JPH06204277A - ワイヤボンディングの方法およびそれにより作られた集積回路デバイス - Google Patents

ワイヤボンディングの方法およびそれにより作られた集積回路デバイス

Info

Publication number
JPH06204277A
JPH06204277A JP5226045A JP22604593A JPH06204277A JP H06204277 A JPH06204277 A JP H06204277A JP 5226045 A JP5226045 A JP 5226045A JP 22604593 A JP22604593 A JP 22604593A JP H06204277 A JPH06204277 A JP H06204277A
Authority
JP
Japan
Prior art keywords
bonding
active circuit
layer
wire
polyimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5226045A
Other languages
English (en)
Japanese (ja)
Inventor
G Heinen Catherine
ジー．ヘイネン キャサリン
Roger J Stierman
ジェイ．スティアーマン ロジャー
C Alphalo Raffaele
シー．アルファロ ラファエル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of JPH06204277A publication Critical patent/JPH06204277A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/019—Manufacture or treatment of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H10W72/9232—Bond pads having multiple stacked layers with additional elements interposed between layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
JP5226045A 1992-09-10 1993-09-10 ワイヤボンディングの方法およびそれにより作られた集積回路デバイス Pending JPH06204277A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US94308792A 1992-09-10 1992-09-10
US943087 1997-10-02

Publications (1)

Publication Number Publication Date
JPH06204277A true JPH06204277A (ja) 1994-07-22

Family

ID=25479083

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5226045A Pending JPH06204277A (ja) 1992-09-10 1993-09-10 ワイヤボンディングの方法およびそれにより作られた集積回路デバイス

Country Status (7)

Country Link
EP (1) EP0587442B1 (enExample)
JP (1) JPH06204277A (enExample)
KR (1) KR100335591B1 (enExample)
DE (1) DE69323515T2 (enExample)
MY (1) MY110904A (enExample)
SG (1) SG47534A1 (enExample)
TW (1) TW253987B (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005088702A1 (ja) * 2004-03-16 2005-09-22 Matsushita Electric Industrial Co., Ltd. 半導体装置
JP2012521082A (ja) * 2009-03-20 2012-09-10 ミクロガン ゲーエムベーハー 垂直接触電子部品及びその製造方法
JP2015204393A (ja) * 2014-04-15 2015-11-16 サンケン電気株式会社 半導体装置
CN108091628A (zh) * 2016-11-22 2018-05-29 株式会社村田制作所 半导体装置

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3420435B2 (ja) 1996-07-09 2003-06-23 松下電器産業株式会社 基板の製造方法、半導体装置及び半導体装置の製造方法
TW445616B (en) 1998-12-04 2001-07-11 Koninkl Philips Electronics Nv An integrated circuit device
US8021976B2 (en) 2002-10-15 2011-09-20 Megica Corporation Method of wire bonding over active area of a semiconductor circuit
US6503820B1 (en) 1999-10-04 2003-01-07 Koninklijke Philips Electronics N.V. Die pad crack absorption system and method for integrated circuit chip fabrication
DE10200932A1 (de) * 2002-01-12 2003-07-24 Philips Intellectual Property Diskretes Halbleiterbauelement
DE10242325A1 (de) * 2002-09-12 2004-04-01 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Halbleiter mit Isolierschicht und Verfahren zu dessen Herstellung
DE10245867A1 (de) * 2002-09-30 2004-04-15 Siced Electronics Development Gmbh & Co. Kg Leistungs-Halbleiterbauelement mit verbesserten Anschlusskontakten und Verfahren zu dessen Herstellung
JP4696532B2 (ja) 2004-05-20 2011-06-08 株式会社デンソー パワー複合集積型半導体装置およびその製造方法
JP4674522B2 (ja) 2004-11-11 2011-04-20 株式会社デンソー 半導体装置
DE102006003930A1 (de) * 2006-01-26 2007-08-09 Infineon Technologies Austria Ag Leistungshalbleiterelement mit internen Bonddrahtverbindungen zu einem Bauelementsubstrat und Verfahren zur Herstellung desselben
US10663175B2 (en) 2017-05-30 2020-05-26 Samsung Electronics Co., Ltd. Home appliance

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51118965A (en) * 1976-02-23 1976-10-19 Hitachi Ltd Insulation film of semiconductor device
JPH01103867A (ja) * 1987-10-16 1989-04-20 Sanyo Electric Co Ltd トランジスタ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4017886A (en) * 1972-10-18 1977-04-12 Hitachi, Ltd. Discrete semiconductor device having polymer resin as insulator and method for making the same
US4723197A (en) * 1985-12-16 1988-02-02 National Semiconductor Corporation Bonding pad interconnection structure
JP2559602B2 (ja) * 1987-11-30 1996-12-04 超音波工業株式会社 ワイヤボンダ用超音波振動子
JP2593965B2 (ja) * 1991-01-29 1997-03-26 三菱電機株式会社 半導体装置
US5201454A (en) * 1991-09-30 1993-04-13 Texas Instruments Incorporated Process for enhanced intermetallic growth in IC interconnections

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51118965A (en) * 1976-02-23 1976-10-19 Hitachi Ltd Insulation film of semiconductor device
JPH01103867A (ja) * 1987-10-16 1989-04-20 Sanyo Electric Co Ltd トランジスタ

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005088702A1 (ja) * 2004-03-16 2005-09-22 Matsushita Electric Industrial Co., Ltd. 半導体装置
US7777223B2 (en) 2004-03-16 2010-08-17 Pansonic Corporation Semiconductor device
US8304857B2 (en) 2004-03-16 2012-11-06 Panasonic Corporation Semiconductor device
JP2012521082A (ja) * 2009-03-20 2012-09-10 ミクロガン ゲーエムベーハー 垂直接触電子部品及びその製造方法
JP2015204393A (ja) * 2014-04-15 2015-11-16 サンケン電気株式会社 半導体装置
CN108091628A (zh) * 2016-11-22 2018-05-29 株式会社村田制作所 半导体装置
JP2018085413A (ja) * 2016-11-22 2018-05-31 株式会社村田製作所 半導体装置

Also Published As

Publication number Publication date
SG47534A1 (en) 1998-04-17
EP0587442A3 (enExample) 1994-08-03
EP0587442A2 (en) 1994-03-16
EP0587442B1 (en) 1999-02-17
DE69323515D1 (de) 1999-03-25
DE69323515T2 (de) 1999-06-17
KR100335591B1 (ko) 2002-08-24
MY110904A (en) 1999-06-30
TW253987B (enExample) 1995-08-11
KR940008033A (ko) 1994-04-28

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