JPH05251513A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPH05251513A
JPH05251513A JP3123368A JP12336891A JPH05251513A JP H05251513 A JPH05251513 A JP H05251513A JP 3123368 A JP3123368 A JP 3123368A JP 12336891 A JP12336891 A JP 12336891A JP H05251513 A JPH05251513 A JP H05251513A
Authority
JP
Japan
Prior art keywords
wiring pattern
bonding pad
substrate
semiconductor device
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP3123368A
Other languages
English (en)
Inventor
Kenichi Anasako
健一 穴迫
Rokuro Honma
六郎 本間
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP3123368A priority Critical patent/JPH05251513A/ja
Priority to EP19920109134 priority patent/EP0516170A3/en
Publication of JPH05251513A publication Critical patent/JPH05251513A/ja
Withdrawn legal-status Critical Current

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    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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Abstract

(57)【要約】 【目的】 ＩＣの電極接続を配線パターン形成と同時に
実施し、ボンディングエリアの縮小と工程の簡素化、低
価格化を図る。 【構成】 半導体装置において、基板２の表面に形成さ
れる凹部２ａと、該凹部２ａに搭載され、表面にボンデ
ィングパッド４が形成されるＩＣ１と、前記基板２とＩ
Ｃ１の隙間を埋める樹脂３と、前記基板２、ＩＣ１及び
樹脂３のそれぞれの表面が同一平面に形成され、同時に
前記ボンディングパッド４との接続を行うように形成さ
れる配線パターン５とを設ける。

