KR880002261A - Wafer Bonding Sheet - Google Patents

Wafer Bonding Sheet Download PDF

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Publication number
KR880002261A
KR880002261A KR1019870007148A KR870007148A KR880002261A KR 880002261 A KR880002261 A KR 880002261A KR 1019870007148 A KR1019870007148 A KR 1019870007148A KR 870007148 A KR870007148 A KR 870007148A KR 880002261 A KR880002261 A KR 880002261A
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KR
South Korea
Prior art keywords
alkyl
meth
water
carbon atoms
adhesive sheet
Prior art date
Application number
KR1019870007148A
Other languages
Korean (ko)
Other versions
KR910002826B1 (en
Inventor
가즈요시 에베
히로아끼 나리따
가쯔히사 다구찌
요시다까 아께다
다까노리 사이또
Original Assignee
쇼오지 고오메이
에프 에스 케이 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP16168286 priority Critical
Priority to JP161682 priority
Priority to JP61-161682 priority
Priority to JP62-43744 priority
Priority to JP8743744A priority patent/JPH0577284B2/ja
Priority to JP43744 priority
Application filed by 쇼오지 고오메이, 에프 에스 케이 가부시끼가이샤 filed Critical 쇼오지 고오메이
Publication of KR880002261A publication Critical patent/KR880002261A/en
Application granted granted Critical
Publication of KR910002826B1 publication Critical patent/KR910002826B1/en

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836Wafer tapes, e.g. grinding or dicing support tapes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • C09J7/381Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Abstract

내용 없음No content

Description

웨이퍼 접착용 시이트Wafer Bonding Sheet

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도 및 제2도는 본 발명의 접착 시이트의 단면도.1 and 2 are cross-sectional views of the adhesive sheet of the present invention.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

1 : 접착 시이트 2 : 베이스1: adhesive sheet 2: base

3 : 접착층 A : 웨이퍼3: adhesive layer A: wafer

B : 잔류 접착제 C : 물B: residual adhesive C: water

Claims (9)

