JPH04271132A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPH04271132A
JPH04271132A JP3009157A JP915791A JPH04271132A JP H04271132 A JPH04271132 A JP H04271132A JP 3009157 A JP3009157 A JP 3009157A JP 915791 A JP915791 A JP 915791A JP H04271132 A JPH04271132 A JP H04271132A
Authority
JP
Japan
Prior art keywords
insulating film
pad electrode
bonding
film
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3009157A
Other languages
English (en)
Other versions
JP2593965B2 (ja
Inventor
Shigeru Harada
繁 原田
Toshimi Endou
遠藤　豪美
Tomohiro Ishida
友弘 石田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP915791A priority Critical patent/JP2593965B2/ja
Priority to KR1019920000819A priority patent/KR960002092B1/ko
Priority to DE19924201792 priority patent/DE4201792C2/de
Publication of JPH04271132A publication Critical patent/JPH04271132A/ja
Priority to US08/249,679 priority patent/US5430329A/en
Priority to US08/416,130 priority patent/US5525546A/en
Application granted granted Critical
Publication of JP2593965B2 publication Critical patent/JP2593965B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】
【０００１】
【産業上の利用分野】この発明は、半導体素子の形成さ
れた半導体基板と外部端子を電気的に接続する技術に関
するものである。
【０００２】
【従来の技術】半導体装置では、半導体基板上に素子を
形成した後に、素子間を電気的に接続するために各種配
線が用いられる。
【０００３】また、同時に、これら半導体基板上の配線
と、半導体装置やパッケージの外部端子とを電気的に接
続することも必要であり、通常半導体基板上に形成され
た配線から引き出されたパッド電極と外部端子とを、ワ
イヤ・ボンディング法により接続するという方法が用い
られる。
【０００４】図９は、このような従来の半導体装置の構
造を示す断面図である。素子が形成された半導体チップ
２０上にボンディング・パッド電極部２１が形成され、
半導体チップ２０の主要表面は保護絶縁膜２２によって
被覆されている。半導体チップ２０を載置するダイパッ
ド部２３ａは、外部端子部（リード部）２３ｂとでリー
ド・フレーム２３を形成する。半導体チップ２０上のパ
ッド電極部２１と外部端子部（リード部）２３ｂとはボ
ンディング・ワイヤ２４によって接続され、チップ２０
はモールド樹脂材２５によって封止されている。
【０００５】次に、この半導体チップ２０の構造につい
て、図９のＡ部を拡大したものを、ＤＲＡＭ（Ｄｙｎａ
ｍｉｃ　　Ｒａｎｄｏｍ　　Ａｃｃｅｓｓ　　Ｍｅｍｏ
ｒｙ）デバイスを例として、説明する。
【０００６】図１０は、従来のＤＲＡＭデバイスの断面
構造を示す図である。シリコン半導体基板１の表面にＤ
ＲＡＭ素子（スタック・セル）２が形成され、ＤＲＡＭ
素子（スタック・セル）２上に第１の絶縁膜３が堆積さ
れ、第１の絶縁膜３上に第１の配線４が形成され、第１
の配線４上に保護絶縁膜としての第２の絶縁膜５が堆積
される。第２の絶縁膜５は図９における保護絶縁膜２２
に相当するものである。ボンディング・パッド電極６は
ボンディング・パッド電極開孔部７を介してボンディン
グワイヤ２４によって図９の外部端子（リード部）２３