Description

【発明の詳細な説明】
【０００１】
【産業上の利用分野】本発明は、半導体装置に係り、特
に、ＩＣ（集積回路）と配線パターンの電気的接続部の
構造に関するものである。
【０００２】
【従来の技術】従来、このような分野の技術としては、
例えば、「高密度ハンダバンプ電極形成とその接続技術
開発」沖電気研究開発 昭和６３年４月，第１３８号，
Ｖｏｌ．５５，Ｎｏ．２，第４５頁〜第５０頁に記載さ
れるものがあった。即ち、従来のＩＣの高密度実装には
ＴＡＢ（Ｔａｐｅ Ａｕｔｏｍａｔｅｄ Ｂｏｎｄｉｎ
ｇ）法、ワイヤボンディング法、フリップチップ法等が
用いられてきた。
【０００３】そこで、従来のワイヤボンディング法で
は、ＩＣ上の電極から配線パターン上へ、Ａｕなどの金
属細線で結線することで電気接続を行うようにしてい
る。また、フリップチップ法ではＩＣ上の電極が半田な
どのボールで形成されており、ＩＣの半田ボール部を下
にして、配線パターン上に前記半田ボールが位置するよ
うにして半田を溶融し、電気接続を行う。
【０００４】ＴＡＢ法ではＩＣ上の電極をテープキャリ
アに形成された電極に同時に接続し、更に、前記テープ
キャリアのもう一方の電極を配線パターンに同時に接続
することで電気接続を行うようにしている。
【０００５】
【発明が解決しようとする課題】しかしながら、以上述
べたワイヤボンディング法やＴＡＢ法では、ＩＣの電極
と絶縁基板の配線パターンと接続するために、接続用の
別の導体を介さなければならない。そのためにボンディ
ングするのに大きなスペースが必要であり、また特殊な
ボンディング装置が必要であった。
【０００６】一方、フリップチップ法ではＩＣの電極上
に半田バンプを形成するため、ＩＣが高価となり、また
ボンディング面が絶縁基板側となるため、接続の信頼性
の確認が難しい等の問題点があった。本発明は、上記問
題点を除去し、ＩＣの電極接続を配線パターン形成と同
時に実施し、ボンディングエリアの縮小と工程の簡素
化、低価格化、高信頼性に優れた半導体装置を提供する
ことを目的とする。
【０００７】
【課題を解決するための手段】本発明は、上記目的を達
成するために、半導体装置において、絶縁基板の表面に
形成される凹部と、該凹部に搭載され、表面にボンディ
ングパッドが形成されるＩＣと、前記絶縁基板とＩＣ間
の凹部を埋める絶縁物と、前記絶縁基板、ＩＣ及び絶縁
物のそれぞれの表面が同一平面に形成され、同時に前記
ボンディングパッドとの接続を行うように形成される配
線パターンとを設けるようにしたものである。
【０００８】また、絶縁基板の表面に搭載され、表面に
ボンディングパッドが形成されるＩＣと、該ＩＣの周囲
を埋める絶縁物と、前記ＩＣ及び絶縁物のそれぞれの表
面が同一平面に形成され、同時に前記ボンディングパッ
ドとの接続を行うように形成される配線パターンとを設
けるようにしたものである。
【０００９】
【作用】本発明によれば、例えば、図１及び図２に示す
ように、ＩＣ１の上面のボンディングパッド４と配線
パターン５の面を、同じ平面となるように形成する。
その平面上に印刷又はフォトリソ（蒸着、スパッタ、エ
ッチング）でＩＣ１のボンディングパッド４の接続も含
めて、配線パターン５を一体的に形成する。即ち、絶縁
基板上に実装されるボンディングパッドが形成されるＩ
Ｃと、周囲の表面を同一の平面となるように構成したの
で、印刷、フォトリソ等により連続した配線パターンを
形成でき、これと同時にボンディングパッドとの接続を
行うことができる。
【００１０】従って、ＩＣのボンディングパッドの電極
接続と基板の配線パターンの形成を同時に行うことがで
き、ボンディングエリアを小さくすることができ、半導
体装置の小形化を図ることができる。
【００１１】
【実施例】本発明の実施例を図面を参照しながら詳細に
説明する。図１は本発明の実施例を示す半導体装置の平
面図、図２は図１のＡ−Ａ′線断面図である。これらの
図において、１はＩＣ、２は基板、３はその基板２とＩ
Ｃ１との隙間を埋める樹脂、４はボンディングパッド、
５は配線パターンである。
【００１２】ここで、基板２とＩＣ１の上面が同じ平面
となるように基板２に凹部２ａを形成し、該凹部２ａに
ＩＣ１を配置して固定する。ＩＣ１と基板２の隙間は樹
脂３で埋める。このように構成することにより、ＩＣ１
のボンディングパッド４と基板２は同一平面上にあり、
続いているので、印刷、フォトリソ等で連続した配線パ
ターン５を形成することができ、ＩＣ１のボンディング
パッド４から基板２の配線パターン５への電極接続を同
時に実施することができる。なおＩＣ１の表面は、ボン
ディングパッド４上を除いてパッシべーション膜（表面
安定化膜）に覆われているため、配線パターン５との電
気的絶縁は確保できる。
【００１３】このように、基板２とＩＣ１は樹脂３も含
めて平面的に構成され、配線パターン５も平面的な配線
にすることができる。つまり、 ＩＣ１の上面のボンディングパッド４と基本となる配
線パターン５の面を、同じ平面となるように形成する。 その平面上に印刷又はフォトリソ（蒸着、スパッ
タ、エッチング）でＩＣ１のボンディングパッド４の接
続も含めて、配線パターン５を一体的に形成するように
したものである。
【００１４】なお、上記実施例では基板２とＩＣ１の隙
間を樹脂３により埋めるようにしているが、これに限定
するものではなく、他の樹脂以外の絶縁物を充填するよ
うにしてもよい。図３は本発明の他の実施例を示す半導
体装置の平面図、図４は図３のＢ−Ｂ′線断面図であ
る。
【００１５】これらの図において、基板１１の上に上面
にボンディングパッド１３を有するＩＣ１０を搭載し、
樹脂１２をＩＣ１０の上面と同じ平面となるように形成
し、その平面上に配線パターン１４を形成する。このよ
うに、構成することにより、ＩＣのボンディングパッド
の電極接続と基板の配線パターンの形成を同時に行うこ
とができる。
【００１６】なお、本発明は上記実施例に限定されるも
のではなく、本発明の趣旨に基づき種々の変形が可能で
あり、それらを本発明の範囲から排除するものではな
い。
【００１７】
【発明の効果】以上詳細に説明したように、本発明によ
れば、ＩＣのボンディングパッドの電極接続と基板の配
線パターンの形成を同時に行うことができる。そのため
にボンディングエリアを小さくすることができ、半導体
装置の小形化を図ることができる。
【００１８】また、特殊なボンディング装置も不要とな
り、工程の簡素化、低コスト化を図ることができる。更
に、接続の信頼性の確認も容易に行うことができると共
に、接続部の配線長も短くすることができるため、高速
動作が可能な半導体装置を得ることができる。
【図面の簡単な説明】
【図１】本発明の実施例を示す半導体装置の平面図であ
る。
【図２】図１のＡ−Ａ′線断面図である。
【図３】本発明の他の実施例を示す半導体装置の平面図
である。
【図４】図３のＢ−Ｂ′線断面図である。
【符号の説明】
１，１０ ＩＣ ２，１１ 基板 ２ａ 凹部 ３ 隙間を埋める樹脂 ４，１３ ボンディングパッド ５，１４ 配線パターン １２ 樹脂

