JPS63242696A - 半導体装置カ−ド - Google Patents

半導体装置カ−ド

Info

Publication number
JPS63242696A
JPS63242696A JP62079923A JP7992387A JPS63242696A JP S63242696 A JPS63242696 A JP S63242696A JP 62079923 A JP62079923 A JP 62079923A JP 7992387 A JP7992387 A JP 7992387A JP S63242696 A JPS63242696 A JP S63242696A
Authority
JP
Japan
Prior art keywords
circuit board
semiconductor device
electronic components
device card
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62079923A
Other languages
English (en)
Other versions
JPH0784115B2 (ja
Inventor
番條　敏信
小野田　重雄
誠 大森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62079923A priority Critical patent/JPH0784115B2/ja
Priority to US07/174,955 priority patent/US4905124A/en
Publication of JPS63242696A publication Critical patent/JPS63242696A/ja
Publication of JPH0784115B2 publication Critical patent/JPH0784115B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、ゲームカードなどに用いられるＩＣカード
などの半導体装置カードに関し、特に電子部品の高密度
実装Ｋかかわる。
〔従来の技術〕
例えば、テレビゲーム用ソフトを内置したゲームカード
やマイコン用メモリカードなどに用いられる、従来の半
導体装置カードＣ以下「カード」と称する）は第４図及
び第５図に平面図及び正面断面図で示すようになってい
た。図において、ｌは半導体装置を収納したパッケージ
で、側周を囲う枠体２と、この枠体の上下に接合され閉
鎖する上部カバー３及び下部カバー４とからなる。これ
ら枠体２及びカバー３　、４Ｆ１合成樹脂材など絶縁材
からなっている。５はプリント配ｍｃ図示は略す）など
回路配線が施された回路基板で、下面に半導体素子や電
気回路部品などの電子部品６が装着されている。この回
路基板４は上面前部側多数の電極端子７が配設されてあ
り、パッケージ１に収納されている。
このように、電極端子７は回路基板５上面塔直接配設さ
れており、回路基板４は上部カバー３に近接していて、
電子部品６は［ｇｌ回路基板の下面に装着しである。
〔発明か解決しようとする問題点〕
上記のような従来の半導体装置カードでは、電子部品６
は回路基板５の下面にしか装着できず、高密度実装が低
下するという問題点があった。
この発明は、このような問題点を解決するためＫなされ
たもので、電子部品を回路基板に高密度実装し九半導体
装置カードを得ることを目的としている。
〔問題点を解決するための手段〕
この発明にかかる半導体装置カードは、回路基板の上面
前端部に端子基板を固着し、この端子基板上に電極端子
を配設し、回路基板の両面に電子部品を装着したもので
ある。
〔作用〕
この発明においては、回路基板の上面が上部カバーから
間隔があくことにより、電子部品が回路基板の上面にも
装着され、高密度実装が得られる。
〔実施例〕
第１図及び第２図はこの発明による半導体装置ある０１
１は回路基板で、プリント配線など回路配線（図示は略
す）が施されてあり、両面に電子部品６が装着されてい
る。この回路基板１１の上面前端部には端子基板１２が
固着されており、この端子基板上面には多数のｔ極端子
マが配設されである。
上記回路基板１１部を第３図に側面図で示す。
回路基板１１に固着′された端子基板１２の上面の多数
の電ｆｆｌ端子７は、それぞれスルー゛ホール１３を介
し回路基板１１０回路配線（図示は略す）に接続されて
いる。このように１端子基板１２上面に電極端子フを配
設したことＫより、回路基板１１が電極端子４面位置か
ら下げられ、上部カバー３から間隔があけられる。この
間隔があけられたＬｇＩｒｊｌ？基板１１上面にも電子
部品６を装着している。
〔発明の効果〕
以上のように、この発明によれば、上面に４極端子を配
設した端子基板を回路基板の上面前部側に固着し、電子
部品を回路基板の上、下面に装着したので、電子部品の
高密度実装ができ、大容量の半導体装置カードが得られ
、しかも、外形は従来のものとほぼ同−内に収められる
。
【図面の簡単な説明】
第１図及び第２図はこの発明による半導体装置カードの
一実施例の平面図及び正面断面図、第３図は第１図の回
路基板部の側面図、第４図及び第５図は従来の半導体装
置カードの平面図及び正面断面図である。 ｌ・・・パッケージ、２・・・枠体、３・・・上部カバ
ー、４・・・下部カバー、６・・・電子部品、フ・・・
電極端子、１１・・・回路基板、１２・・・端子基板。 なお、図中同一符号は同−又は相当部分を示す。

