KR960030365A - 고온용 폴리이미드 정전기 척 - Google Patents

고온용 폴리이미드 정전기 척 Download PDF

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Publication number
KR960030365A
KR960030365A KR1019960002236A KR19960002236A KR960030365A KR 960030365 A KR960030365 A KR 960030365A KR 1019960002236 A KR1019960002236 A KR 1019960002236A KR 19960002236 A KR19960002236 A KR 19960002236A KR 960030365 A KR960030365 A KR 960030365A
Authority
KR
South Korea
Prior art keywords
polyimide
electrostatic chuck
conductive
electrostatic
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1019960002236A
Other languages
English (en)
Korean (ko)
Inventor
첸 아이후아
파크헤 비야이
에델스테인 서지오
Original Assignee
제임스 조셉 드롱
어플라이드 머티어리얼스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 제임스 조셉 드롱, 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 제임스 조셉 드롱
Publication of KR960030365A publication Critical patent/KR960030365A/ko
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
KR1019960002236A 1995-01-31 1996-01-31 고온용 폴리이미드 정전기 척 Ceased KR960030365A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/381,258 1995-01-31
US08/381,258 US5691876A (en) 1995-01-31 1995-01-31 High temperature polyimide electrostatic chuck

Publications (1)

Publication Number Publication Date
KR960030365A true KR960030365A (ko) 1996-08-17

Family

ID=23504320

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960002236A Ceased KR960030365A (ko) 1995-01-31 1996-01-31 고온용 폴리이미드 정전기 척

Country Status (4)

Country Link
US (2) US5691876A (enExample)
EP (1) EP0725426A2 (enExample)
JP (1) JPH08330405A (enExample)
KR (1) KR960030365A (enExample)

