JP6742214B2 - 静電チャックプレートの給電装置 - Google Patents
静電チャックプレートの給電装置 Download PDFInfo
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- JP6742214B2 JP6742214B2 JP2016196605A JP2016196605A JP6742214B2 JP 6742214 B2 JP6742214 B2 JP 6742214B2 JP 2016196605 A JP2016196605 A JP 2016196605A JP 2016196605 A JP2016196605 A JP 2016196605A JP 6742214 B2 JP6742214 B2 JP 6742214B2
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- Prior art keywords
- power supply
- electrostatic chuck
- chuck plate
- needle
- unit
- Prior art date
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- 239000010410 layer Substances 0.000 description 42
- 239000000758 substrate Substances 0.000 description 32
- 239000002184 metal Substances 0.000 description 20
- 229910052751 metal Inorganic materials 0.000 description 20
- 230000003068 static effect Effects 0.000 description 12
- 230000008030 elimination Effects 0.000 description 9
- 238000003379 elimination reaction Methods 0.000 description 9
- 230000005611 electricity Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000005259 measurement Methods 0.000 description 6
- 244000126211 Hericium coralloides Species 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 238000000926 separation method Methods 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 210000001520 comb Anatomy 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
Description
2 基板
2a 主面
2b 裏面
2c 側面
2d,2e 外縁部
3 櫛歯電極
31 正極電極
311,321 枝部
311a,321a 太幅領域
311b,321b 細幅領域
312,322 幹部
32 負極電極
4 金属層
5 絶縁層
5a 内側絶縁層
5b 外側絶縁層
5c 保持面
6 電極端子部
6a 正極電極端子部
6b 負極電極端子部
100 給電装置
110 ベース部
110a 載置面
120 給電部
121,122 ニードル
121a,122a 先端
121b,122b 基端
123,124 ニードル支持部
123a,124a 収容部
125 固定部
130 電源部
131 第1電源部
132 第2電源部
133 キャパシタンス測定回路
134 給電指示スイッチ
135 除電指示スイッチ
136 制御部
140 位置付けユニット
141 押圧部
141a 押圧面
142 支持部
151,152 バネ
Claims (2)
- 保持面側に形成された一対の電極と接続して側面側で露出する一対の電極端子部を備える双極型静電チャックプレートに電圧を印加する静電チャックプレートの給電装置であって、
該静電チャックプレートを載置する載置面を備えるベース部と、
導電性の一対のニードルと、内部に該ニードルの根本及びバネを収容し該ニードルを該バネで付勢しつつ支持するニードル支持部と、を有し、該載置面と略平行に先端を突出させた該ニードルで該ベース部に載置した該静電チャックプレートの該電極端子部に接触する給電部と、
該給電部に印加する電圧を制御する電源部と、
該ベース部に支持される該静電チャックプレートを該給電部に対応する位置に位置付ける位置付けユニットと、を備え、
該電源部は、該一対のニードルに対して正負の組合せで電圧を供給する事を特徴とする静電チャックプレートの給電装置。 - 該位置付けユニットは、該給電部の該バネが収縮するが全圧縮しない程度の力で該静電チャックプレートを該ニードルに押圧することを特徴とする請求項1の静電チャックプレートの給電装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016196605A JP6742214B2 (ja) | 2016-10-04 | 2016-10-04 | 静電チャックプレートの給電装置 |
TW106130306A TW201814824A (zh) | 2016-10-04 | 2017-09-05 | 靜電夾盤的供電裝置 |
CN201710896577.9A CN107895701B (zh) | 2016-10-04 | 2017-09-28 | 静电卡盘板的供电装置 |
KR1020170125896A KR102257254B1 (ko) | 2016-10-04 | 2017-09-28 | 정전 척 플레이트의 급전 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016196605A JP6742214B2 (ja) | 2016-10-04 | 2016-10-04 | 静電チャックプレートの給電装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018060894A JP2018060894A (ja) | 2018-04-12 |
JP6742214B2 true JP6742214B2 (ja) | 2020-08-19 |
Family
ID=61802758
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016196605A Active JP6742214B2 (ja) | 2016-10-04 | 2016-10-04 | 静電チャックプレートの給電装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6742214B2 (ja) |
KR (1) | KR102257254B1 (ja) |
CN (1) | CN107895701B (ja) |
TW (1) | TW201814824A (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6493372B2 (ja) | 2016-12-07 | 2019-04-03 | トヨタ自動車株式会社 | 半導体装置 |
JP7556320B2 (ja) | 2021-04-15 | 2024-09-26 | 新光電気工業株式会社 | 基板取り外し装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05315429A (ja) * | 1992-05-07 | 1993-11-26 | Hitachi Ltd | 半導体製造装置の搬送装置 |
JPH0883832A (ja) * | 1994-07-13 | 1996-03-26 | Shinko Electric Co Ltd | 電力供給装置 |
JP3507141B2 (ja) * | 1994-09-05 | 2004-03-15 | キヤノン株式会社 | 電池室 |
JP3076727B2 (ja) * | 1994-10-19 | 2000-08-14 | 東芝機械株式会社 | 試料ホルダの固定装置 |
JP4378822B2 (ja) * | 1999-07-09 | 2009-12-09 | Toto株式会社 | 静電チャックおよびユニット |
JP2002124229A (ja) * | 2000-10-13 | 2002-04-26 | Tookado:Kk | 電池のスイッチ |
JP4508990B2 (ja) * | 2005-09-07 | 2010-07-21 | 株式会社巴川製紙所 | 給電コネクタ、及び当該給電コネクタを有する静電チャック装置 |
JP5112808B2 (ja) * | 2007-10-15 | 2013-01-09 | 筑波精工株式会社 | 静電型補強装置 |
WO2010004915A1 (ja) * | 2008-07-08 | 2010-01-14 | 株式会社クリエイティブ テクノロジー | 双極型静電チャック |
JP2010061949A (ja) * | 2008-09-03 | 2010-03-18 | Canon Inc | 電子機器 |
JP6358856B2 (ja) * | 2014-05-29 | 2018-07-18 | 東京エレクトロン株式会社 | 静電吸着装置及び冷却処理装置 |
JP6433204B2 (ja) | 2014-09-01 | 2018-12-05 | 株式会社ディスコ | 静電支持プレート及び静電支持プレートの製造方法 |
-
2016
- 2016-10-04 JP JP2016196605A patent/JP6742214B2/ja active Active
-
2017
- 2017-09-05 TW TW106130306A patent/TW201814824A/zh unknown
- 2017-09-28 CN CN201710896577.9A patent/CN107895701B/zh active Active
- 2017-09-28 KR KR1020170125896A patent/KR102257254B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20180037589A (ko) | 2018-04-12 |
KR102257254B1 (ko) | 2021-05-26 |
CN107895701B (zh) | 2023-06-30 |
JP2018060894A (ja) | 2018-04-12 |
CN107895701A (zh) | 2018-04-10 |
TW201814824A (zh) | 2018-04-16 |
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