JPH0577284B2 - - Google Patents

Info

Publication number
JPH0577284B2
JPH0577284B2 JP8743744A JP4374487A JPH0577284B2 JP H0577284 B2 JPH0577284 B2 JP H0577284B2 JP 8743744 A JP8743744 A JP 8743744A JP 4374487 A JP4374487 A JP 4374487A JP H0577284 B2 JPH0577284 B2 JP H0577284B2
Authority
JP
Japan
Prior art keywords
wafer
adhesive
water
adhesive sheet
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP8743744A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63153814A (ja
Inventor
Kazuyoshi Ebe
Hiroaki Narita
Katsuhisa Taguchi
Yoshitaka Akeda
Takanori Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Priority to MYPI87000930A priority Critical patent/MY102454A/en
Priority to KR1019870007148A priority patent/KR910002826B1/ko
Priority to EP87306075A priority patent/EP0252739B1/en
Priority to DE87306075T priority patent/DE3787680T2/de
Publication of JPS63153814A publication Critical patent/JPS63153814A/ja
Priority to MYPI91001866A priority patent/MY109333A/en
Publication of JPH0577284B2 publication Critical patent/JPH0577284B2/ja
Priority to SG23494A priority patent/SG23494G/en
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP62043744A 1986-07-09 1987-02-26 ウエハ貼着用粘着シ−ト Granted JPS63153814A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
MYPI87000930A MY102454A (en) 1986-07-09 1987-07-02 Adhesive sheets for sticking wafers thereto
KR1019870007148A KR910002826B1 (ko) 1986-07-09 1987-07-04 웨이퍼 접착용 시이트
EP87306075A EP0252739B1 (en) 1986-07-09 1987-07-09 Adhesive sheets for sticking wafers thereto
DE87306075T DE3787680T2 (de) 1986-07-09 1987-07-09 Klebestreifen zum Kleben von Plättchen.
MYPI91001866A MY109333A (en) 1986-07-09 1991-10-12 Adhesive sheets for sticking wafers thereto
SG23494A SG23494G (en) 1986-07-09 1994-02-07 Adhesive sheets for sticking wafers thereto.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP61-161682 1986-07-09
JP16168286 1986-07-09

Publications (2)

Publication Number Publication Date
JPS63153814A JPS63153814A (ja) 1988-06-27
JPH0577284B2 true JPH0577284B2 (enExample) 1993-10-26

Family

ID=15739841

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62043744A Granted JPS63153814A (ja) 1986-07-09 1987-02-26 ウエハ貼着用粘着シ−ト

Country Status (3)

Country Link
JP (1) JPS63153814A (enExample)
KR (1) KR910002826B1 (enExample)
MY (2) MY102454A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7351645B2 (en) 2004-06-02 2008-04-01 Lintec Corporation Pressure sensitive adhesive sheet for use in semiconductor working and method for producing semiconductor chip
US9670382B2 (en) 2011-03-22 2017-06-06 Lintec Corporation Base film and pressure-sensitive adhesive sheet provided therewith

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3177149B2 (ja) * 1996-03-15 2001-06-18 リンテック株式会社 粘着テープ用基材、該基材を用いた粘着テープ、および該基材の製造方法
JPH10337823A (ja) * 1997-04-11 1998-12-22 Lintec Corp 基材および該基材を用いた粘着テープ
JP3809733B2 (ja) 1998-02-25 2006-08-16 セイコーエプソン株式会社 薄膜トランジスタの剥離方法
US6235387B1 (en) 1998-03-30 2001-05-22 3M Innovative Properties Company Semiconductor wafer processing tapes
PT1568071T (pt) * 2002-11-29 2019-06-17 Fraunhofer Ges Forschung Pastilha com camada de separação e camada de suporte e seu processo de fabrico
JP5665020B2 (ja) * 2009-12-22 2015-02-04 国立大学法人九州工業大学 配線用電子部品の製造方法
JP5762781B2 (ja) 2011-03-22 2015-08-12 リンテック株式会社 基材フィルムおよび該基材フィルムを備えた粘着シート
WO2016063916A1 (ja) 2014-10-23 2016-04-28 リンテック株式会社 表面保護用シート
JP6647267B2 (ja) 2017-11-09 2020-02-14 古河電気工業株式会社 半導体チップの製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2319973B2 (de) * 1972-04-26 1981-06-04 Celanese Corp., 10036 New York, N.Y. Verfahren zur Stabilisierung von Oxymethylencopolymer
JPS6031351B2 (ja) * 1979-11-13 1985-07-22 日本合成化学工業株式会社 水溶性感圧接着剤
JPS59157162A (ja) * 1983-02-26 1984-09-06 Dainippon Printing Co Ltd 水による剥離の容易な粘着剤組成物
JPS6143677A (ja) * 1984-08-07 1986-03-03 Mitsui Toatsu Chem Inc Ｉｃプロセス用フイルム

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7351645B2 (en) 2004-06-02 2008-04-01 Lintec Corporation Pressure sensitive adhesive sheet for use in semiconductor working and method for producing semiconductor chip
US9670382B2 (en) 2011-03-22 2017-06-06 Lintec Corporation Base film and pressure-sensitive adhesive sheet provided therewith

Also Published As

Publication number Publication date
MY102454A (en) 1992-06-30
KR910002826B1 (ko) 1991-05-06
MY109333A (en) 1997-01-31
KR880002261A (ko) 1988-04-30
JPS63153814A (ja) 1988-06-27

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