JPH0548955B2 - - Google Patents

Info

Publication number
JPH0548955B2
JPH0548955B2 JP62317724A JP31772487A JPH0548955B2 JP H0548955 B2 JPH0548955 B2 JP H0548955B2 JP 62317724 A JP62317724 A JP 62317724A JP 31772487 A JP31772487 A JP 31772487A JP H0548955 B2 JPH0548955 B2 JP H0548955B2
Authority
JP
Japan
Prior art keywords
support plate
lead
resin
semiconductor
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP62317724A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01158756A (ja
Inventor
Sadao Yoshida
Masami Minami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP62317724A priority Critical patent/JPH01158756A/ja
Publication of JPH01158756A publication Critical patent/JPH01158756A/ja
Publication of JPH0548955B2 publication Critical patent/JPH0548955B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/01515—
    • H10W72/075—
    • H10W72/5363—
    • H10W72/5449—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP62317724A 1987-12-16 1987-12-16 樹脂封止型半導体装置の製造方法 Granted JPH01158756A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62317724A JPH01158756A (ja) 1987-12-16 1987-12-16 樹脂封止型半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62317724A JPH01158756A (ja) 1987-12-16 1987-12-16 樹脂封止型半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPH01158756A JPH01158756A (ja) 1989-06-21
JPH0548955B2 true JPH0548955B2 (cg-RX-API-DMAC10.html) 1993-07-22

Family

ID=18091334

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62317724A Granted JPH01158756A (ja) 1987-12-16 1987-12-16 樹脂封止型半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPH01158756A (cg-RX-API-DMAC10.html)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2563171Y2 (ja) * 1992-06-26 1998-02-18 シャープ株式会社 樹脂封止型半導体装置
JP2597768Y2 (ja) * 1992-09-04 1999-07-12 シャープ株式会社 電力半導体装置
JP3572833B2 (ja) * 1996-12-19 2004-10-06 株式会社デンソー 樹脂封止型半導体装置の製造方法
DE10247610A1 (de) * 2002-10-11 2004-04-29 Micronas Gmbh Elektronisches Bauelement mit einem Systemträger
US20040113240A1 (en) 2002-10-11 2004-06-17 Wolfgang Hauser An electronic component with a leadframe
JP4349437B2 (ja) 2007-06-04 2009-10-21 株式会社デンソー 電子装置の製造方法
JP6677922B2 (ja) * 2015-10-08 2020-04-08 株式会社リコー 画像形成装置の製造方法
CN107845575A (zh) * 2017-11-03 2018-03-27 浙江人和光伏科技有限公司 一种薄片二极管的生产方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5643854B2 (cg-RX-API-DMAC10.html) * 1973-07-17 1981-10-15
JPS62180957U (cg-RX-API-DMAC10.html) * 1986-05-06 1987-11-17

Also Published As

Publication number Publication date
JPH01158756A (ja) 1989-06-21

Similar Documents

Publication Publication Date Title
JPH0730046A (ja) 半導体装置、リードフレーム及び半導体装置の製造方法
JPH1145958A (ja) 表面実装部品及びその製造方法
JPH0548955B2 (cg-RX-API-DMAC10.html)
EP0307946B1 (en) Method of manufacturing a resin insulated type semiconductor device
JP2525555Y2 (ja) 樹脂封止型半導体装置用リードフレーム組立体
JPS61102040A (ja) 樹脂封止型半導体装置の製造方法
JP7591377B2 (ja) 半導体部品
JPH0254665B2 (cg-RX-API-DMAC10.html)
JP2973506B2 (ja) 樹脂封止形半導体装置の製造方法
KR100448432B1 (ko) 에어-캐버티 플라스틱 패키지용 성형 금형
JPH0394432A (ja) 樹脂封止型電子部品の製造方法
JP3705235B2 (ja) 半導体装置の製造方法
JPH079917B2 (ja) 樹脂封止型半導体装置の製造方法
JPS6244815B2 (cg-RX-API-DMAC10.html)
JPS647496B2 (cg-RX-API-DMAC10.html)
JPH0328067B2 (cg-RX-API-DMAC10.html)
JP2917556B2 (ja) 絶縁物封止型電子部品の製造方法
JP2802966B2 (ja) 樹脂封止型電子部品の製造方法
JP2601033B2 (ja) 樹脂封止型半導体装置およびその製造方法
JPS6314466Y2 (cg-RX-API-DMAC10.html)
JP2596247B2 (ja) 半導体装置の成形用金型
JPH0213461B2 (cg-RX-API-DMAC10.html)
JPH0824156B2 (ja) 樹脂封止型半導体装置の製造方法
JPH0378779B2 (cg-RX-API-DMAC10.html)
JPH0590315A (ja) 樹脂封止金型

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees