MY102454A - Adhesive sheets for sticking wafers thereto - Google Patents

Adhesive sheets for sticking wafers thereto

Info

Publication number
MY102454A
MY102454A MYPI87000930A MYPI19870930A MY102454A MY 102454 A MY102454 A MY 102454A MY PI87000930 A MYPI87000930 A MY PI87000930A MY PI19870930 A MYPI19870930 A MY PI19870930A MY 102454 A MY102454 A MY 102454A
Authority
MY
Malaysia
Prior art keywords
adhesive
wafers
adhesive sheets
attached
face side
Prior art date
Application number
MYPI87000930A
Inventor
Narita Hiroaki
Taguchi Katsuhisa
Ebe Kazuyoshi
Saito Takanori
Akeda Yoshitaka
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of MY102454A publication Critical patent/MY102454A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Abstract

ADHESIVE SHEETS FOR STICKING WAFERS THERETO ACCORDING TO THE PRESENT INVENTION ARE ADHESIVE SHEETS WHICH ARE APPLIED TO THE FACE SIDE OF WAFERS HAVING FORMED PATTERNS THEREON WHEN THE REVERSE SIDE OF SAID WAFERS ARE SUBJECTED TO GRINDING TREATMENT, CHARACTERIZED IN THAT THE ADHESIVE SHEETS COMPRISE A BASE AND A WATER- SWELLING ADHESIVE COATED THEREON AS AN ADHESIVE LAYER. USING THE ADHESIVE SHEETS ACCORDING TO THE PRESENT INVENTION, EVEN WHEN THE ADHESIVE REMAINED AND ATTACHED TO THE FACE SIDE OF WAFERS AFTER STRIPPING OFF SAID ADHESIVE SHEETS THEREFROM SUBSEQUENT TO THE COMPLETION OF THE GRINDING TREATMENT OF THE REVERSE SIDE OF WAFERS, THE ADHESIVE, WHICH ATTACHED AT A RARE POSSIBILITY, CAN BE REMOVED THEREFROM BY CLEANING WITH WATER WITHOUT USING ORGANIC SOLVENTS SUCH AS TRICHLENE. ACCORDINGLY, THERE IS NO POSSIBILITY TO EXERT ADVERSE EFFECTS ON HUMAN BODY AND, MOREOVER, THE ADHESIVE, WHICH ATTACHED TO THE FACE SIDE OFWAFERS AT A RARE POSSIBILITY CAN BE REMOVED THEREFROM BY A SINGLE STEP. (FIG. 3)
MYPI87000930A 1986-07-09 1987-07-02 Adhesive sheets for sticking wafers thereto MY102454A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP16168286 1986-07-09
JP62043744A JPS63153814A (en) 1986-07-09 1987-02-26 Adhesive sheet for sticking wafer

Publications (1)

Publication Number Publication Date
MY102454A true MY102454A (en) 1992-06-30

Family

ID=15739841

Family Applications (2)

Application Number Title Priority Date Filing Date
MYPI87000930A MY102454A (en) 1986-07-09 1987-07-02 Adhesive sheets for sticking wafers thereto
MYPI91001866A MY109333A (en) 1986-07-09 1991-10-12 Adhesive sheets for sticking wafers thereto

Family Applications After (1)

Application Number Title Priority Date Filing Date
MYPI91001866A MY109333A (en) 1986-07-09 1991-10-12 Adhesive sheets for sticking wafers thereto

Country Status (3)

Country Link
JP (1) JPS63153814A (en)
KR (1) KR910002826B1 (en)
MY (2) MY102454A (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3177149B2 (en) * 1996-03-15 2001-06-18 リンテック株式会社 Adhesive tape substrate, adhesive tape using the substrate, and method for producing the substrate
JPH10337823A (en) * 1997-04-11 1998-12-22 Lintec Corp Base material and pressure sensitive adhesive tape using the material
JP3809733B2 (en) 1998-02-25 2006-08-16 セイコーエプソン株式会社 Thin film transistor peeling method
US6235387B1 (en) 1998-03-30 2001-05-22 3M Innovative Properties Company Semiconductor wafer processing tapes
PT1568071T (en) 2002-11-29 2019-06-17 Fraunhofer Ges Forschung Wafer comprising a separation layer and a support layer and its manufacturing method
JP4574234B2 (en) 2004-06-02 2010-11-04 リンテック株式会社 Adhesive sheet for semiconductor processing and method for manufacturing semiconductor chip
JP5665020B2 (en) * 2009-12-22 2015-02-04 国立大学法人九州工業大学 Manufacturing method of electronic parts for wiring
JP5762781B2 (en) 2011-03-22 2015-08-12 リンテック株式会社 Base film and pressure-sensitive adhesive sheet provided with the base film
JP5282113B2 (en) 2011-03-22 2013-09-04 リンテック株式会社 Base film and pressure-sensitive adhesive sheet provided with the base film
US10224230B2 (en) 2014-10-23 2019-03-05 Lintec Corporation Surface protective sheet
JP6647267B2 (en) * 2017-11-09 2020-02-14 古河電気工業株式会社 Manufacturing method of semiconductor chip

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2319973B2 (en) * 1972-04-26 1981-06-04 Celanese Corp., 10036 New York, N.Y. Process for stabilizing oxymethylene copolymer
JPS6031351B2 (en) * 1979-11-13 1985-07-22 日本合成化学工業株式会社 water soluble pressure sensitive adhesive
JPS59157162A (en) * 1983-02-26 1984-09-06 Dainippon Printing Co Ltd Pressure-sensitive adhesive composition peelable easily with water
JPS6143677A (en) * 1984-08-07 1986-03-03 Mitsui Toatsu Chem Inc Film for ic processing

Also Published As

Publication number Publication date
KR880002261A (en) 1988-04-30
JPH0577284B2 (en) 1993-10-26
MY109333A (en) 1997-01-31
JPS63153814A (en) 1988-06-27
KR910002826B1 (en) 1991-05-06

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