ｂと接続され、モールド樹脂封止材２５によって封止さ
れている。
【０００７】以下、従来の半導体装置の製造フローの例
を、ボンディング・パッド電極部の形成工程、および、
ワイヤ・ボンディング工程を主体として概説する。
【０００８】まず図１１に示すようにシリコン半導体基
板１の表面に、素子分離用酸化膜３０１、トランスファ
ー・ゲート電極３０２、不純物拡散層３０３、ワード線
３０４、記憶ノード３０５、キャパシタ絶縁膜３０６、
セル・プレート３０７から構成されたＤＲＡＭ素子（ス
タック・セル）２を形成する。
【０００９】そして図１２に示すようにＤＲＡＭ素子（
スタック・セル）２の形成されたシリコン半導体基板１
上の全面に第１の絶縁膜３を堆積した後、写真製版やエ
ッチング法を用いて所望の部分にコンタクト孔３０８を
開孔する。
【００１０】次に、ビット線として、第１の配線４であ
るアルミ配線を形成する。最近のサブミクロン・デバイ
スでは、■コンタクト部でのアルミとシリコン基板（不
純物拡散層）との異常反応（アロイスパイク）による接
合リークを防止し、■アルミ合金膜中のシリコンが固相
エビタキシャル成長によりコンタクト部に析出すること
により発生するコンタクト不良を防止し、■アルミ配線
の上層に形成される層間絶縁膜や保護絶縁膜の膜応力に
より配線が断線する“ストレス・マイグレーション”に
対する耐性を高めるなどの理由から、第１層のアルミ配
線４として、窒化チタン（ＴｉＮ）やチタン・タングス
テン（ＴｉＷ）などのバリアメタル膜３０９と、Ａｌ−
Ｓｉ、Ａｌ−Ｓｉ−Ｃｕなどのアルミ合金膜３１０を組
み合わせた構造の配線が用いられる。
【００１１】なお、これらの膜は、通常、スパッタ法で
堆積され、写真製版やエッチング法を用い、第１のアル
ミ配線４、および、ボンディング・パッド電極部６とし
てパターニングされる。
【００１２】つぎに、例えば、シラン（ＳｉＨ４　）と
亜酸化窒素（Ｎ２　Ｏ）ガスを用い、３００〜４００℃
の膜堆積温度で、ブラズマを用いた化学気相成長法（Ｃ
ＶＤ；Ｃｈｅｍｉｃａｌ　　Ｖａｐｏｒ　　Ｄｅｐｏｓ
ｉｔｉｏｎ）により、第１の配線４上に、保護絶縁膜５
として、シリコン酸化膜を堆積する（図１３）。
【００１３】なお、保護絶縁膜５としては、シリコン酸
化膜に比べ、水分等の透過率が小さく、かつ、機械的強
度が高いという特徴を持つシリコン窒化膜やシリコン酸
窒化膜、あるいは、これらを組み合わせた膜も用いられ
る。
【００１４】これらの膜は、上記と同様のプラズマを用
いた化学気相成長法で、シリコン窒化膜の場合、例えば
、シラン（ＳｉＨ４　）とアンモニア（ＮＨ３　）ガス
を用いて堆積する。また、シリコン酸窒化膜の場合、シ
ラン（ＳｉＨ４　）とアンモニア（ＮＨ３　）と亜酸化
窒素（Ｎ２　Ｏ）ガスを用いて堆積する。
【００１５】堆積された保護絶縁膜５は、図１４に示す
ように写真製版や、エッチング法を用いて開孔され、、
ワイヤ・ボンディングを行うためのボンディング・パッ
ド電極開孔部７を形成する。
【００１６】素子の形成された半導体基板１はダイシン
グにより半導体チップ２０として切り出され、図９に示
されたようにリード・フレーム２３のダイパッド部２３
ａに半田や、導電性樹脂等を用いて接着される。
【００１７】次に、ボンディング・パッド電極開孔部７
を介してボンディング・パッド電極部６とリード・フレ
ーム２３のリード部２３ｂを金線などからなるボンディ
ング・ワイヤ２４で接続する（図１５）。
【００１８】なお、ワイヤ・ボンディング法としては、
金線などを、熱圧着、あるいは、熱圧着と超音波を併用
した接着が通常用いられる。
【００１９】最後に、モールド樹脂２５により全体をパ
ッケージする（図１６）。
【００２０】
【発明が解決しようとする課題】従来のモールド樹脂封
止型・半導体装置においては、図１７に示すように、ボ
ンディング・パッド電極部６のアルミ膜３１１が、ワイ
ヤ・ボンディング材２４の周囲で、露出している構造と
なっているため、下記のような問題点が生ずる。
【００２１】つまり、モールド樹脂２５を介して侵入し
てくる水分３１２などにより、上記の露出している部分
のアルミ膜３１１が腐食され蝕孔３１３が生じる。その
ため、ボンディング・パッド電極部６での電気的オープ
ン故障というモードの、信頼性（耐湿性）故障が発生し
やすくなるという問題である。
【００２２】半導体装置の多機能化に伴い増加する端子
ピン数に対応して、ボンディング・パッド電極部の大き
さは益々小さくなり、高密度・表面実装に対応して、導
