JPS63153814A - ウエハ貼着用粘着シ−ト - Google Patents

ウエハ貼着用粘着シ−ト

Info

Publication number
JPS63153814A
JPS63153814A JP62043744A JP4374487A JPS63153814A JP S63153814 A JPS63153814 A JP S63153814A JP 62043744 A JP62043744 A JP 62043744A JP 4374487 A JP4374487 A JP 4374487A JP S63153814 A JPS63153814 A JP S63153814A
Authority
JP
Japan
Prior art keywords
wafer
pressure sensitive
adhesive
water
sensitive adhesives
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62043744A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0577284B2 (enExample
Inventor
Kazuyoshi Ebe
和義 江部
Hiroaki Narita
博昭 成田
Katsuhisa Taguchi
田口　克久
Yoshitaka Akeda
明田　好孝
Takanori Saito
斉藤　隆則
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
F S K KK
FSK Corp
Original Assignee
F S K KK
FSK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by F S K KK, FSK Corp filed Critical F S K KK
Priority to MYPI87000930A priority Critical patent/MY102454A/en
Priority to KR1019870007148A priority patent/KR910002826B1/ko
Priority to EP87306075A priority patent/EP0252739B1/en
Priority to DE87306075T priority patent/DE3787680T2/de
Publication of JPS63153814A publication Critical patent/JPS63153814A/ja
Priority to MYPI91001866A priority patent/MY109333A/en
Publication of JPH0577284B2 publication Critical patent/JPH0577284B2/ja
Priority to SG23494A priority patent/SG23494G/en
Granted legal-status Critical Current

Links

Classifications

    • H10P72/7402—
    • H10W72/071—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • H10P50/00—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H10P72/7416—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP62043744A 1986-07-09 1987-02-26 ウエハ貼着用粘着シ−ト Granted JPS63153814A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
MYPI87000930A MY102454A (en) 1986-07-09 1987-07-02 Adhesive sheets for sticking wafers thereto
KR1019870007148A KR910002826B1 (ko) 1986-07-09 1987-07-04 웨이퍼 접착용 시이트
EP87306075A EP0252739B1 (en) 1986-07-09 1987-07-09 Adhesive sheets for sticking wafers thereto
DE87306075T DE3787680T2 (de) 1986-07-09 1987-07-09 Klebestreifen zum Kleben von Plättchen.
MYPI91001866A MY109333A (en) 1986-07-09 1991-10-12 Adhesive sheets for sticking wafers thereto
SG23494A SG23494G (en) 1986-07-09 1994-02-07 Adhesive sheets for sticking wafers thereto.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP16168286 1986-07-09
JP61-161682 1986-07-09

Publications (2)

Publication Number Publication Date
JPS63153814A true JPS63153814A (ja) 1988-06-27
JPH0577284B2 JPH0577284B2 (enExample) 1993-10-26

Family

ID=15739841

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62043744A Granted JPS63153814A (ja) 1986-07-09 1987-02-26 ウエハ貼着用粘着シ−ト

Country Status (3)

Country Link
JP (1) JPS63153814A (enExample)
KR (1) KR910002826B1 (enExample)
MY (2) MY102454A (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6139953A (en) * 1996-03-15 2000-10-31 Lintec Corporation Adhesive tape, base material for adhesive tape and their manufacturing methods
US6156423A (en) * 1997-04-11 2000-12-05 Lintec Corporation Base material and adhesive tape using the same
US6235387B1 (en) 1998-03-30 2001-05-22 3M Innovative Properties Company Semiconductor wafer processing tapes
EP1014452A4 (en) * 1998-02-25 2001-11-14 Seiko Epson Corp METHOD TO SEPARATE A THIN-LAYER COMPONENT, METHOD TO TRANSFER A THIN-LAYER COMPONENT, THIN-LAYER COMPONENT, ACTIVE MATRIX SUBSTRATE, AND LIQUID CRYSTAL DISPLAY
JP2006508540A (ja) * 2002-11-29 2006-03-09 フラウンホファー ゲゼルシャフト ツール フェルドルンク デル アンゲヴァントテン フォルシュンク エー ファウ ウェーハ処理プロセス及び装置並びに中間層及びキャリヤー層を有するウェーハ
JP2011134747A (ja) * 2009-12-22 2011-07-07 Kyushu Institute Of Technology 配線用電子部品及びその製造方法
US9559073B2 (en) 2011-03-22 2017-01-31 Lintec Corporation Base film and pressure-sensitive adhesive sheet provided therewith
US10224230B2 (en) 2014-10-23 2019-03-05 Lintec Corporation Surface protective sheet
JP2019087682A (ja) * 2017-11-09 2019-06-06 古河電気工業株式会社 半導体チップの製造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4574234B2 (ja) 2004-06-02 2010-11-04 リンテック株式会社 半導体加工用粘着シートおよび半導体チップの製造方法
JP5282113B2 (ja) 2011-03-22 2013-09-04 リンテック株式会社 基材フィルムおよび該基材フィルムを備えた粘着シート

