JPH0784115B2 - 半導体装置カ−ド - Google Patents

半導体装置カ−ド

Info

Publication number
JPH0784115B2
JPH0784115B2 JP62079923A JP7992387A JPH0784115B2 JP H0784115 B2 JPH0784115 B2 JP H0784115B2 JP 62079923 A JP62079923 A JP 62079923A JP 7992387 A JP7992387 A JP 7992387A JP H0784115 B2 JPH0784115 B2 JP H0784115B2
Authority
JP
Japan
Prior art keywords
circuit board
semiconductor device
device card
board
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP62079923A
Other languages
English (en)
Other versions
JPS63242696A (ja
Inventor
敏信 番條
重雄 小野田
誠 大森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62079923A priority Critical patent/JPH0784115B2/ja
Priority to US07/174,955 priority patent/US4905124A/en
Publication of JPS63242696A publication Critical patent/JPS63242696A/ja
Publication of JPH0784115B2 publication Critical patent/JPH0784115B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、ゲームカードなどに用いられるICカードな
どの半導体装置カードに関し、特に電子部品の高密度実
装にかかわる。
〔従来の技術〕
例えば、テレビゲーム用ソフトを内蔵したゲームカード
やマイコン用メモリカードなどに用いられる、従来の半
導体装置カード（以下「カード」と称する）は第４図及
び第５図に平面図及び正面断面図で示すようになつてい
た。図において、１は半導体装置を収納したパツケージ
で、側周を囲う枠体２と、この枠体の上下に接合され閉
鎖する上部カバー３及び下部カバー４とからなる。これ
ら枠体２及びカバー3,4は合成樹脂など絶縁材からなつ
ている。５はプリント配線（図示は略す）など回路配線
が施された回路基板で、下面に半導体素子や電気回路部
品などの電子部品６が装着されている。この回路基板５
は上面前部側多数の電極端子７が配設されてあり、パツ
ケージ１に収納されている。
このように、電極端子７は回路基板５上面に直接配設さ
れており、回路基板５は上部カバー３に近接していて、
電子部品６は回路基板５の下面に装着してある。
〔発明が解決しようとする問題点〕
上記のような従来の半導体装置カードでは、電子部品６
は回路基板５の下面にしか装着できず、高密度実装が低
下するという問題点があつた。
この発明は、このような問題点を解決するためになされ
たもので、電子部品を回路基板に高密度実装した半導体
装置カードを得ることを目的としている。
〔問題点を解決するための手段〕
この発明にかかる半導体装置カードは、回路基板の上面
前端部に端子基板を固着し、この端子基板上に電極端子
を配設し、回路基板の両面に電子部品を装着したもので
ある。
〔作用〕
この発明においては、回路基板の上面が上部カバーから
間隔があくことにより、電子部品が回路基板の上面にも
装着され、高密度実装が得られる。
〔実施例〕
第１図及び第２図はこの発明による半導体装置カードの
一実施例を示す平面図及び正面断面図であり、１〜４は
上記従来のものと同一のものである。11は回路基板で、
プリント配線など回路配線（図示は略す）が施されてあ
り、両面に電子部品６が装着されている。この回路基板
11の周囲は枠体２のほぼ中央に配置した段部2a上に載せ
られて位置決め固定されていて、かつその上面前端部に
は端子基板12が固着されており、この端子基板上面には
多数の電極端子７が配設されてある。
上記回路基板11部を第３図に側面図で示す。回路基板11
に固着されて端子基板12の上面の多数の電極端子７は、
それぞれスルーホール13を介し回路基板11の回路配線
（図示は略す）に接続されている。このように、端子基
板12上面に電極端子７を配設したことにより、回路基板
11が電極端子面位置から下げられ、上部カバー３から間
隔があけられる。この間隔があけられた回路基板11上面
にも電子部品６を装着している。
〔発明の効果〕
以上のようにこの発明によれば、パッケージ枠体のほぼ
中央部に設けた段部に回路基板を載置することで、その
上下に空間を設けてこの上下両空間に夫々電子部品を装
着するようにしたので、回路基板の位置決め固定による
組立が容易になし得るとともに、電子部品の高密度実装
が簡単にでき、また、回路基板の前端部上面だけに、電
極端子を配設した端子基板を固着することで、電極端子
を枠体上面と同じレベルに配置することができるととも
に、外形が従来のものとほぼ同一内に収められるという
効果を有する。
【図面の簡単な説明】
第１図及び第２図はこの発明による半導体装置カードの
一実施例の平面図及び正面断面図、第３図は第１図の回
路基板部の側面図、第４図及び第５図は従来の半導体装
置カードの平面図及び正面断面図である。 １……パツケージ、２……枠体、３……上部カバー、４
……下部カバー、６……電子部品、７……電極端子、11
……回路基板、12……端子基板。 なお、図中同一符号は同一又は相当部分を示す。

Claims (2)

    【特許請求の範囲】
  1. 【請求項１】側周を囲う枠体の上下面にカバーを固定し
    たパッケージの上記枠体のほぼ中央部に段部を形成し
    て、この段部に、回路配線が施され、かつ両面に複数の
    電子部品が装着された回路基板を載置して固定するとと
    もに、上記回路基板の前端部の上面に端子基板を固着
    し、この端子基板の上面に多数の電極端子を配設したこ
    とを特徴とする半導体装置カード。
  2. 【請求項２】端子基板上面の電極端子をスルーホールを
    介し回路基板の回路配線に接続した特許請求の範囲第１
    項記載の半導体装置カード。
JP62079923A 1987-03-31 1987-03-31 半導体装置カ−ド Expired - Fee Related JPH0784115B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP62079923A JPH0784115B2 (ja) 1987-03-31 1987-03-31 半導体装置カ−ド
US07/174,955 US4905124A (en) 1987-03-31 1988-03-29 IC card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62079923A JPH0784115B2 (ja) 1987-03-31 1987-03-31 半導体装置カ−ド

Publications (2)

Publication Number Publication Date
JPS63242696A JPS63242696A (ja) 1988-10-07
JPH0784115B2 true JPH0784115B2 (ja) 1995-09-13

Family

ID=13703823

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62079923A Expired - Fee Related JPH0784115B2 (ja) 1987-03-31 1987-03-31 半導体装置カ−ド

Country Status (2)

Country Link
US (1) US4905124A (ja)
JP (1) JPH0784115B2 (ja)

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JPS6040587A (ja) * 1983-08-12 1985-03-02 Canon Inc メモリカ−ド
JPS61199051U (ja) * 1985-05-31 1986-12-12
JPS6298264U (ja) * 1985-12-11 1987-06-23

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JPS63242696A (ja) 1988-10-07
US4905124A (en) 1990-02-27

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