JP6358856B2 - 静電吸着装置及び冷却処理装置 - Google Patents
静電吸着装置及び冷却処理装置 Download PDFInfo
- Publication number
- JP6358856B2 JP6358856B2 JP2014111285A JP2014111285A JP6358856B2 JP 6358856 B2 JP6358856 B2 JP 6358856B2 JP 2014111285 A JP2014111285 A JP 2014111285A JP 2014111285 A JP2014111285 A JP 2014111285A JP 6358856 B2 JP6358856 B2 JP 6358856B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- power supply
- electrostatic chuck
- supply terminal
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
Description
Claims (5)
- 被処理体を吸着するための静電チャックであり、
第1面、及び、該第1面とは異なる第2面を含む基台と、
前記基台上に設けられた第1絶縁層であり、前記第1面上で延在する第1部分、及び、前記第2面の少なくとも一部の上で延在する第2部分を含む、該第1絶縁層と、
前記第1部分上に設けられた吸着電極と、
前記第1部分及び前記吸着電極上に設けられた第2絶縁層と、
前記第1絶縁層上に設けられており、且つ、前記吸着電極に電気的に接続された導体パターンであり、前記第2部分上に設けられた給電端子を含む、該導体パターンと、
を有する、該静電チャックと、
前記給電端子に当接される接触部を有する端子部材と、
前記端子部材の前記接触部を前記給電端子に対して付勢する手段と、
前記端子部材に電気的に接続される配線と、
前記配線に電気的に接続される電源と、
を備え、
前記付勢する手段は第1のねじであり、
前記端子部材がその中に挿入された穴を提供する突出部を有し、前記第1のねじを支持する絶縁性の支持部材を更に備え、
前記支持部材は、前記基台の凹部に前記突出部が挿入された状態で前記基台に対して第2のねじにより固定されており、
−263℃〜−60℃の範囲内の温度で被処理体を吸着する、
静電吸着装置。 - 前記接触部は、導電性のバネを含む、請求項1に記載の静電吸着装置。
- 前記配線は、前記付勢する手段を介して前記端子部材に電気的に接続される、請求項1又は2に記載の静電吸着装置。
- 前記第2面は前記第1面に非平行な方向に延びる領域を含み、
前記給電端子は前記第2部分を介して前記第2面の前記領域上に設けられている、
請求項1〜3の何れか一項に記載の静電吸着装置。 - 処理容器と、
請求項1〜4の何れか一項に記載の静電吸着装置であり、前記処理容器内に前記静電チャックが設けられた、該静電吸着装置と、
前記静電チャックを冷却するための冷凍機と、
を備える冷却処理装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014111285A JP6358856B2 (ja) | 2014-05-29 | 2014-05-29 | 静電吸着装置及び冷却処理装置 |
KR1020150068979A KR101791302B1 (ko) | 2014-05-29 | 2015-05-18 | 정전 흡착 장치, 정전 척 및 냉각 처리 장치 |
TW104115879A TWI659497B (zh) | 2014-05-29 | 2015-05-19 | 靜電吸附裝置、靜電夾具及冷卻處理裝置 |
US14/721,408 US9787222B2 (en) | 2014-05-29 | 2015-05-26 | Electrostatic attraction apparatus, electrostatic chuck and cooling treatment apparatus |
SG10201504222SA SG10201504222SA (en) | 2014-05-29 | 2015-05-28 | Electrostatic Attraction Apparatus, Electrostatic Chuck And Cooling Treatment Apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014111285A JP6358856B2 (ja) | 2014-05-29 | 2014-05-29 | 静電吸着装置及び冷却処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015226010A JP2015226010A (ja) | 2015-12-14 |
JP6358856B2 true JP6358856B2 (ja) | 2018-07-18 |
Family
ID=54702934
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014111285A Active JP6358856B2 (ja) | 2014-05-29 | 2014-05-29 | 静電吸着装置及び冷却処理装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9787222B2 (ja) |
JP (1) | JP6358856B2 (ja) |
KR (1) | KR101791302B1 (ja) |
SG (1) | SG10201504222SA (ja) |
TW (1) | TWI659497B (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6742214B2 (ja) * | 2016-10-04 | 2020-08-19 | 株式会社ディスコ | 静電チャックプレートの給電装置 |
JP6605061B2 (ja) | 2017-07-07 | 2019-11-13 | 東京エレクトロン株式会社 | 載置台構造及び処理装置 |
US11149345B2 (en) * | 2017-12-11 | 2021-10-19 | Applied Materials, Inc. | Cryogenically cooled rotatable electrostatic chuck |
US11848177B2 (en) | 2018-02-23 | 2023-12-19 | Lam Research Corporation | Multi-plate electrostatic chucks with ceramic baseplates |
JP7134039B2 (ja) | 2018-09-14 | 2022-09-09 | 東京エレクトロン株式会社 | 基板載置機構、成膜装置、および成膜方法 |
JP7210960B2 (ja) * | 2018-09-21 | 2023-01-24 | 東京エレクトロン株式会社 | 真空処理装置及び基板搬送方法 |
JP7151368B2 (ja) * | 2018-10-19 | 2022-10-12 | 東京エレクトロン株式会社 | 酸化処理モジュール、基板処理システム及び酸化処理方法 |
