JPH0515306B2 - - Google Patents
Info
- Publication number
- JPH0515306B2 JPH0515306B2 JP15079286A JP15079286A JPH0515306B2 JP H0515306 B2 JPH0515306 B2 JP H0515306B2 JP 15079286 A JP15079286 A JP 15079286A JP 15079286 A JP15079286 A JP 15079286A JP H0515306 B2 JPH0515306 B2 JP H0515306B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- semiconductor device
- thickness
- film
- wiring conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
- H01L2924/10157—Shape being other than a cuboid at the active surface
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15079286A JPS636851A (ja) | 1986-06-26 | 1986-06-26 | 超薄形半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15079286A JPS636851A (ja) | 1986-06-26 | 1986-06-26 | 超薄形半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS636851A JPS636851A (ja) | 1988-01-12 |
| JPH0515306B2 true JPH0515306B2 (enrdf_load_stackoverflow) | 1993-03-01 |
Family
ID=15504533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15079286A Granted JPS636851A (ja) | 1986-06-26 | 1986-06-26 | 超薄形半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS636851A (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5091251A (en) * | 1989-05-29 | 1992-02-25 | Tomoegawa Paper Co., Ltd. | Adhesive tapes and semiconductor devices |
| US5162945A (en) * | 1989-06-27 | 1992-11-10 | Asahi Kogaku Kogyo K.K. | Ocular lens system |
| JP4093018B2 (ja) * | 2002-11-08 | 2008-05-28 | 沖電気工業株式会社 | 半導体装置及びその製造方法 |
| JP4597182B2 (ja) * | 2007-11-09 | 2010-12-15 | Okiセミコンダクタ株式会社 | 半導体装置及びその製造方法 |
-
1986
- 1986-06-26 JP JP15079286A patent/JPS636851A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS636851A (ja) | 1988-01-12 |
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