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US6278600B1 (en) * 1994-01-31 2001-08-21 Applied Materials, Inc. Electrostatic chuck with improved temperature control and puncture resistance
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US5801915A (en) * 1994-01-31 1998-09-01 Applied Materials, Inc. Electrostatic chuck having a unidirectionally conducting coupler layer
US5729423A (en) * 1994-01-31 1998-03-17 Applied Materials, Inc. Puncture resistant electrostatic chuck
US6099939A (en) * 1995-04-13 2000-08-08 International Business Machines Corporation Enhanced adhesion between a vapor deposited metal and an organic polymer surface exhibiting tailored morphology
JPH0955420A (ja) * 1995-08-11 1997-02-25 Anelva Corp 静電吸着機構
TW406346B (en) * 1996-08-26 2000-09-21 Applied Materials Inc Method and apparatus for cooling a workpiece using an electrostatic chuck
US6184158B1 (en) * 1996-12-23 2001-02-06 Lam Research Corporation Inductively coupled plasma CVD
US6117246A (en) * 1997-01-31 2000-09-12 Applied Materials, Inc. Conductive polymer pad for supporting a workpiece upon a workpiece support surface of an electrostatic chuck
JPH10275752A (ja) * 1997-03-28 1998-10-13 Ube Ind Ltd 張合わせウエハ−及びその製造方法、基板
USD406852S (en) * 1997-11-14 1999-03-16 Applied Materials, Inc. Electrostatic chuck with improved spacing mask and workpiece detection device
US5953200A (en) * 1998-02-05 1999-09-14 Vlsi Technology, Inc. Multiple pole electrostatic chuck with self healing mechanism for wafer clamping
EP0948042A1 (de) * 1998-03-06 1999-10-06 VenTec Gesellschaft für Venturekapital und Unternehmensberatung Elektrostatische Vorrichtung zum Halten von Wafern und anderen Bauteilen
US5905626A (en) * 1998-04-12 1999-05-18 Dorsey Gage, Inc. Electrostatic chuck with ceramic pole protection
US6104596A (en) * 1998-04-21 2000-08-15 Applied Materials, Inc. Apparatus for retaining a subtrate in a semiconductor wafer processing system and a method of fabricating same
US6072685A (en) * 1998-05-22 2000-06-06 Applied Materials, Inc. Electrostatic chuck having an electrical connector with housing
US6159055A (en) * 1998-07-31 2000-12-12 Applied Materials, Inc. RF electrode contact assembly for a detachable electrostatic chuck
US6258228B1 (en) * 1999-01-08 2001-07-10 Tokyo Electron Limited Wafer holder and clamping ring therefor for use in a deposition chamber
USD420023S (en) * 1999-01-09 2000-02-01 Applied Materials, Inc. Electrostatic chuck with improved spacing mask and workpiece detection device
US6094334A (en) * 1999-03-02 2000-07-25 Applied Materials, Inc. Polymer chuck with heater and method of manufacture
US6268994B1 (en) 1999-07-09 2001-07-31 Dorsey Gage, Inc. Electrostatic chuck and method of manufacture
JP2001043961A (ja) * 1999-07-28 2001-02-16 Keihin Sokki Kk 半導体ウエハーにおけるヒータ装置およびその製造方法
JP2001126851A (ja) * 1999-10-26 2001-05-11 Keihin Sokki Kk 半導体ウエハーにおけるヒータ装置およびその製造方法
US6490144B1 (en) * 1999-11-29 2002-12-03 Applied Materials, Inc. Support for supporting a substrate in a process chamber
US6377437B1 (en) 1999-12-22 2002-04-23 Lam Research Corporation High temperature electrostatic chuck
KR20010066139A (ko) * 1999-12-31 2001-07-11 황인길 척을 가지고 있는 반도체 제조 장치
TW507312B (en) * 2000-02-04 2002-10-21 Philips Electron Optics Bv Particle-optical apparatus, and object carrier therefor
JP4753460B2 (ja) * 2000-08-16 2011-08-24 株式会社クリエイティブ テクノロジー 静電チャック及びその製造方法
KR100796749B1 (ko) 2001-05-16 2008-01-22 삼성전자주식회사 액정 표시 장치용 박막 트랜지스터 어레이 기판
US6669783B2 (en) 2001-06-28 2003-12-30 Lam Research Corporation High temperature electrostatic chuck
US7334443B2 (en) 2002-02-22 2008-02-26 Master Lock Company Llc Radio frequency electronic lock
US6660665B2 (en) * 2002-05-01 2003-12-09 Japan Fine Ceramics Center Platen for electrostatic wafer clamping apparatus
CN100365795C (zh) * 2003-06-17 2008-01-30 创意科技股份有限公司 双极型静电卡盘
DE10332325A1 (de) * 2003-07-16 2005-02-03 Schaltbau Gmbh Druckkontakt-Steckverbinder
DE10332298B4 (de) * 2003-07-16 2018-09-27 Schaltbau Gmbh Wasserdichter Druckkontakt-Steckverbinder, Kontaktelement für einen wasserdichten Druckkontakt-Steckverbinder und Verfahren zur Herstellung eines Kontaktelements
TWI377224B (en) * 2004-07-27 2012-11-21 Kaneka Corp Polyimide film having high adhesiveness and production method therefor
CN102675634B (zh) * 2004-09-24 2015-06-17 株式会社钟化 具有高粘接性的聚酰亚胺薄膜的制造方法
WO2006077780A1 (ja) * 2005-01-18 2006-07-27 Kaneka Corporation 接着性の改良された新規なポリイミドフィルム
US9520276B2 (en) * 2005-06-22 2016-12-13 Tokyo Electron Limited Electrode assembly and plasma processing apparatus
JP5049784B2 (ja) 2005-08-04 2012-10-17 株式会社カネカ 金属被覆ポリイミドフィルム
US20070034957A1 (en) * 2005-08-12 2007-02-15 Wagner Richard J Electrostatic foot for non-permanent attachment
DE102006055618B4 (de) * 2006-11-24 2011-05-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Mobiler elektrostatischer Trägerwafer mit elektrisch isoliertem Ladungsspeicher, Anordnung zur Halterung und Verfahren zum Halten und Lösen eines scheibenförmigen Bauteils
US9147588B2 (en) * 2007-03-09 2015-09-29 Tel Nexx, Inc. Substrate processing pallet with cooling
US7989022B2 (en) * 2007-07-20 2011-08-02 Micron Technology, Inc. Methods of processing substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto
US8043433B2 (en) * 2008-02-11 2011-10-25 Applied Materials, Inc. High efficiency electro-static chucks for semiconductor wafer processing
TWI475594B (zh) 2008-05-19 2015-03-01 恩特格林斯公司 靜電夾頭
US20090325340A1 (en) * 2008-06-30 2009-12-31 Mohd Aslami Plasma vapor deposition system and method for making multi-junction silicon thin film solar cell modules and panels
US8064185B2 (en) 2008-09-05 2011-11-22 Applied Materials, Inc. Electrostatic chuck electrical balancing circuit repair
CN102449754B (zh) 2009-05-15 2015-10-21 恩特格林斯公司 具有聚合物突出物的静电吸盘
US8861170B2 (en) 2009-05-15 2014-10-14 Entegris, Inc. Electrostatic chuck with photo-patternable soft protrusion contact surface
CN105196094B (zh) 2010-05-28 2018-01-26 恩特格林斯公司 高表面电阻率静电吸盘
US20120154974A1 (en) * 2010-12-16 2012-06-21 Applied Materials, Inc. High efficiency electrostatic chuck assembly for semiconductor wafer processing
NL2008630A (en) 2011-04-27 2012-10-30 Asml Netherlands Bv Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder.
JP6100703B2 (ja) * 2012-01-26 2017-03-22 京セラ株式会社 静電チャックおよびその製造方法
US9281226B2 (en) * 2012-04-26 2016-03-08 Applied Materials, Inc. Electrostatic chuck having reduced power loss
SG11201503454QA (en) * 2012-11-02 2015-06-29 Entegris Inc Electrostatic chuck with photo-patternable soft protrusion contact surface
US9349630B2 (en) 2013-03-15 2016-05-24 Applied Materials, Inc. Methods and apparatus for electrostatic chuck repair and refurbishment
JP6358856B2 (ja) 2014-05-29 2018-07-18 東京エレクトロン株式会社 静電吸着装置及び冷却処理装置
US9868272B2 (en) * 2014-09-30 2018-01-16 Illinois Tool Works Inc. Card assembly and method of manufacturing the same
WO2016135565A1 (en) 2015-02-23 2016-09-01 M Cubed Technologies, Inc. Film electrode for electrostatic chuck
DE102015210736B3 (de) 2015-06-11 2016-10-27 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung mit folie zum elektrostatischen koppeln eines substrats mit einem substratträger
JP6226092B2 (ja) * 2016-03-14 2017-11-08 Toto株式会社 静電チャック
JP6784527B2 (ja) * 2016-07-12 2020-11-11 株式会社ディスコ 静電チャックテーブル、レーザー加工装置及び被加工物の加工方法
JP6238097B1 (ja) * 2016-07-20 2017-11-29 Toto株式会社 静電チャック
JP6836663B2 (ja) * 2017-11-24 2021-03-03 トーカロ株式会社 発熱部材
JP7403215B2 (ja) 2018-09-14 2023-12-22 東京エレクトロン株式会社 基板支持体及び基板処理装置
US11887878B2 (en) * 2019-06-28 2024-01-30 Applied Materials, Inc. Detachable biasable electrostatic chuck for high temperature applications
US20210035767A1 (en) * 2019-07-29 2021-02-04 Applied Materials, Inc. Methods for repairing a recess of a chamber component
US11587817B2 (en) 2020-10-21 2023-02-21 Applied Materials, Inc. High temperature bipolar electrostatic chuck
KR102856158B1 (ko) * 2021-05-14 2025-09-04 어플라이드 머티어리얼스, 인코포레이티드 빠른 열 배출 능력을 갖는 고온 서셉터
US12014906B2 (en) * 2021-11-19 2024-06-18 Applied Materials, Inc. High temperature detachable very high frequency (VHF) electrostatic chuck (ESC) for PVD chamber
CN119054066A (zh) * 2022-04-14 2024-11-29 恩特格里斯公司 用于电荷消散的导电聚合物层
JP2024002793A (ja) * 2022-06-24 2024-01-11 新光電気工業株式会社 基板固定装置
US20250128477A1 (en) * 2023-10-18 2025-04-24 The Boeing Company Electrostatic tacking membrane assembly