Claims (2)

    【特許請求の範囲】
  1. （１）回路配線が施された回路基板、上面に多数の電極
    端子が配設されており、上記回路基板の上面前端部に固
    着された端子基板、上記回路基板の両面に装着された複
    数の電子部品、及びこれら電子部品を装着した上記回路
    基板部を収納し、上記電極端子部を露出させたパツケー
    ジを備えた、半導体装置カード。
  2. （２）端子基板上面の電極端子をスルーホールを介し回
    路基板の回路配線に接続した特許請求の範囲第１項記載
    の半導体装置カード。
JP62079923A 1987-03-31 1987-03-31 半導体装置カ−ド Expired - Fee Related JPH0784115B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP62079923A JPH0784115B2 (ja) 1987-03-31 1987-03-31 半導体装置カ−ド
US07/174,955 US4905124A (en) 1987-03-31 1988-03-29 IC card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62079923A JPH0784115B2 (ja) 1987-03-31 1987-03-31 半導体装置カ−ド

Publications (2)

Publication Number Publication Date
JPS63242696A true JPS63242696A (ja) 1988-10-07
JPH0784115B2 JPH0784115B2 (ja) 1995-09-13

Family

ID=13703823

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62079923A Expired - Fee Related JPH0784115B2 (ja) 1987-03-31 1987-03-31 半導体装置カ−ド

Country Status (2)

Country Link
US (1) US4905124A (ja)
JP (1) JPH0784115B2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021086483A (ja) * 2019-11-29 2021-06-03 昌栄印刷株式会社 樹脂製カード媒体及びその製造方法