  1. 웨이퍼의 반대면을 그라인딩 처리할때 패턴이 형성되어 있는 웨이퍼의 표면에 붙이는 웨이퍼 접착용 접착 시이트에 있어서, 접착 시이트가 베이스와 베이스에 물팽창 접착제를 코팅한 접착층으로 이루어진 것을 특징으로 하는 웨이퍼 접착용 접착 시이트.A wafer bonding adhesive sheet which is attached to the surface of a wafer on which a pattern is formed when grinding the opposite side of the wafer, wherein the adhesive sheet is composed of a base and an adhesive layer coated with a water-expandable adhesive on the base. Adhesive sheet.
  2. 제1항에 있어서, 베이스가 폴리에틸렌, 폴리프로필렌, 폴리비닐 크롤라이드, 폴리에틸렌 테레프탈레이트, 폴리부틸렌 테레프탈레이트, 폴리부텐, 폴리부타디엔, 폴리우레탄, 폴리메틸 펜텐, 에틸렌-비닐 아세테이트 코폴리머, 크로스-링크된 폴리올레핀 또는 에틸렌-메타크릴산 코폴리머인 것을 특징으로 하는 접착 시이트.The method of claim 1 wherein the base is polyethylene, polypropylene, polyvinyl crawlide, polyethylene terephthalate, polybutylene terephthalate, polybutene, polybutadiene, polyurethane, polymethyl pentene, ethylene-vinyl acetate copolymers, cross- An adhesive sheet, characterized in that it is a linked polyolefin or ethylene-methacrylic acid copolymer.
  3. 제1항에 있어서, 물팽창 접착제는 물과 접촉하여 제한된 팽창을 하는 것을 특징으로 하는 접착 시이트.The adhesive sheet of claim 1 wherein the water expansion adhesive has limited expansion in contact with water.
  4. 제1항에 있어서, 물팽창 접착제가 (A) 친수성 성분들로서 에틸렌 옥사이드 그룹들을 갖는 하나 또는 둘 이상의 비이온 계면활성제와, (B) 다음 화학식 1로서 표현되는 하나 또는 둘 이상의 순환구조 유니트 40-99㏖% 및 다음 화학식 2로 표현되는 하나 또는 둘 이상의 순환 구조 유니트 60-1㏖%로 구성된 하나 또는 둘 이상의 코폴리머로 이루어진 것을 특징으로 하는 접착 시이트. (여기서 전술한 코폴리머 또는 코폴리머들은 필요하다면 성분(B)의 카르복실 그룹과 반응하는 초산아연 또는 염화마그네슘같은 가교제와 크로스-링크 되는 것이다.)The water-expandable adhesive according to claim 1, wherein the water-expandable adhesive comprises (A) at least one nonionic surfactant having ethylene oxide groups as hydrophilic components, and (B) at least one cyclic structure unit represented by the following formula (1) 40-99 An adhesive sheet comprising one or more copolymers composed of mol% and 60-1 mol% of one or two or more cyclic structural units represented by the following formula (2). (The copolymers or copolymers described above are cross-linked with a crosslinking agent such as zinc acetate or magnesium chloride, if necessary, reacted with the carboxyl group of component (B).)
    여기서 R1은 수소, 염소 또는 저급알킬이며, R2는 수소, 염소, 저급알킬 또는 -OCOR3, -OR3, -COOR3,,, -CN, -CONH2, -CONHCH2OH, -CH2OH, -C2H2OH, -OH 또는의 그룹이며, R3는 1-8개의 탄소원자를 갖는 알킬이다.Wherein R 1 is hydrogen, chlorine or lower alkyl, R 2 is hydrogen, chlorine, lower alkyl or -OCOR 3 , -OR 3 , -COOR 3 , , , -CN, -CONH 2 , -CONHCH 2 OH, -CH 2 OH, -C 2 H 2 OH, -OH or Is a group of R 3 is alkyl having 1-8 carbon atoms.
    여기서 X, Y 및 Z는 같거나 다를 수 있고, 각각 수소, 염소, 저급알킬 또는 -COOR4, -COOH, -CH2COOH 또는 -CH2COOR4의 그룹이며, R4는 1-4개의 탄소원자를 갖는 알킬이다.Wherein X, Y and Z may be the same or different and are each hydrogen, chlorine, lower alkyl or a group of -COOR 4 , -COOH, -CH 2 COOH or -CH 2 COOR 4 , and R 4 is 1-4 carbon sources Alkyl having a ruler.
  5. 제4항에 있어서, 비이온 계면 활성제가 (i) OH(C2H4O)a(C3H6O)b(C2H4O)cH (여기서 a, b 및 c는 각각 20-80인 정수이다) (ii) RA(C2H4O)eH (여기서 R은 6-18개의 탄소원자를 갖는 알킬, 4-20개의 탄소원자를 갖는 알킬을 가진 알킬페닐, 또는The method of claim 4, wherein the nonionic surfactant is selected from the group consisting of (i) OH (C 2 H 4 O) a (C 3 H 6 O) b (C 2 H 4 O) c H, wherein a, b and c are each 20 Is an integer of -80) (ii) RA (C 2 H 4 O) e H (where R is alkyl having 6-18 carbon atoms, alkylphenyl having alkyl having 4-20 carbon atoms, or
    H(또는 CH3)의 그룹이며, A는 산소, 황 또는 -COO, -CONH, CON(C2H4O)cH, PO4H 또는 PO4(C2H4O)cH의 그룹이며, e는 2-80인 정수이다) 또는 (iii)Is a group of H (or CH 3 ), where A is oxygen, sulfur or a group of -COO, -CONH, CON (C 2 H 4 O) c H, PO 4 H or PO 4 (C 2 H 4 O) c H E is an integer of 2-80) or (iii)
    (여기서 R은 6-18개의 탄소원자를 갖는 알킬이며, X, Y, X는 각각 2-40인 정수이다)인 것을 특징으로 하는 접착 시이트.Wherein R is alkyl having 6-18 carbon atoms and X, Y and X are each an integer of 2-40.
  6. 물팽창 접착제는 (A) 수용성 폴리머와 (B) 물에 팽창하는 폴리머를 부여하는 (메타) 아크릴 에스테르 모노머로 이루어진 것을 특징으로 하는 접착 시이트.The water-expandable adhesive is an adhesive sheet comprising (A) a water-soluble polymer and (B) a (meth) acrylic ester monomer to impart a polymer to expand to water.
  7. 제1항에 있어서, (A) 수용성 폴리머는 화학식The process of claim 1 wherein (A) the water soluble polymer is of formula
    (여기서 R1은 수소 또는 메틸이며, R2는 2-4개의 탄소원자를 갖는 알킬렌이며, R3는 1개 이상의 탄소원자를 갖는 알킬이며, n은 1이상의 정수이다)으로 표현되는 (메타) 아크릴 에스테르 모노머, (메타) 아크릴산, (메타) 아크릴 에스테르, 비닐피롤리돈, 아크릴아미드, 디메틸 아미노에틸 (메타) 아크릴레이트, 디에틸 아미노에틸 (메타) 아크릴레이트 또는 비닐 메틸 에테르로 부터 유도되는 것을 특징으로 하는 접착 시이트.(Meth) acrylic represented by (wherein R 1 is hydrogen or methyl, R 2 is alkylene having 2-4 carbon atoms, R 3 is alkyl having 1 or more carbon atoms, n is an integer of 1 or more) Derived from ester monomers, (meth) acrylic acid, (meth) acrylic esters, vinylpyrrolidone, acrylamide, dimethyl aminoethyl (meth) acrylate, diethyl aminoethyl (meth) acrylate or vinyl methyl ether Adhesive sheet.
  8. 제7항에 있어서, (B) (메타) 아크릴 에스테르 모노머는 (메타) 아크릴 에스테르 모노머들, 디메틸 아미노에틸 (메타) 아크릴레이트 또는 디메틸 아미노에틸 (메타) 아크릴레이트, (메타) 아크릴레이트인 것을 특징으로 하는 접착 시이트.8. The (B) (meth) acrylic ester monomer is (meth) acrylic ester monomers, dimethyl aminoethyl (meth) acrylate or dimethyl aminoethyl (meth) acrylate, (meth) acrylate. Adhesive sheet.
  9. 제1항에 있어서, 물팽창 접착제는 (A) 카르복실 그룹을 함유하는 모너머 10-40㏖%, 4개 이상의 탄소원자를 갖는 알킬을 가진 (메타) 아크릴 알킬 에스테르 60-90㏖% 및 전술한 모노머들과는 다른 비닐모노머 (0-20㏖%로 이루어진 코폴리머내에 카르복실 그룹을 중화시켜서 얻어진 코폴리머의 염과 (B) 화학식 R1O(R2O)nR3(여기서 R1은 탄소 원자의 수가 1-4개인 알킬이며, R2는 탄소원자의 수가 2-4개인 알킬렌이며, R3는 수소, 탄소원자의 수가 1-4개인 알킬 또는 아세틸 이며, n은 1-6정수이다.)으로 표현되는 친수성 화합물로 이루어진 것을 특징으로 하는 접착 시이트.The water-expandable adhesive according to claim 1, which comprises (A) 10-40 mol% of monomers containing carboxyl groups, 60-90 mol% of (meth) acryl alkyl esters with alkyl having at least 4 carbon atoms and the foregoing (B) a salt of a copolymer obtained by neutralizing a carboxyl group in a copolymer consisting of 0-20 mol% and a monomer of formula R 1 O (R 2 O) n R 3 , wherein R 1 is a carbon atom Is 1-4 alkyl, R 2 is alkylene having 2-4 carbon atoms, R 3 is hydrogen, alkyl or acetyl having 1-4 carbon atoms, and n is 1-6 integer. An adhesive sheet composed of a hydrophilic compound represented.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019870007148A 1986-07-09 1987-07-04 Adhesive sheet for sticking afers KR910002826B1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP16168286 1986-07-09
JP161682 1986-07-09
JP61-161682 1986-07-09
JP43744 1987-02-26
JP62-43744 1987-02-26
JP8743744A JPH0577284B2 (en) 1986-07-09 1987-02-26

