JPS636851A - 超薄形半導体装置 - Google Patents

超薄形半導体装置

Info

Publication number
JPS636851A
JPS636851A JP15079286A JP15079286A JPS636851A JP S636851 A JPS636851 A JP S636851A JP 15079286 A JP15079286 A JP 15079286A JP 15079286 A JP15079286 A JP 15079286A JP S636851 A JPS636851 A JP S636851A
Authority
JP
Japan
Prior art keywords
film
thickness
semiconductor element
semiconductor device
bump electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15079286A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0515306B2 (enrdf_load_stackoverflow
Inventor
Masayuki Arai
荒井　眞幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP15079286A priority Critical patent/JPS636851A/ja
Publication of JPS636851A publication Critical patent/JPS636851A/ja
Publication of JPH0515306B2 publication Critical patent/JPH0515306B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10157—Shape being other than a cuboid at the active surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP15079286A 1986-06-26 1986-06-26 超薄形半導体装置 Granted JPS636851A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15079286A JPS636851A (ja) 1986-06-26 1986-06-26 超薄形半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15079286A JPS636851A (ja) 1986-06-26 1986-06-26 超薄形半導体装置

Publications (2)

Publication Number Publication Date
JPS636851A true JPS636851A (ja) 1988-01-12
JPH0515306B2 JPH0515306B2 (enrdf_load_stackoverflow) 1993-03-01

Family

ID=15504533

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15079286A Granted JPS636851A (ja) 1986-06-26 1986-06-26 超薄形半導体装置

Country Status (1)

Country Link
JP (1) JPS636851A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5091251A (en) * 1989-05-29 1992-02-25 Tomoegawa Paper Co., Ltd. Adhesive tapes and semiconductor devices
US5162945A (en) * 1989-06-27 1992-11-10 Asahi Kogaku Kogyo K.K. Ocular lens system
JP2004165188A (ja) * 2002-11-08 2004-06-10 Oki Electric Ind Co Ltd 半導体装置及びその製造方法
JP2008053755A (ja) * 2007-11-09 2008-03-06 Oki Electric Ind Co Ltd 半導体装置及びその製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5091251A (en) * 1989-05-29 1992-02-25 Tomoegawa Paper Co., Ltd. Adhesive tapes and semiconductor devices
US5162945A (en) * 1989-06-27 1992-11-10 Asahi Kogaku Kogyo K.K. Ocular lens system
JP2004165188A (ja) * 2002-11-08 2004-06-10 Oki Electric Ind Co Ltd 半導体装置及びその製造方法
JP2008053755A (ja) * 2007-11-09 2008-03-06 Oki Electric Ind Co Ltd 半導体装置及びその製造方法

Also Published As

Publication number Publication date
JPH0515306B2 (enrdf_load_stackoverflow) 1993-03-01

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