Families Citing this family (92)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2634284B2 (ja) * 1990-03-26 1997-07-23 三菱電機株式会社 半導体装置カード用フレームおよびこれを使用した半導体装置カード並びにその製造方法
US5153818A (en) * 1990-04-20 1992-10-06 Rohm Co., Ltd. Ic memory card with an anisotropic conductive rubber interconnector
US5053613A (en) * 1990-05-29 1991-10-01 Mitsubishi Denki Kabushiki Kaisha IC card
JPH0513967A (ja) * 1991-07-03 1993-01-22 Mitsubishi Electric Corp 半導体記憶制御装置及びその高密度実装方法
EP0532160B1 (en) * 1991-09-09 1998-09-16 ITT Manufacturing Enterprises, Inc. Card grounding system
JP2708666B2 (ja) * 1992-06-16 1998-02-04 三菱電機株式会社 Ｉｃカードおよびその製造方法
US5481434A (en) * 1993-10-04 1996-01-02 Molex Incorporated Memory card and frame for assembly therefor
US5526235A (en) * 1994-06-23 1996-06-11 Garmin Communication And Navigation Electronic storage device and receptacle
US5606704A (en) * 1994-10-26 1997-02-25 Intel Corporation Active power down for PC card I/O applications
JP2846301B2 (ja) 1997-06-11 1999-01-13 松下電器産業株式会社 メモリカード用アダプタカード
US6282097B1 (en) 1998-10-28 2001-08-28 Garmin Corporation Data card having a retractable handle
US6215671B1 (en) 1998-12-10 2001-04-10 Garmin Corporation Method and apparatus for connecting circuit boards
US6250553B1 (en) 1998-12-30 2001-06-26 Garmin Corporation Data card having a retractable handle
US6466862B1 (en) * 1999-04-19 2002-10-15 Bruce DeKock System for providing traffic information
US6632997B2 (en) 2001-06-13 2003-10-14 Amkor Technology, Inc. Personalized circuit module package and method for packaging circuit modules
US6930256B1 (en) 2002-05-01 2005-08-16 Amkor Technology, Inc. Integrated circuit substrate having laser-embedded conductive patterns and method therefor
US7334326B1 (en) 2001-06-19 2008-02-26 Amkor Technology, Inc. Method for making an integrated circuit substrate having embedded passive components
US6967124B1 (en) 2001-06-19 2005-11-22 Amkor Technology, Inc. Imprinted integrated circuit substrate and method for imprinting an integrated circuit substrate
US6570825B2 (en) 2001-08-21 2003-05-27 Amkor Technology, Inc. Method and circuit module package for automated switch actuator insertion
US6900527B1 (en) 2001-09-19 2005-05-31 Amkor Technology, Inc. Lead-frame method and assembly for interconnecting circuits within a circuit module
US20080169541A1 (en) * 2001-09-19 2008-07-17 Jeffrey Alan Miks Enhanced durability multimedia card
US7019387B1 (en) 2002-02-14 2006-03-28 Amkor Technology, Inc. Lead-frame connector and circuit module assembly
US9691635B1 (en) 2002-05-01 2017-06-27 Amkor Technology, Inc. Buildup dielectric layer having metallization pattern semiconductor package fabrication method
US7548430B1 (en) 2002-05-01 2009-06-16 Amkor Technology, Inc. Buildup dielectric and metallization process and semiconductor package
US7399661B2 (en) * 2002-05-01 2008-07-15 Amkor Technology, Inc. Method for making an integrated circuit substrate having embedded back-side access conductors and vias
US6930257B1 (en) 2002-05-01 2005-08-16 Amkor Technology, Inc. Integrated circuit substrate having laminated laser-embedded circuit layers
US7670962B2 (en) 2002-05-01 2010-03-02 Amkor Technology, Inc. Substrate having stiffener fabrication method
US7633765B1 (en) 2004-03-23 2009-12-15 Amkor Technology, Inc. Semiconductor package including a top-surface metal layer for implementing circuit features
US20080043447A1 (en) * 2002-05-01 2008-02-21 Amkor Technology, Inc. Semiconductor package having laser-embedded terminals
US6816032B1 (en) 2002-09-03 2004-11-09 Amkor Technology, Inc. Laminated low-profile dual filter module for telecommunications devices and method therefor
US6717822B1 (en) 2002-09-20 2004-04-06 Amkor Technology, Inc. Lead-frame method and circuit module assembly including edge stiffener