Publications (2)

Publication Number Publication Date
KR880002261A true KR880002261A (en) 1988-04-30
KR910002826B1 KR910002826B1 (en) 1991-05-06

Family

ID=15739841

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870007148A KR910002826B1 (en) 1986-07-09 1987-07-04 Adhesive sheet for sticking afers

Country Status (2)

Country Link
JP (1) JPH0577284B2 (en)
KR (1) KR910002826B1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3177149B2 (en) * 1996-03-15 2001-06-18 リンテック株式会社 Adhesive tape substrate, adhesive tape using the substrate, and method for producing the substrate
JPH10337823A (en) * 1997-04-11 1998-12-22 Lintec Corp Base material and pressure sensitive adhesive tape using the material
JP3809733B2 (en) 1998-02-25 2006-08-16 セイコーエプソン株式会社 Thin film transistor peeling method
US6235387B1 (en) 1998-03-30 2001-05-22 3M Innovative Properties Company Semiconductor wafer processing tapes
WO2004051708A2 (en) * 2002-11-29 2004-06-17 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method and device for machining a wafer, in addition to a wafer comprising a separation layer and a support layer
JP4574234B2 (en) 2004-06-02 2010-11-04 リンテック株式会社 Adhesive sheet for semiconductor processing and method for manufacturing semiconductor chip
JP5665020B2 (en) * 2009-12-22 2015-02-04 国立大学法人九州工業大学 Manufacturing method of electronic parts for wiring
JP5762781B2 (en) 2011-03-22 2015-08-12 リンテック株式会社 Base film and pressure-sensitive adhesive sheet provided with the base film
JP5282113B2 (en) 2011-03-22 2013-09-04 リンテック株式会社 Base film and pressure-sensitive adhesive sheet provided with the base film
CN107078042A (en) 2014-10-23 2017-08-18 琳得科株式会社 Surface protection sheet material

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2319973B2 (en) * 1972-04-26 1981-06-04 Celanese Corp., 10036 New York, N.Y., Us
JPS6031351B2 (en) * 1979-11-13 1985-07-22 Nippon Synthetic Chem Ind
JPH0561314B2 (en) * 1983-02-26 1993-09-06 Dainippon Printing Co Ltd
JPH0151511B2 (en) * 1984-08-07 1989-11-02 Mitsui Toatsu Chemicals

Also Published As

Publication number Publication date
KR910002826B1 (en) 1991-05-06
JPS63153814A (en) 1988-06-27
JPH0577284B2 (en) 1993-10-26

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