JPS6298264U - - Google Patents

Info

Publication number
JPS6298264U
JPS6298264U JP1985190421U JP19042185U JPS6298264U JP S6298264 U JPS6298264 U JP S6298264U JP 1985190421 U JP1985190421 U JP 1985190421U JP 19042185 U JP19042185 U JP 19042185U JP S6298264 U JPS6298264 U JP S6298264U
Authority
JP
Japan
Prior art keywords
electronic component
component mounting
leads
narrow
mounting lands
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985190421U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985190421U priority Critical patent/JPS6298264U/ja
Priority to US06/939,815 priority patent/US4772762A/en
Publication of JPS6298264U publication Critical patent/JPS6298264U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/097—Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09772—Conductors directly under a component but not electrically connected to the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の一実施例を示す平面図、第
２図は印刷配線板に装着された電子部品の一例を
示す側面図、第３図は従来の印刷配線板の一例を
示す側面図である。 図において１は印刷配線板、２は電子部品、３
は電子部品のリード、５，６は配線パターン、４
０は電子部品取付けランド。なお、各図中同一符
号は同一又は相当部分を示す。
補正 昭６１．９．４ 図面の簡単な説明を次のように補正する。 明細書第５頁第１７行目「側面図」とあるを「
平面図」と訂正する。 明細書第５頁第１９行目「４０」とあるを「４
，４０」と訂正する。

Claims (1)

  1. 【実用新案登録請求の範囲】 装着すべき電子部品のリードを半田付けする電
    子部品取付けランドを有する印刷配線板において
    、 電子部品のリードの間隔が狭し、したがつてこ
    れに対応する電子部品取付けランドの間隔が狭く
    、電子部品のリードに平行な方向には、ただ１本
    の配線パターンだけを電子部品取付けランド間に
    通すことができる電子部品取付けランドに対して
    は、互いに隣接する２個の電子部品取付けランド
    の間に、これに取付けられる電子部品のリードの
    方向に対し所定の角度を有する平行２線によつて
    定められる間隙が形成されるような電子部品取付
    けランドの形状とし、上記平行２線の間隔を少な
    くとも２本の配線パターンを通すことができる間
    隔としたことを特徴とする印刷配線板。
JP1985190421U 1985-12-11 1985-12-11 Pending JPS6298264U (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1985190421U JPS6298264U (ja) 1985-12-11 1985-12-11
US06/939,815 US4772762A (en) 1985-12-11 1986-12-09 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985190421U JPS6298264U (ja) 1985-12-11 1985-12-11

Publications (1)

Publication Number Publication Date
JPS6298264U true JPS6298264U (ja) 1987-06-23

Family

ID=16257854

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985190421U Pending JPS6298264U (ja) 1985-12-11 1985-12-11

Country Status (2)

Country Link
US (1) US4772762A (ja)
JP (1) JPS6298264U (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0784115B2 (ja) * 1987-03-31 1995-09-13 三菱電機株式会社 半導体装置カ−ド
JPH06224530A (ja) * 1993-01-27 1994-08-12 Nikon Corp プリント配線基板
US5307980A (en) * 1993-02-10 1994-05-03 Ford Motor Company Solder pad configuration for wave soldering
KR940023325A (ko) * 1993-03-11 1994-10-22 토모마쯔 켕고 땜납층을 프리코팅해서 사용되는 회로기판 및 땜납층이 프리코팅된 회로기판
US6162543A (en) * 1998-12-11 2000-12-19 Saint-Gobain Industrial Ceramics, Inc. High purity siliconized silicon carbide having high thermal shock resistance
US6111204A (en) * 1999-02-08 2000-08-29 Ford Motor Company Bond pads for fine-pitch applications on air bridge circuit boards
US10862232B2 (en) * 2018-08-02 2020-12-08 Dell Products L.P. Circuit board pad connector system

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3833838A (en) * 1972-11-13 1974-09-03 A Christiansen Electronic component mounting wafers for repeated connection in a variety of circuit designs
JPS5530822A (en) * 1978-08-25 1980-03-04 Fujitsu Ltd Printed board
EP0082216B1 (de) * 1981-12-23 1985-10-09 Ibm Deutschland Gmbh Mehrschichtiges, keramisches Substrat für integrierte Halbleiterschaltungen mit mehreren Metallisierungsebenen
US4548452A (en) * 1983-06-29 1985-10-22 International Business Machines Corporation High-density electrical contact pad pattern
US4527041A (en) * 1983-06-02 1985-07-02 Kazuo Kai Method of forming a wiring pattern on a wiring board
US4562513A (en) * 1984-05-21 1985-12-31 International Business Machines Corporation Process for forming a high density metallurgy system on a substrate and structure thereof

Also Published As

Publication number Publication date
US4772762A (en) 1988-09-20

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