US6910635B1 (en) 2002-10-08 2005-06-28 Amkor Technology, Inc. Die down multi-media card and method of making same
US6798047B1 (en) 2002-12-26 2004-09-28 Amkor Technology, Inc. Pre-molded leadframe
US7095103B1 (en) 2003-05-01 2006-08-22 Amkor Technology, Inc. Leadframe based memory card
US6911718B1 (en) 2003-07-03 2005-06-28 Amkor Technology, Inc. Double downset double dambar suspended leadframe
US7102891B1 (en) 2003-07-23 2006-09-05 Amkor Technology, Inc. Circuit module having interconnects for connecting functioning and non-functioning add ons and method therefor
US7633763B1 (en) 2004-01-28 2009-12-15 Amkor Technology, Inc. Double mold memory card and its manufacturing method
US11081370B2 (en) 2004-03-23 2021-08-03 Amkor Technology Singapore Holding Pte. Ltd. Methods of manufacturing an encapsulated semiconductor device
US10811277B2 (en) 2004-03-23 2020-10-20 Amkor Technology, Inc. Encapsulated semiconductor package
US7556986B1 (en) 2004-04-21 2009-07-07 Amkor Technology, Inc. Tape supported memory card leadframe structure
US7074654B1 (en) 2004-04-21 2006-07-11 Amkor Technology, Inc. Tape supported memory card leadframe structure
US7145238B1 (en) 2004-05-05 2006-12-05 Amkor Technology, Inc. Semiconductor package and substrate having multi-level vias
US7170754B2 (en) * 2004-05-06 2007-01-30 Sychip Inc. SDIO memory and interface card
US7201327B1 (en) 2004-10-18 2007-04-10 Amkor Technology, Inc. Memory card and its manufacturing method
US7193305B1 (en) 2004-11-03 2007-03-20 Amkor Technology, Inc. Memory card ESC substrate insert
US7908080B2 (en) 2004-12-31 2011-03-15 Google Inc. Transportation routing
ITMI20050139A1 (it) * 2005-01-31 2006-08-01 St Microelectronics Srl Dispositivo di memorizzazione dati rimovibile e relativo metodo di assemblaggio
US7220915B1 (en) 2005-02-17 2007-05-22 Amkor Technology, Inc. Memory card and its manufacturing method
US7112875B1 (en) 2005-02-17 2006-09-26 Amkor Technology, Inc. Secure digital memory card using land grid array structure
US8826531B1 (en) 2005-04-05 2014-09-09 Amkor Technology, Inc. Method for making an integrated circuit substrate having laminated laser-embedded circuit layers
US20090021921A1 (en) * 2005-04-26 2009-01-22 Amkor Technology, Inc. Memory card and its manufacturing method
US7719845B1 (en) 2005-04-26 2010-05-18 Amkor Technology, Inc. Chamfered memory card module and method of making same
US7375975B1 (en) 2005-10-31 2008-05-20 Amkor Technology, Inc. Enhanced durability memory card
US7837120B1 (en) 2005-11-29 2010-11-23 Amkor Technology, Inc. Modular memory card and method of making same
US7359204B1 (en) 2006-02-15 2008-04-15 Amkor Technology, Inc. Multiple cover memory card
US20070270040A1 (en) * 2006-05-05 2007-11-22 Jang Sang J Chamfered Memory Card
US7589398B1 (en) 2006-10-04 2009-09-15 Amkor Technology, Inc. Embedded metal features structure
US7550857B1 (en) 2006-11-16 2009-06-23 Amkor Technology, Inc. Stacked redistribution layer (RDL) die assembly package
US7750250B1 (en) 2006-12-22 2010-07-06 Amkor Technology, Inc. Blind via capture pad structure
US7752752B1 (en) 2007-01-09 2010-07-13 Amkor Technology, Inc. Method of fabricating an embedded circuit pattern
US9367712B1 (en) 2007-03-01 2016-06-14 Amkor Technology, Inc. High density memory card using folded flex
US8323771B1 (en) 2007-08-15 2012-12-04 Amkor Technology, Inc. Straight conductor blind via capture pad structure and fabrication method
US8872329B1 (en) 2009-01-09 2014-10-28 Amkor Technology, Inc. Extended landing pad substrate package structure and method
US7960827B1 (en) 2009-04-09 2011-06-14 Amkor Technology, Inc. Thermal via heat spreader package and method
US8623753B1 (en) 2009-05-28 2014-01-07 Amkor Technology, Inc. Stackable protruding via package and method
