JPH07297265A - 静電チャック - Google Patents

静電チャック

Info

Publication number
JPH07297265A
JPH07297265A JP8839094A JP8839094A JPH07297265A JP H07297265 A JPH07297265 A JP H07297265A JP 8839094 A JP8839094 A JP 8839094A JP 8839094 A JP8839094 A JP 8839094A JP H07297265 A JPH07297265 A JP H07297265A
Authority
JP
Japan
Prior art keywords
electrostatic chuck
dielectric layer
electrode
oxide
flatness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8839094A
Other languages
English (en)
Japanese (ja)
Inventor
Hiroshi Mogi
弘 茂木
Kenichi Arai
健一 新井
Shinji Kojima
伸次 小嶋
Yoshihiro Kubota
芳宏 久保田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP8839094A priority Critical patent/JPH07297265A/ja
Priority to TW083110217A priority patent/TW287314B/zh
Priority to KR1019950001027A priority patent/KR950034652A/ko
Publication of JPH07297265A publication Critical patent/JPH07297265A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
JP8839094A 1994-04-26 1994-04-26 静電チャック Pending JPH07297265A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP8839094A JPH07297265A (ja) 1994-04-26 1994-04-26 静電チャック
TW083110217A TW287314B (sv) 1994-04-26 1994-11-04
KR1019950001027A KR950034652A (ko) 1994-04-26 1995-01-21 정전척

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8839094A JPH07297265A (ja) 1994-04-26 1994-04-26 静電チャック

Publications (1)

Publication Number Publication Date
JPH07297265A true JPH07297265A (ja) 1995-11-10

Family

ID=13941474

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8839094A Pending JPH07297265A (ja) 1994-04-26 1994-04-26 静電チャック

Country Status (3)

Country Link
JP (1) JPH07297265A (sv)
KR (1) KR950034652A (sv)
TW (1) TW287314B (sv)

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09260474A (ja) * 1996-03-22 1997-10-03 Sony Corp 静電チャックおよびウエハステージ
EP0863544A2 (en) * 1997-03-06 1998-09-09 Ngk Insulators, Ltd. Substrate for use in wafer attracting apparatus and manufacturing method thereof
JPH11209182A (ja) * 1998-01-22 1999-08-03 Sumitomo Metal Ind Ltd プラズマ耐食部材
JPH11214491A (ja) * 1998-01-22 1999-08-06 Toshiba Ceramics Co Ltd ウエハ保持装置及びその製造方法
WO1999059201A1 (en) * 1998-05-11 1999-11-18 Applied Materials Inc Polished ceramic chuck for low backside particles in semiconductor plasma processing
WO2001013423A1 (fr) * 1999-08-10 2001-02-22 Ibiden Co., Ltd. Plaque ceramique pour dispositif de production de semi-conducteurs
WO2001054188A1 (fr) * 2000-01-21 2001-07-26 Tocalo Co., Ltd. Element support electrostatique et procede de production associe
US6342754B1 (en) 1996-12-27 2002-01-29 Canon Kabushiki Kaisha Charge-reducing film, image forming apparatus including said film and method of manufacturing said image forming apparatus
JP2002057207A (ja) * 2000-01-20 2002-02-22 Sumitomo Electric Ind Ltd 半導体製造装置用ウェハ保持体およびその製造方法ならびに半導体製造装置
KR20020064508A (ko) * 2001-02-02 2002-08-09 삼성전자 주식회사 정전 척
US6730276B2 (en) 2000-07-24 2004-05-04 Sumitomo Osaka Cement Co., Ltd. Plastic film electrostatic adsorption apparatus and electrostatic adsorption method
WO2005034233A1 (en) * 2003-10-09 2005-04-14 Snt Co., Ltd Electro-static chuck with non-sintered aln and a method of preparing the same
JP2005191581A (ja) * 2000-01-20 2005-07-14 Sumitomo Electric Ind Ltd 半導体製造装置用ウェハ保持体およびその製造方法ならびに半導体製造装置
EP1387392A3 (de) * 2002-07-15 2005-09-07 Integrated Dynamics Engineering Elektrostatischer Greifer und Verfahren zu dessen Herstellung
JP2007150351A (ja) * 2007-02-15 2007-06-14 Toto Ltd 静電チャック
US7615133B2 (en) 2001-12-04 2009-11-10 Toto Ltd. Electrostatic chuck module and cooling system
JP2010118551A (ja) * 2008-11-13 2010-05-27 Tokyo Electron Ltd 静電チャック及び基板処理装置
JP2010166086A (ja) * 2010-04-12 2010-07-29 Fujitsu Semiconductor Ltd 静電チャックを用いた半導体製造装置
JP2010177698A (ja) * 2010-04-12 2010-08-12 Fujitsu Semiconductor Ltd 静電チャックの製造方法
KR20140116015A (ko) 2013-03-22 2014-10-01 엔지케이 인슐레이터 엘티디 세라믹스 부재 및 반도체 제조 장치용 부재
WO2015080135A1 (ja) * 2013-11-29 2015-06-04 株式会社東芝 プラズマ装置用部品及びその製造方法
KR20170036740A (ko) 2014-09-16 2017-04-03 엔지케이 인슐레이터 엘티디 세라믹 구조체, 기판 유지 장치용 부재 및 세라믹 구조체의 제법
WO2019163757A1 (ja) * 2018-02-20 2019-08-29 住友大阪セメント株式会社 静電チャック装置および静電チャック装置の製造方法
JPWO2020261992A1 (sv) * 2019-06-28 2020-12-30
JPWO2022014410A1 (sv) * 2020-07-13 2022-01-20

