JPH0469836B2 - - Google Patents

Info

Publication number
JPH0469836B2
JPH0469836B2 JP62034620A JP3462087A JPH0469836B2 JP H0469836 B2 JPH0469836 B2 JP H0469836B2 JP 62034620 A JP62034620 A JP 62034620A JP 3462087 A JP3462087 A JP 3462087A JP H0469836 B2 JPH0469836 B2 JP H0469836B2
Authority
JP
Japan
Prior art keywords
solder
terminal
electronic component
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62034620A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63202989A (ja
Inventor
Seiichi Abe
Kenji Fujita
Toshuki Nakao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62034620A priority Critical patent/JPS63202989A/ja
Priority to US07/140,201 priority patent/US4821946A/en
Publication of JPS63202989A publication Critical patent/JPS63202989A/ja
Publication of JPH0469836B2 publication Critical patent/JPH0469836B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/042—Remote solder depot on the PCB, the solder flowing to the connections from this depot
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0545—Pattern for applying drops or paste; Applying a pattern made of drops or paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP62034620A 1987-02-19 1987-02-19 半田付け方法 Granted JPS63202989A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP62034620A JPS63202989A (ja) 1987-02-19 1987-02-19 半田付け方法
US07/140,201 US4821946A (en) 1987-02-19 1987-12-31 Soldering method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62034620A JPS63202989A (ja) 1987-02-19 1987-02-19 半田付け方法

Publications (2)

Publication Number Publication Date
JPS63202989A JPS63202989A (ja) 1988-08-22
JPH0469836B2 true JPH0469836B2 (en, 2012) 1992-11-09

Family

ID=12419425

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62034620A Granted JPS63202989A (ja) 1987-02-19 1987-02-19 半田付け方法

Country Status (2)

Country Link
US (1) US4821946A (en, 2012)
JP (1) JPS63202989A (en, 2012)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2647294B1 (fr) * 1989-05-18 1994-05-20 Applications Gles Electricite Me Procede de soudage de composants electriques sur un circuit conducteur imprime sur un substrat metallise isole
JPH03120789A (ja) * 1989-10-03 1991-05-22 Mitsubishi Electric Corp プリント配線板への電子部品取付法
US5011066A (en) * 1990-07-27 1991-04-30 Motorola, Inc. Enhanced collapse solder interconnection
US5233504A (en) * 1990-12-06 1993-08-03 Motorola, Inc. Noncollapsing multisolder interconnection
US5154341A (en) * 1990-12-06 1992-10-13 Motorola Inc. Noncollapsing multisolder interconnection
US5172852A (en) * 1992-05-01 1992-12-22 Motorola, Inc. Soldering method
JPH06177526A (ja) * 1992-12-09 1994-06-24 Toyota Autom Loom Works Ltd 接合剤の印刷方法
US5573171A (en) * 1995-02-16 1996-11-12 Trw Inc. Method of thin film patterning by reflow
CN1080616C (zh) * 1995-06-20 2002-03-13 松下电器产业株式会社 焊料、用焊接法贴装的电子元件及电路板
US5660321A (en) * 1996-03-29 1997-08-26 Intel Corporation Method for controlling solder bump height and volume for substrates containing both pad-on and pad-off via contacts
US5996222A (en) * 1997-01-16 1999-12-07 Ford Motor Company Soldering process with minimal thermal impact on substrate
JP2001043647A (ja) * 1999-07-15 2001-02-16 Internatl Business Mach Corp <Ibm> ハードディスク装置、スライダ保持構造、ヘッド・ジンバル・アッセンブリ及びその製造方法
US6707007B1 (en) 2003-01-10 2004-03-16 Laine Siddoway Electrically heated soldering pliers with removably attachable jaw portions
JP4812429B2 (ja) * 2005-01-31 2011-11-09 三洋電機株式会社 回路装置の製造方法
FR2897503B1 (fr) * 2006-02-16 2014-06-06 Valeo Sys Controle Moteur Sas Procede de fabrication d'un module electronique par fixation sequentielle des composants et ligne de production correspondante
JP2019062042A (ja) * 2017-09-26 2019-04-18 太陽誘電株式会社 金属端子付き電子部品および電子部品実装回路基板
JP6705479B2 (ja) * 2018-09-12 2020-06-03 日亜化学工業株式会社 光源装置の製造方法
US20240090131A1 (en) * 2022-09-14 2024-03-14 Hamilton Sundstrand Corporation Thermal management for flat no lead packages

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3451122A (en) * 1964-06-11 1969-06-24 Western Electric Co Methods of making soldered connections
US3465422A (en) * 1966-08-30 1969-09-09 Carrier Corp Brazing method employing fused glass matrix preform
US4199909A (en) * 1977-04-07 1980-04-29 Technigaz Thermally insulating, fluid-tight composite wall, prefabricated elements for constructing the same and method of constructing said wall
JPS5731317A (en) * 1980-07-29 1982-02-19 Sumitomo Electric Industries Electric equipment and wire connecting structure
JPS5992597A (ja) * 1982-11-19 1984-05-28 沖電気工業株式会社 電子部品の半田付方法

Also Published As

Publication number Publication date
JPS63202989A (ja) 1988-08-22
US4821946A (en) 1989-04-18

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