US8222538B1 (en) 2009-06-12 2012-07-17 Amkor Technology, Inc. Stackable via package and method
US8471154B1 (en) 2009-08-06 2013-06-25 Amkor Technology, Inc. Stackable variable height via package and method
US8796561B1 (en) 2009-10-05 2014-08-05 Amkor Technology, Inc. Fan out build up substrate stackable package and method
US8937381B1 (en) 2009-12-03 2015-01-20 Amkor Technology, Inc. Thin stackable package and method
US9691734B1 (en) 2009-12-07 2017-06-27 Amkor Technology, Inc. Method of forming a plurality of electronic component packages
US8536462B1 (en) 2010-01-22 2013-09-17 Amkor Technology, Inc. Flex circuit package and method
US8300423B1 (en) 2010-05-25 2012-10-30 Amkor Technology, Inc. Stackable treated via package and method
US8294276B1 (en) 2010-05-27 2012-10-23 Amkor Technology, Inc. Semiconductor device and fabricating method thereof
US8338229B1 (en) 2010-07-30 2012-12-25 Amkor Technology, Inc. Stackable plasma cleaned via package and method
US8717775B1 (en) 2010-08-02 2014-05-06 Amkor Technology, Inc. Fingerprint sensor package and method
US8337657B1 (en) 2010-10-27 2012-12-25 Amkor Technology, Inc. Mechanical tape separation package and method
US8482134B1 (en) 2010-11-01 2013-07-09 Amkor Technology, Inc. Stackable package and method
US9748154B1 (en) 2010-11-04 2017-08-29 Amkor Technology, Inc. Wafer level fan out semiconductor device and manufacturing method thereof
US8525318B1 (en) 2010-11-10 2013-09-03 Amkor Technology, Inc. Semiconductor device and fabricating method thereof
US8557629B1 (en) 2010-12-03 2013-10-15 Amkor Technology, Inc. Semiconductor device having overlapped via apertures
US8535961B1 (en) 2010-12-09 2013-09-17 Amkor Technology, Inc. Light emitting diode (LED) package and method
US9721872B1 (en) 2011-02-18 2017-08-01 Amkor Technology, Inc. Methods and structures for increasing the allowable die size in TMV packages
US9013011B1 (en) 2011-03-11 2015-04-21 Amkor Technology, Inc. Stacked and staggered die MEMS package and method
KR101140113B1 (ko) 2011-04-26 2012-04-30 앰코 테크놀로지 코리아 주식회사 반도체 디바이스
US8653674B1 (en) 2011-09-15 2014-02-18 Amkor Technology, Inc. Electronic component package fabrication method and structure
US8633598B1 (en) 2011-09-20 2014-01-21 Amkor Technology, Inc. Underfill contacting stacking balls package fabrication method and structure
US9029962B1 (en) 2011-10-12 2015-05-12 Amkor Technology, Inc. Molded cavity substrate MEMS package fabrication method and structure
KR101366461B1 (ko) 2012-11-20 2014-02-26 앰코 테크놀로지 코리아 주식회사 반도체 디바이스 및 그 제조 방법
US9799592B2 (en) 2013-11-19 2017-10-24 Amkor Technology, Inc. Semicondutor device with through-silicon via-less deep wells
KR101488590B1 (ko) 2013-03-29 2015-01-30 앰코 테크놀로지 코리아 주식회사 반도체 디바이스 및 그 제조 방법
KR101607981B1 (ko) 2013-11-04 2016-03-31 앰코 테크놀로지 코리아 주식회사 반도체 패키지용 인터포저 및 이의 제조 방법, 제조된 인터포저를 이용한 반도체 패키지
US9960328B2 (en) 2016-09-06 2018-05-01 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6040587A (ja) * 1983-08-12 1985-03-02 Canon Inc メモリカ−ド
JPS61199051U (ja) * 1985-05-31 1986-12-12

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3529213A (en) * 1969-04-08 1970-09-15 North American Rockwell Extendable package for electronic assemblies
JPS57130842A (en) * 1981-02-06 1982-08-13 Nippon Denso Co Ltd Electronic system for mounting on vehicle
JPS58111166A (ja) * 1981-12-24 1983-07-02 Canon Inc Ｒｏｍパツク
JPS6298264U (ja) * 1985-12-11 1987-06-23

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6040587A (ja) * 1983-08-12 1985-03-02 Canon Inc メモリカ−ド
JPS61199051U (ja) * 1985-05-31 1986-12-12

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021086483A (ja) * 2019-11-29 2021-06-03 昌栄印刷株式会社 樹脂製カード媒体及びその製造方法

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JPH0784115B2 (ja) 1995-09-13

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