Claims (2)

    【特許請求の範囲】
  1. 【請求項１】（ａ）絶縁基板の表面に形成される凹部
    と、 （ｂ）該凹部に搭載され、表面にボンディングパッドが
    形成されるＩＣと、 （ｃ）前記絶縁基板と前記ＩＣ間の凹部を埋める絶縁物
    と、 （ｄ）前記絶縁基板、前記ＩＣ及び絶縁物のそれぞれの
    表面が同一平面に形成され、同時に前記ボンディングパ
    ッドとの接続を行うように形成される配線パターンとを
    具備することを特徴とする半導体装置。
  2. 【請求項２】（ａ）絶縁基板の表面に搭載され、表面に
    ボンディングパッドが形成されるＩＣと、 （ｂ）該ＩＣの周囲を埋める絶縁物と、 （ｃ）前記ＩＣ及び絶縁物のそれぞれの表面が同一平面
    に形成され、同時に前記ボンディングパッドとの接続を
    行うように形成される配線パターンとを具備することを
    特徴とする半導体装置。
JP3123368A 1991-05-28 1991-05-28 半導体装置 Withdrawn JPH05251513A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP3123368A JPH05251513A (ja) 1991-05-28 1991-05-28 半導体装置
EP19920109134 EP0516170A3 (en) 1991-05-28 1992-05-29 Semiconductor chip mounted circuit board assembly and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3123368A JPH05251513A (ja) 1991-05-28 1991-05-28 半導体装置

Publications (1)

Publication Number Publication Date
JPH05251513A true JPH05251513A (ja) 1993-09-28

Family

ID=14858856

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3123368A Withdrawn JPH05251513A (ja) 1991-05-28 1991-05-28 半導体装置

Country Status (2)

Country Link
EP (1) EP0516170A3 (ja)
JP (1) JPH05251513A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005197610A (ja) * 2004-01-09 2005-07-21 Sony Corp 微小構造体のアッセンブリ方法および装置ならびに電子応用装置の製造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0157857B1 (ko) * 1992-01-14 1998-12-01 문정환 반도체 패키지
US5696666A (en) * 1995-10-11 1997-12-09 Motorola, Inc. Low profile exposed die chip carrier package

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3380082D1 (en) * 1982-10-21 1989-07-20 Abbott Lab A method of establishing electrical connections at a semiconductor device
US4866501A (en) * 1985-12-16 1989-09-12 American Telephone And Telegraph Company At&T Bell Laboratories Wafer scale integration
US4989063A (en) * 1988-12-09 1991-01-29 The United States Of America As Represented By The Secretary Of The Air Force Hybrid wafer scale microcircuit integration
DE3925604A1 (de) * 1989-08-02 1991-02-07 Siemens Ag Kontaktierung von ungehaeusten halbleiterschaltungen auf substraten

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005197610A (ja) * 2004-01-09 2005-07-21 Sony Corp 微小構造体のアッセンブリ方法および装置ならびに電子応用装置の製造方法
JP4534491B2 (ja) * 2004-01-09 2010-09-01 ソニー株式会社 電子応用装置の製造方法およびマイクロロッドトランジスタのアッセンブリ方法

Also Published As

Publication number Publication date
EP0516170A2 (en) 1992-12-02
EP0516170A3 (en) 1993-04-14

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