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JPS60157232A (ja) * 1984-01-27 1985-08-17 Toshiba Corp 静電チヤツク装置
US4733632A (en) * 1985-09-25 1988-03-29 Tokyo Electron Limited Wafer feeding apparatus
KR880004546A (ko) * 1986-09-12 1988-06-04 사이토 다이죠 온도를 제어할 수 있는 진공처리장치
JPH04186653A (ja) * 1990-11-17 1992-07-03 Toshiba Corp 静電チャック
US5280156A (en) * 1990-12-25 1994-01-18 Ngk Insulators, Ltd. Wafer heating apparatus and with ceramic substrate and dielectric layer having electrostatic chucking means
US5310453A (en) * 1992-02-13 1994-05-10 Tokyo Electron Yamanashi Limited Plasma process method using an electrostatic chuck
JPH06326176A (ja) * 1993-05-12 1994-11-25 Tokyo Electron Ltd 自己バイアス測定方法及び装置並びに静電吸着装置

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JPS60157232A (ja) * 1984-01-27 1985-08-17 Toshiba Corp 静電チヤツク装置
US4733632A (en) * 1985-09-25 1988-03-29 Tokyo Electron Limited Wafer feeding apparatus
KR880004546A (ko) * 1986-09-12 1988-06-04 사이토 다이죠 온도를 제어할 수 있는 진공처리장치
JPH04186653A (ja) * 1990-11-17 1992-07-03 Toshiba Corp 静電チャック
US5280156A (en) * 1990-12-25 1994-01-18 Ngk Insulators, Ltd. Wafer heating apparatus and with ceramic substrate and dielectric layer having electrostatic chucking means
US5310453A (en) * 1992-02-13 1994-05-10 Tokyo Electron Yamanashi Limited Plasma process method using an electrostatic chuck
JPH06326176A (ja) * 1993-05-12 1994-11-25 Tokyo Electron Ltd 自己バイアス測定方法及び装置並びに静電吸着装置

Also Published As

Publication number Publication date
US5908334A (en) 1999-06-01
EP0725426A3 (enExample) 1996-08-28
US5691876A (en) 1997-11-25
JPH08330405A (ja) 1996-12-13
EP0725426A2 (en) 1996-08-07

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