastomer-based silicone adhesive is available from Dow Corning Toray Silicone SE4400 (viscosity before curing 76 (25 ° C Pa's), thermal conductivity 0.92 (W / m-K) ] Can be used.
- the bipolar electrostatic chuck of the present invention can be manufactured more easily than a conventional bipolar electrostatic chuck. After use, the electrostatic chuck can be easily separated and efficiently reused, thereby reducing the cost of recycling and assembling for reuse. The performance of the obtained electrostatic chuck can be maintained at the same level as that before reuse.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04736883A EP1635388A4 (en) | 2003-06-17 | 2004-06-15 | DIPOLAR ELECTROSTATIC CLAMPING DEVICE |
US10/561,159 US7567421B2 (en) | 2003-06-17 | 2004-06-15 | Bipolar electrostatic chuck |
JP2005507016A JP4532410B2 (ja) | 2003-06-17 | 2004-06-15 | 双極型静電チャック |
KR1020057024160A KR101076511B1 (ko) | 2003-06-17 | 2005-12-16 | 쌍극형 정전척 |
HK06111451A HK1091029A1 (en) | 2003-06-17 | 2006-10-18 | Dipolar electrostatic chuck |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003-172470 | 2003-06-17 | ||
JP2003172470 | 2003-06-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004112123A1 true WO2004112123A1 (ja) | 2004-12-23 |
Family
ID=33549473
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/008679 WO2004112123A1 (ja) | 2003-06-17 | 2004-06-15 | 双極型静電チャック |
Country Status (8)
Country | Link |
---|---|
US (1) | US7567421B2 (ja) |
EP (1) | EP1635388A4 (ja) |
JP (1) | JP4532410B2 (ja) |
KR (1) | KR101076511B1 (ja) |
CN (1) | CN100365795C (ja) |
HK (1) | HK1091029A1 (ja) |
TW (1) | TWI254965B (ja) |
WO (1) | WO2004112123A1 (ja) |
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WO2007032418A1 (en) * | 2005-09-12 | 2007-03-22 | Matsushita Electric Industrial Co., Ltd. | Plasma treating apparatus and electrode member therefor and electrode member manufacturing and recycling method |
JP2009521311A (ja) * | 2005-12-23 | 2009-06-04 | ラム リサーチ コーポレーション | 超音波による攪拌と電場を用いた静電チャックの洗浄 |
JP2009148784A (ja) * | 2007-12-19 | 2009-07-09 | Disco Abrasive Syst Ltd | チャックテーブル機構 |
CN103187348A (zh) * | 2011-12-31 | 2013-07-03 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 晶片固定装置、半导体设备和晶片固定方法 |
DE102006035402B4 (de) * | 2005-11-07 | 2020-08-20 | Ngk Insulators, Ltd. | Demontageverfahren und Wiederverwendungsverfahren eines Trägermaterial-Halterungselements |
JP2022032813A (ja) * | 2020-08-14 | 2022-02-25 | 信越化学工業株式会社 | シリコーン接着剤組成物、及びシリコーンゴム硬化物 |
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US11393708B2 (en) | 2018-12-21 | 2022-07-19 | Toto Ltd. | Electrostatic chuck |
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007032418A1 (en) * | 2005-09-12 | 2007-03-22 | Matsushita Electric Industrial Co., Ltd. | Plasma treating apparatus and electrode member therefor and electrode member manufacturing and recycling method |
DE102006035402B4 (de) * | 2005-11-07 | 2020-08-20 | Ngk Insulators, Ltd. | Demontageverfahren und Wiederverwendungsverfahren eines Trägermaterial-Halterungselements |
JP2009521311A (ja) * | 2005-12-23 | 2009-06-04 | ラム リサーチ コーポレーション | 超音波による攪拌と電場を用いた静電チャックの洗浄 |
JP4938792B2 (ja) * | 2005-12-23 | 2012-05-23 | ラム リサーチ コーポレーション | 超音波による攪拌と電場を用いた静電チャックの洗浄 |
JP2009148784A (ja) * | 2007-12-19 | 2009-07-09 | Disco Abrasive Syst Ltd | チャックテーブル機構 |
CN103187348A (zh) * | 2011-12-31 | 2013-07-03 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 晶片固定装置、半导体设备和晶片固定方法 |
JP2022032813A (ja) * | 2020-08-14 | 2022-02-25 | 信越化学工業株式会社 | シリコーン接着剤組成物、及びシリコーンゴム硬化物 |
JP7285238B2 (ja) | 2020-08-14 | 2023-06-01 | 信越化学工業株式会社 | シリコーン接着剤組成物、及びシリコーンゴム硬化物 |
Also Published As
Publication number | Publication date |
---|---|
KR101076511B1 (ko) | 2011-10-24 |
US7567421B2 (en) | 2009-07-28 |
JPWO2004112123A1 (ja) | 2006-09-28 |
TWI254965B (en) | 2006-05-11 |
TW200520024A (en) | 2005-06-16 |
JP4532410B2 (ja) | 2010-08-25 |
EP1635388A4 (en) | 2009-10-21 |
KR20060029229A (ko) | 2006-04-05 |
HK1091029A1 (en) | 2007-01-05 |
US20060158821A1 (en) | 2006-07-20 |
CN100365795C (zh) | 2008-01-30 |
EP1635388A1 (en) | 2006-03-15 |
CN1806324A (zh) | 2006-07-19 |
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