US11417504B2 (en) * | 2018-10-25 | 2022-08-16 | Tokyo Electron Limited | Stage device and processing apparatus |
JP7224139B2 (ja) | 2018-10-25 | 2023-02-17 | 東京エレクトロン株式会社 | ステージ装置および処理装置 |
JP7233266B2 (ja) | 2018-10-25 | 2023-03-06 | 東京エレクトロン株式会社 | ステージ装置および処理装置 |
JP2022520784A (ja) | 2019-02-12 | 2022-04-01 | ラム リサーチ コーポレーション | セラミックモノリシック本体を備えた静電チャック |
NL2025069A (en) * | 2019-03-13 | 2020-09-17 | Asml Holding Nv | Electrostatic clamp for a lithographic apparatus |
JP7426842B2 (ja) | 2020-02-12 | 2024-02-02 | 東京エレクトロン株式会社 | ステージ装置、給電機構、および処理装置 |
Family Cites Families (19)
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JPS58165462U (ja) * | 1982-04-27 | 1983-11-04 | ナイルス部品株式会社 | シガレツトライタ−の異常過熱防止装置 |
JPH01116442U (ja) * | 1988-02-01 | 1989-08-07 | ||
US5275683A (en) * | 1991-10-24 | 1994-01-04 | Tokyo Electron Limited | Mount for supporting substrates and plasma processing apparatus using the same |
US5348497A (en) * | 1992-08-14 | 1994-09-20 | Applied Materials, Inc. | High voltage vaccum feed-through electrical connector |
US5350479A (en) * | 1992-12-02 | 1994-09-27 | Applied Materials, Inc. | Electrostatic chuck for high power plasma processing |
US5625526A (en) | 1993-06-01 | 1997-04-29 | Tokyo Electron Limited | Electrostatic chuck |
JPH07161803A (ja) * | 1993-12-08 | 1995-06-23 | Tokyo Electron Ltd | アルミニウム部材とポリベンズイミダゾール部材との接合方法、静電チャックの電極構造およびその製造方法 |
US5822171A (en) * | 1994-02-22 | 1998-10-13 | Applied Materials, Inc. | Electrostatic chuck with improved erosion resistance |
US5691876A (en) | 1995-01-31 | 1997-11-25 | Applied Materials, Inc. | High temperature polyimide electrostatic chuck |
US5745332A (en) * | 1996-05-08 | 1998-04-28 | Applied Materials, Inc. | Monopolar electrostatic chuck having an electrode in contact with a workpiece |
JPH10303286A (ja) * | 1997-02-25 | 1998-11-13 | Applied Materials Inc | 静電チャック及び半導体製造装置 |
JP3872256B2 (ja) * | 2000-05-29 | 2007-01-24 | 京セラ株式会社 | ウエハ加熱装置 |
JP4021661B2 (ja) * | 2001-12-27 | 2007-12-12 | 株式会社巴川製紙所 | 静電チャック装置 |
JP4369765B2 (ja) | 2003-07-24 | 2009-11-25 | 京セラ株式会社 | 静電チャック |
JP4508990B2 (ja) * | 2005-09-07 | 2010-07-21 | 株式会社巴川製紙所 | 給電コネクタ、及び当該給電コネクタを有する静電チャック装置 |
JP4803518B2 (ja) * | 2006-04-06 | 2011-10-26 | 独立行政法人産業技術総合研究所 | 試料冷却装置 |
KR100884327B1 (ko) | 2007-03-30 | 2009-02-18 | 주식회사 유진테크 | 써모커플 장치 및 기판처리장치 |
US20110164955A1 (en) * | 2009-07-15 | 2011-07-07 | Applied Materials,Inc. | Processing chamber with translating wear plate for lift pin |
JP6176771B2 (ja) | 2010-12-28 | 2017-08-09 | 住友大阪セメント株式会社 | 静電チャック装置 |
-
2014
- 2014-05-29 JP JP2014111285A patent/JP6358856B2/ja active Active
-
2015
- 2015-05-18 KR KR1020150068979A patent/KR101791302B1/ko active IP Right Grant
- 2015-05-19 TW TW104115879A patent/TWI659497B/zh active
- 2015-05-26 US US14/721,408 patent/US9787222B2/en active Active
- 2015-05-28 SG SG10201504222SA patent/SG10201504222SA/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2015226010A (ja) | 2015-12-14 |
KR101791302B1 (ko) | 2017-10-27 |
SG10201504222SA (en) | 2015-12-30 |
US20150349668A1 (en) | 2015-12-03 |
TW201611178A (zh) | 2016-03-16 |
KR20150138015A (ko) | 2015-12-09 |
US9787222B2 (en) | 2017-10-10 |
TWI659497B (zh) | 2019-05-11 |
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