JPH0345542B2 - - Google Patents

Info

Publication number
JPH0345542B2
JPH0345542B2 JP57132553A JP13255382A JPH0345542B2 JP H0345542 B2 JPH0345542 B2 JP H0345542B2 JP 57132553 A JP57132553 A JP 57132553A JP 13255382 A JP13255382 A JP 13255382A JP H0345542 B2 JPH0345542 B2 JP H0345542B2
Authority
JP
Japan
Prior art keywords
chip
semiconductor
resin
stage
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57132553A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5922349A (ja
Inventor
Junichi Kasai
Rikio Sugiura
Akihiro Kubota
Toshuki Yoda
Katsushi Yoshitoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP57132553A priority Critical patent/JPS5922349A/ja
Publication of JPS5922349A publication Critical patent/JPS5922349A/ja
Publication of JPH0345542B2 publication Critical patent/JPH0345542B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/121—
    • H10W70/435—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/5449—
    • H10W72/884—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP57132553A 1982-07-29 1982-07-29 半導体装置 Granted JPS5922349A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57132553A JPS5922349A (ja) 1982-07-29 1982-07-29 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57132553A JPS5922349A (ja) 1982-07-29 1982-07-29 半導体装置

Publications (2)

Publication Number Publication Date
JPS5922349A JPS5922349A (ja) 1984-02-04
JPH0345542B2 true JPH0345542B2 (enExample) 1991-07-11

Family

ID=15083973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57132553A Granted JPS5922349A (ja) 1982-07-29 1982-07-29 半導体装置

Country Status (1)

Country Link
JP (1) JPS5922349A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4777520A (en) * 1986-03-27 1988-10-11 Oki Electric Industry Co. Ltd. Heat-resistant plastic semiconductor device
JPS63293955A (ja) * 1987-05-27 1988-11-30 Hitachi Ltd 樹脂封止型半導体装置
US5313102A (en) * 1989-12-22 1994-05-17 Texas Instruments Incorporated Integrated circuit device having a polyimide moisture barrier coating
KR100234824B1 (ko) * 1991-03-20 1999-12-15 윌리엄 비. 켐플러 반도체 장치
JPH08195169A (ja) * 1995-01-18 1996-07-30 Mitsubishi Electric Corp カラー陰極線管の蛍光面の形成方法及びカラー陰極線管の蛍光面形成用露光機
US11443958B2 (en) 2019-12-02 2022-09-13 Stmicroelectronics S.R.L. Semiconductor device and corresponding method

Also Published As

Publication number Publication date
JPS5922349A (ja) 1984-02-04

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