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4923294A (enExample) * 1972-04-26 1974-03-01
JPS5670077A (en) * 1979-11-13 1981-06-11 Nippon Synthetic Chem Ind Co Ltd:The Water-soluble pressure-sensitive adhesive
JPS59157162A (ja) * 1983-02-26 1984-09-06 Dainippon Printing Co Ltd 水による剥離の容易な粘着剤組成物
JPS6143677A (ja) * 1984-08-07 1986-03-03 Mitsui Toatsu Chem Inc Ｉｃプロセス用フイルム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4923294A (enExample) * 1972-04-26 1974-03-01
JPS5670077A (en) * 1979-11-13 1981-06-11 Nippon Synthetic Chem Ind Co Ltd:The Water-soluble pressure-sensitive adhesive
JPS59157162A (ja) * 1983-02-26 1984-09-06 Dainippon Printing Co Ltd 水による剥離の容易な粘着剤組成物
JPS6143677A (ja) * 1984-08-07 1986-03-03 Mitsui Toatsu Chem Inc Ｉｃプロセス用フイルム

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6139953A (en) * 1996-03-15 2000-10-31 Lintec Corporation Adhesive tape, base material for adhesive tape and their manufacturing methods
US6156423A (en) * 1997-04-11 2000-12-05 Lintec Corporation Base material and adhesive tape using the same
EP1014452A4 (en) * 1998-02-25 2001-11-14 Seiko Epson Corp METHOD TO SEPARATE A THIN-LAYER COMPONENT, METHOD TO TRANSFER A THIN-LAYER COMPONENT, THIN-LAYER COMPONENT, ACTIVE MATRIX SUBSTRATE, AND LIQUID CRYSTAL DISPLAY
US6700631B1 (en) 1998-02-25 2004-03-02 Seiko Epson Corporation Method of separating thin-film device, method of transferring thin-film device, thin-film device, active matrix substrate, and liquid crystal display device
US6885389B2 (en) 1998-02-25 2005-04-26 Seiko Epson Corporation Method of separating thin film device, method of transferring thin film device, thin film device, active matrix substrate and liquid crystal display device
US6235387B1 (en) 1998-03-30 2001-05-22 3M Innovative Properties Company Semiconductor wafer processing tapes
US6478918B2 (en) 1998-03-30 2002-11-12 3M Innovative Properties Company Semiconductor wafer processing tapes
JP4936667B2 (ja) * 2002-11-29 2012-05-23 フラウンホファー ゲゼルシャフト ツール フェルドルンク デル アンゲヴァントテン フォルシュンク エー ファウ ウェーハ処理プロセス及び装置並びに中間層及びキャリヤー層を有するウェーハ
JP2006508540A (ja) * 2002-11-29 2006-03-09 フラウンホファー ゲゼルシャフト ツール フェルドルンク デル アンゲヴァントテン フォルシュンク エー ファウ ウェーハ処理プロセス及び装置並びに中間層及びキャリヤー層を有するウェーハ
US8173522B2 (en) 2002-11-29 2012-05-08 Thin Materials Ag Method and device for machining a wafer, in addition to a wafer comprising a separation layer and a support layer
JP2011134747A (ja) * 2009-12-22 2011-07-07 Kyushu Institute Of Technology 配線用電子部品及びその製造方法
US8952261B2 (en) 2009-12-22 2015-02-10 Kyushu Institute Of Technology Interconnect-use electronic component and method for producing same
US9559073B2 (en) 2011-03-22 2017-01-31 Lintec Corporation Base film and pressure-sensitive adhesive sheet provided therewith
US10224230B2 (en) 2014-10-23 2019-03-05 Lintec Corporation Surface protective sheet
JP2019087682A (ja) * 2017-11-09 2019-06-06 古河電気工業株式会社 半導体チップの製造方法
US10916441B2 (en) 2017-11-09 2021-02-09 Furukawa Electric Co., Ltd. Method for producing semiconductor chips

Also Published As

Publication number Publication date
JPH0577284B2 (enExample) 1993-10-26
KR910002826B1 (ko) 1991-05-06
KR880002261A (ko) 1988-04-30
MY109333A (en) 1997-01-31
MY102454A (en) 1992-06-30

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