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI254403B (en) 2000-05-19 2006-05-01 Ngk Insulators Ltd Electrostatic clamper, and electrostatic attracting structures
JP3808286B2 (ja) * 2000-06-07 2006-08-09 住友大阪セメント株式会社 静電チャック

Cited By (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09260474A (ja) * 1996-03-22 1997-10-03 Sony Corp 静電チャックおよびウエハステージ
US6342754B1 (en) 1996-12-27 2002-01-29 Canon Kabushiki Kaisha Charge-reducing film, image forming apparatus including said film and method of manufacturing said image forming apparatus
EP0863544A3 (en) * 1997-03-06 2000-01-05 Ngk Insulators, Ltd. Substrate for use in wafer attracting apparatus and manufacturing method thereof
US6491571B1 (en) 1997-03-06 2002-12-10 Ngk Insulators, Ltd. Substrate for use in wafer attracting apparatus and manufacturing method thereof
US6166432A (en) * 1997-03-06 2000-12-26 Ngk Insulators, Ltd. Substrate for use in wafer attracting apparatus and manufacturing method thereof
EP0863544A2 (en) * 1997-03-06 1998-09-09 Ngk Insulators, Ltd. Substrate for use in wafer attracting apparatus and manufacturing method thereof
JPH11209182A (ja) * 1998-01-22 1999-08-03 Sumitomo Metal Ind Ltd プラズマ耐食部材
JPH11214491A (ja) * 1998-01-22 1999-08-06 Toshiba Ceramics Co Ltd ウエハ保持装置及びその製造方法
WO1999059201A1 (en) * 1998-05-11 1999-11-18 Applied Materials Inc Polished ceramic chuck for low backside particles in semiconductor plasma processing
US7084376B2 (en) 1999-08-10 2006-08-01 Ibiden Co., Ltd. Semiconductor production device ceramic plate
WO2001013423A1 (fr) * 1999-08-10 2001-02-22 Ibiden Co., Ltd. Plaque ceramique pour dispositif de production de semi-conducteurs
US6717116B1 (en) 1999-08-10 2004-04-06 Ibiden Co., Ltd. Semiconductor production device ceramic plate
JP2002057207A (ja) * 2000-01-20 2002-02-22 Sumitomo Electric Ind Ltd 半導体製造装置用ウェハ保持体およびその製造方法ならびに半導体製造装置
JP4529690B2 (ja) * 2000-01-20 2010-08-25 住友電気工業株式会社 半導体製造装置用ウェハ保持体およびその製造方法ならびに半導体製造装置
JP2005191581A (ja) * 2000-01-20 2005-07-14 Sumitomo Electric Ind Ltd 半導体製造装置用ウェハ保持体およびその製造方法ならびに半導体製造装置
JP2001203258A (ja) * 2000-01-21 2001-07-27 Tocalo Co Ltd 静電チャック部材およびその製造方法
US6771483B2 (en) 2000-01-21 2004-08-03 Tocalo Co., Ltd. Electrostatic chuck member and method of producing the same
WO2001054188A1 (fr) * 2000-01-21 2001-07-26 Tocalo Co., Ltd. Element support electrostatique et procede de production associe
US6730276B2 (en) 2000-07-24 2004-05-04 Sumitomo Osaka Cement Co., Ltd. Plastic film electrostatic adsorption apparatus and electrostatic adsorption method
