TW253987B - - Google Patents
Info
- Publication number
- TW253987B TW253987B TW083103530A TW83103530A TW253987B TW 253987 B TW253987 B TW 253987B TW 083103530 A TW083103530 A TW 083103530A TW 83103530 A TW83103530 A TW 83103530A TW 253987 B TW253987 B TW 253987B
- Authority
- TW
- Taiwan
Links
Classifications
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- H10W72/071—
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- H10W72/019—
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- H10W70/60—
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- H10W72/0711—
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- H10W72/07533—
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- H10W72/07541—
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- H10W72/536—
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- H10W72/552—
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- H10W72/5522—
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- H10W72/59—
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- H10W72/9232—
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- H10W72/952—
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- H10W74/00—
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US94308792A | 1992-09-10 | 1992-09-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW253987B true TW253987B (enExample) | 1995-08-11 |
Family
ID=25479083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW083103530A TW253987B (enExample) | 1992-09-10 | 1994-04-21 |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP0587442B1 (enExample) |
| JP (1) | JPH06204277A (enExample) |
| KR (1) | KR100335591B1 (enExample) |
| DE (1) | DE69323515T2 (enExample) |
| MY (1) | MY110904A (enExample) |
| SG (1) | SG47534A1 (enExample) |
| TW (1) | TW253987B (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3420435B2 (ja) | 1996-07-09 | 2003-06-23 | 松下電器産業株式会社 | 基板の製造方法、半導体装置及び半導体装置の製造方法 |
| TW445616B (en) | 1998-12-04 | 2001-07-11 | Koninkl Philips Electronics Nv | An integrated circuit device |
| US8021976B2 (en) | 2002-10-15 | 2011-09-20 | Megica Corporation | Method of wire bonding over active area of a semiconductor circuit |
| US6503820B1 (en) * | 1999-10-04 | 2003-01-07 | Koninklijke Philips Electronics N.V. | Die pad crack absorption system and method for integrated circuit chip fabrication |
| DE10200932A1 (de) * | 2002-01-12 | 2003-07-24 | Philips Intellectual Property | Diskretes Halbleiterbauelement |
| DE10242325A1 (de) * | 2002-09-12 | 2004-04-01 | eupec Europäische Gesellschaft für Leistungshalbleiter mbH | Halbleiter mit Isolierschicht und Verfahren zu dessen Herstellung |
| DE10245867A1 (de) * | 2002-09-30 | 2004-04-15 | Siced Electronics Development Gmbh & Co. Kg | Leistungs-Halbleiterbauelement mit verbesserten Anschlusskontakten und Verfahren zu dessen Herstellung |
| US7777223B2 (en) * | 2004-03-16 | 2010-08-17 | Pansonic Corporation | Semiconductor device |
| JP4696532B2 (ja) | 2004-05-20 | 2011-06-08 | 株式会社デンソー | パワー複合集積型半導体装置およびその製造方法 |
| JP4674522B2 (ja) | 2004-11-11 | 2011-04-20 | 株式会社デンソー | 半導体装置 |
| DE102006003930A1 (de) * | 2006-01-26 | 2007-08-09 | Infineon Technologies Austria Ag | Leistungshalbleiterelement mit internen Bonddrahtverbindungen zu einem Bauelementsubstrat und Verfahren zur Herstellung desselben |
| JP5732035B2 (ja) * | 2009-03-20 | 2015-06-10 | ミクロガン ゲーエムベーハー | 垂直接触電子部品及びその製造方法 |
| JP2015204393A (ja) * | 2014-04-15 | 2015-11-16 | サンケン電気株式会社 | 半導体装置 |
| JP6690509B2 (ja) * | 2016-11-22 | 2020-04-28 | 株式会社村田製作所 | 半導体装置 |
| US10663175B2 (en) | 2017-05-30 | 2020-05-26 | Samsung Electronics Co., Ltd. | Home appliance |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4017886A (en) * | 1972-10-18 | 1977-04-12 | Hitachi, Ltd. | Discrete semiconductor device having polymer resin as insulator and method for making the same |
| JPS51118965A (en) * | 1976-02-23 | 1976-10-19 | Hitachi Ltd | Insulation film of semiconductor device |
| US4723197A (en) * | 1985-12-16 | 1988-02-02 | National Semiconductor Corporation | Bonding pad interconnection structure |
| JPH01103867A (ja) * | 1987-10-16 | 1989-04-20 | Sanyo Electric Co Ltd | トランジスタ |
| JP2559602B2 (ja) * | 1987-11-30 | 1996-12-04 | 超音波工業株式会社 | ワイヤボンダ用超音波振動子 |
| JP2593965B2 (ja) * | 1991-01-29 | 1997-03-26 | 三菱電機株式会社 | 半導体装置 |
| US5201454A (en) * | 1991-09-30 | 1993-04-13 | Texas Instruments Incorporated | Process for enhanced intermetallic growth in IC interconnections |
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1993
- 1993-09-09 KR KR1019930018082A patent/KR100335591B1/ko not_active Expired - Lifetime
- 1993-09-10 JP JP5226045A patent/JPH06204277A/ja active Pending
- 1993-09-10 DE DE69323515T patent/DE69323515T2/de not_active Expired - Fee Related
- 1993-09-10 SG SG1996002685A patent/SG47534A1/en unknown
- 1993-09-10 MY MYPI93001860A patent/MY110904A/en unknown
- 1993-09-10 EP EP93307165A patent/EP0587442B1/en not_active Expired - Lifetime
-
1994
- 1994-04-21 TW TW083103530A patent/TW253987B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| EP0587442A2 (en) | 1994-03-16 |
| KR940008033A (ko) | 1994-04-28 |
| EP0587442A3 (enExample) | 1994-08-03 |
| EP0587442B1 (en) | 1999-02-17 |
| KR100335591B1 (ko) | 2002-08-24 |
| JPH06204277A (ja) | 1994-07-22 |
| DE69323515D1 (de) | 1999-03-25 |
| DE69323515T2 (de) | 1999-06-17 |
| SG47534A1 (en) | 1998-04-17 |
| MY110904A (en) | 1999-06-30 |