JPS5866646U - 混成集積回路の封止構造 - Google Patents

混成集積回路の封止構造

Info

Publication number
JPS5866646U
JPS5866646U JP1981160053U JP16005381U JPS5866646U JP S5866646 U JPS5866646 U JP S5866646U JP 1981160053 U JP1981160053 U JP 1981160053U JP 16005381 U JP16005381 U JP 16005381U JP S5866646 U JPS5866646 U JP S5866646U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
sealing structure
resin layer
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1981160053U
Other languages
English (en)
Other versions
JPS622775Y2 (ja
Inventor
風見　明
近藤　武雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP1981160053U priority Critical patent/JPS5866646U/ja
Priority to KR2019820003095U priority patent/KR860000239Y1/ko
Publication of JPS5866646U publication Critical patent/JPS5866646U/ja
Application granted granted Critical
Publication of JPS622775Y2 publication Critical patent/JPS622775Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/481—Encapsulations, e.g. protective coatings characterised by their materials comprising semiconductor materials

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来例を説明する断面図、第２図は本考案を説
明する断面図である。 主な図番の説明、１１は混成集積回路基板、１２は導電
路、１３は半導体素子、１６は封止樹脂層、１７は蓋体
、１８はシリコンレジン層である。

Claims (1)

  1. 【実用新案登録請求の範囲】 １　混成集積回路基板上に所望の導電路を設は該導電路
    上に半導体素子を固着した混成集積回路に於いて、前記
    半導体素子を保護する封止樹脂層で前記基板を覆う蓋体
    を前記基板に固着することを特徴とする混成集積回路の
    封止構造。 ２　実用新案登録請求の範囲第１項に於いて、前記半導
    体素子を囲む様に前記基板表面にシリコンレジン層を設
    は前記封止樹脂層の流れを防止することを特徴とする混
    成集積回路の封止構造。
JP1981160053U 1981-10-26 1981-10-26 混成集積回路の封止構造 Granted JPS5866646U (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1981160053U JPS5866646U (ja) 1981-10-26 1981-10-26 混成集積回路の封止構造
KR2019820003095U KR860000239Y1 (ko) 1981-10-26 1982-04-20 혼성집적회로의 봉지구조

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981160053U JPS5866646U (ja) 1981-10-26 1981-10-26 混成集積回路の封止構造

Publications (2)

Publication Number Publication Date
JPS5866646U true JPS5866646U (ja) 1983-05-06
JPS622775Y2 JPS622775Y2 (ja) 1987-01-22

Family

ID=29952483

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981160053U Granted JPS5866646U (ja) 1981-10-26 1981-10-26 混成集積回路の封止構造

Country Status (2)

Country Link
JP (1) JPS5866646U (ja)
KR (1) KR860000239Y1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10270604A (ja) * 1997-03-25 1998-10-09 Mitsumi Electric Co Ltd 電子部品モジュール

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53139206U (ja) * 1977-04-07 1978-11-04

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53139206U (ja) * 1977-04-07 1978-11-04

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10270604A (ja) * 1997-03-25 1998-10-09 Mitsumi Electric Co Ltd 電子部品モジュール

Also Published As

Publication number Publication date
KR830004331U (ko) 1983-12-30
JPS622775Y2 (ja) 1987-01-22
KR860000239Y1 (ko) 1986-03-05

Similar Documents

Publication Publication Date Title
JPS58446U (ja) 混成集積回路装置
JPS5866646U (ja) 混成集積回路の封止構造
JPS5858342U (ja) 混成集積回路
JPS6037257U (ja) 光起電力素子
JPS5866647U (ja) 混成集積回路の封止構造
JPS59146954U (ja) 混成集積回路の封止構造
JPS58168141U (ja) リ−ドレスパツケ−ジ
JPS5977231U (ja) 半導体装置
JPS60174253U (ja) 混成集積回路装置
JPS5952668U (ja) 混成集積回路
JPS5948076U (ja) プリント基板構造
JPS602841U (ja) 半導体取付基板
JPS58124960U (ja) 混成集積回路の封止構造
JPS59131158U (ja) チツプキヤリヤ−
JPS58124958U (ja) 混成集積回路の封止構造
JPS5978637U (ja) 混成集積回路装置
JPS5858343U (ja) 混成集積回路
JPS6013745U (ja) 混成集積回路
JPS6142861U (ja) 半導体装置
JPS5923744U (ja) 混成集積回路の封止構造
JPS6013746U (ja) 混成集積回路の封止構造
JPS6037243U (ja) 混成集積回路
JPS5812942U (ja) 薄膜集積回路装置
JPS59187186U (ja) 回路基板のシ−ル構造
JPS6027444U (ja) 樹脂封止形半導体装置