KR20020064508A (ko) * 2001-02-02 2002-08-09 삼성전자 주식회사 정전 척
US7615133B2 (en) 2001-12-04 2009-11-10 Toto Ltd. Electrostatic chuck module and cooling system
EP1387392A3 (de) * 2002-07-15 2005-09-07 Integrated Dynamics Engineering Elektrostatischer Greifer und Verfahren zu dessen Herstellung
WO2005034233A1 (en) * 2003-10-09 2005-04-14 Snt Co., Ltd Electro-static chuck with non-sintered aln and a method of preparing the same
JP2007150351A (ja) * 2007-02-15 2007-06-14 Toto Ltd 静電チャック
JP2010118551A (ja) * 2008-11-13 2010-05-27 Tokyo Electron Ltd 静電チャック及び基板処理装置
JP2010166086A (ja) * 2010-04-12 2010-07-29 Fujitsu Semiconductor Ltd 静電チャックを用いた半導体製造装置
JP2010177698A (ja) * 2010-04-12 2010-08-12 Fujitsu Semiconductor Ltd 静電チャックの製造方法
US9177847B2 (en) 2013-03-22 2015-11-03 Ngk Insulators, Ltd. Ceramic member and member for semiconductor manufacturing equipment
KR20140116015A (ko) 2013-03-22 2014-10-01 엔지케이 인슐레이터 엘티디 세라믹스 부재 및 반도체 제조 장치용 부재
US10100413B2 (en) 2013-11-29 2018-10-16 Kabushiki Kaisha Toshiba Component for plasma apparatus and method of manufacturing the same
WO2015080135A1 (ja) * 2013-11-29 2015-06-04 株式会社東芝 プラズマ装置用部品及びその製造方法
JPWO2015080135A1 (ja) * 2013-11-29 2017-03-16 株式会社東芝 プラズマ装置用部品及びその製造方法
CN105793467A (zh) * 2013-11-29 2016-07-20 株式会社东芝 等离子体装置用部件及其制造方法
US11011404B2 (en) 2014-09-16 2021-05-18 Ngk Insulators, Ltd. Ceramic structure, member for substrate-holding apparatus, and method for producing the ceramic structure
KR20170036740A (ko) 2014-09-16 2017-04-03 엔지케이 인슐레이터 엘티디 세라믹 구조체, 기판 유지 장치용 부재 및 세라믹 구조체의 제법
WO2019163757A1 (ja) * 2018-02-20 2019-08-29 住友大阪セメント株式会社 静電チャック装置および静電チャック装置の製造方法
CN111684574A (zh) * 2018-02-20 2020-09-18 住友大阪水泥股份有限公司 静电卡盘装置及静电卡盘装置的制造方法
KR20200121801A (ko) * 2018-02-20 2020-10-26 스미토모 오사카 세멘토 가부시키가이샤 정전 척 장치 및 정전 척 장치의 제조 방법
JPWO2019163757A1 (ja) * 2018-02-20 2021-02-04 住友大阪セメント株式会社 静電チャック装置および静電チャック装置の製造方法
CN111684574B (zh) * 2018-02-20 2023-09-05 住友大阪水泥股份有限公司 静电卡盘装置及静电卡盘装置的制造方法
US11848223B2 (en) 2018-02-20 2023-12-19 Sumitomo Osaka Cement Co., Ltd. Electrostatic chuck device and method for producing electrostatic chuck device
JPWO2020261992A1 (sv) * 2019-06-28 2020-12-30
US11948825B2 (en) 2019-06-28 2024-04-02 Ngk Insulators, Ltd. Wafer placement table
JPWO2022014410A1 (sv) * 2020-07-13 2022-01-20
WO2022014410A1 (ja) * 2020-07-13 2022-01-20 京セラ株式会社 試料保持具

Also Published As

Publication number Publication date
TW287314B (sv) 1996-10-01
KR950034652A (ko) 1995-12-28

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