JPS5922349A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5922349A
JPS5922349A JP57132553A JP13255382A JPS5922349A JP S5922349 A JPS5922349 A JP S5922349A JP 57132553 A JP57132553 A JP 57132553A JP 13255382 A JP13255382 A JP 13255382A JP S5922349 A JPS5922349 A JP S5922349A
Authority
JP
Japan
Prior art keywords
resin
chip
semiconductor
film
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57132553A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0345542B2 (enExample
Inventor
Junichi Kasai
純一 河西
Rikio Sugiura
杉浦　力夫
Akihiro Kubota
昭弘 窪田
Toshiyuki Yoda
敏幸 誉田
Katsushi Yoshitoshi
吉利　勝志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP57132553A priority Critical patent/JPS5922349A/ja
Publication of JPS5922349A publication Critical patent/JPS5922349A/ja
Publication of JPH0345542B2 publication Critical patent/JPH0345542B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/435—Shapes or dispositions of insulating layers on leadframes, e.g. bridging members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP57132553A 1982-07-29 1982-07-29 半導体装置 Granted JPS5922349A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57132553A JPS5922349A (ja) 1982-07-29 1982-07-29 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57132553A JPS5922349A (ja) 1982-07-29 1982-07-29 半導体装置

Publications (2)

Publication Number Publication Date
JPS5922349A true JPS5922349A (ja) 1984-02-04
JPH0345542B2 JPH0345542B2 (enExample) 1991-07-11

Family

ID=15083973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57132553A Granted JPS5922349A (ja) 1982-07-29 1982-07-29 半導体装置

Country Status (1)

Country Link
JP (1) JPS5922349A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4777520A (en) * 1986-03-27 1988-10-11 Oki Electric Industry Co. Ltd. Heat-resistant plastic semiconductor device
JPS63293955A (ja) * 1987-05-27 1988-11-30 Hitachi Ltd 樹脂封止型半導体装置
EP0433695A3 (en) * 1989-12-22 1991-10-02 Texas Instruments Incorporated Integrated circuit device and method to prevent cracking during surface mount
EP0504821A3 (en) * 1991-03-20 1994-11-02 Hitachi Ltd Packaged semiconductor device having stress absorbing film
US5725977A (en) * 1995-01-18 1998-03-10 Mitsubishi Denki Kabushiki Kaisha Method of forming fluorescent screen for color cathode-ray tube and exposure system for forming same
US11443958B2 (en) 2019-12-02 2022-09-13 Stmicroelectronics S.R.L. Semiconductor device and corresponding method

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4777520A (en) * 1986-03-27 1988-10-11 Oki Electric Industry Co. Ltd. Heat-resistant plastic semiconductor device
JPS63293955A (ja) * 1987-05-27 1988-11-30 Hitachi Ltd 樹脂封止型半導体装置
EP0433695A3 (en) * 1989-12-22 1991-10-02 Texas Instruments Incorporated Integrated circuit device and method to prevent cracking during surface mount
EP0504821A3 (en) * 1991-03-20 1994-11-02 Hitachi Ltd Packaged semiconductor device having stress absorbing film
US5406028A (en) * 1991-03-20 1995-04-11 Hitachi, Ltd. Packaged semiconductor device having stress absorbing film
US5725977A (en) * 1995-01-18 1998-03-10 Mitsubishi Denki Kabushiki Kaisha Method of forming fluorescent screen for color cathode-ray tube and exposure system for forming same
US11443958B2 (en) 2019-12-02 2022-09-13 Stmicroelectronics S.R.L. Semiconductor device and corresponding method
US12148628B2 (en) 2019-12-02 2024-11-19 Stmicroelectronics S.R.L. Semiconductor device and corresponding method

Also Published As

Publication number Publication date
JPH0345542B2 (enExample) 1991-07-11

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