体装置のパッケージの厚み（これはほぼモールド樹脂の
厚み）は益々薄くなり、外部から侵入する水分などの影
響を受け易くなるという最近の動向からみて、上記問題
は今後益々大きな問題となってくる。
【００２３】この発明は、上記のような問題点を解決す
るためになされたもので、ボンディング・パッド電極部
６の大きさが小さくても、パッケージの厚みが薄型であ
っても、信頼性（耐湿性）のレベルの高い半導体装置を
得ることを目的としている。
【００２４】
【課題を解決するための手段】この発明による半導体装
置は、外部端子と接続するためのパッド電極部の開孔部
の近傍の絶縁膜の少なくとも最表面に弾性をもつ絶縁膜
を設け、かつ、ワイヤ・ボンディングが前記パッド電極
の開孔部を覆う。
【００２５】
【作用】この発明における半導体装置は、配線層上のパ
ッド電極部において、前記パッド電極部の開孔部をワイ
ヤ・ボンディングにより覆うことにより、前記パッド電
極部において前記配線層を露出せず、蝕孔の形成を抑え
る。
【００２６】また前記パッド電極の開孔部の近傍に設け
られた弾性を持つ絶縁膜は、ワイヤ・ボンディング時の
機械的な力を吸収し、前記パッド電極部の近傍でのクラ
ック発生を抑える。
【００２７】
【実施例】以下、この発明の一実施例を説明する。
【００２８】図において、１はシリコン半導体基板、２
はシリコン半導体基板１表面に形成されたＤＲＡＭ素子
（スタック・セル）、３はＤＲＡＭ素子（スタック・セ
ル）２上に堆積された第１の絶縁膜、４は第１の絶縁膜
３上に形成された第１の配線、５は第１の配線４上に堆
積された第２の絶縁膜（保護絶縁膜）、６は外部端子（
リード部）２３ｂと接続するためのボンディング・パッ
ド電極部、７はボンディング・パッド電極開孔部、１０
は弾性絶縁膜、１１は弾性絶縁膜１０の開孔部、２４は
第２の絶縁膜５の開孔部１１と外部端子（リード部）２
３ｂを接続するためのボンディング・ワイヤ、２５はモ
ールド樹脂封止材、である。
【００２９】図１に示す本発明の一施例の半導体装置の
製造フローの例を、ボンディング・パッド電極部６の形
成工程、および、ワイヤ・ボンディング工程を主体とし
て図２で説明する。
【００３０】まず図２に示すようにシリコン半導体基板
１の表面に、素子分離用酸化膜３０１、トランスファー
・ゲート電極３０２、不純物拡散層３０３、ワード線３
０４、記憶ノード３０５、キャパシタ絶縁膜３０６、セ
ル・プレート３０７から構成されたＤＲＡＭ素子（スタ
ック・セル）２を形成する。
【００３１】そして図３に示すようにＤＲＡＭ素子（ス
タック・セル）２の形成されたシリコン半導体基板１上
の全面に第１の絶縁膜３を堆積した後、写真製版やエッ
チング法を用いて所望の部分にコンタクト孔３０８を開
孔する。
【００３２】次に、ビット線として第１の配線４である
アルミ配線を形成する。従来の場合と同様に窒化チタン
（ＴｉＮ）やチタン・タングステン（ＴｉＷ）などのバ
リアメタル膜３０９と、Ａｌ−Ｓｉ、Ａｌ−Ｓｉ−Ｃｕ
などのアルミ合金膜３１０を組み合わせた構造が用いら
れ、写真製版やエッチング法を用い、第１のアルミ配線
４、および、ボンディング・パッド電極部６としてパタ
ーニングされる。
【００３３】つぎに、例えば、シラン（ＳｉＨ４　）と
亜酸化窒素（Ｎ２　Ｏ）ガスを用い、３００〜４００℃
の膜堆積温度で、ブラズマを用いた化学気相成長法（Ｃ
ＶＤ；Ｃｈｅｍｉｃａｌ　　Ｖａｐｏｒ　　Ｄｅｐｏｓ
ｉｔｉｏｎ）により、第１の配線４上に、保護絶縁膜５
として、従来の場合と同様にシリコン酸化膜、シリコン
酸化膜、シリコン窒化膜、シリコン酸窒化膜などを堆積
する（図４）。
【００３４】更に写真製版や、エッチング法を用いて、
ワイヤ・ボンディングを行うためのボンディング・パッ
ド電極開孔部７を形成する（図５）。
【００３５】ただ、この場合、従来技術と異なり、ボン
ディング・パッド電極開孔部７の大きさを、ボンディン
グ・ワイヤ２４のボール径１２に比べて小さくなるよう
に設定する。
【００３６】次いで保護絶縁膜５の表面にポリイミド樹
脂系・絶縁膜やシリコーン樹脂系・絶縁膜などの弾性絶
縁膜１０を形成する。
【００３７】形成法としては、これらの樹脂材料をスピ
ン・コート法により塗布する方法が一般的である。その
後、写真製版やエッチング法を用いて、ボンディング・
パッド電極部６を露呈させ、弾性絶縁膜１０の開孔部１
１を形成する（図６）。
【００３８】このとき、弾性絶縁膜１０の開孔部１１は
、保護絶縁膜５の開孔部７よりも、内側になるようにし
、ワイヤ・ボンディング時の機械的な力が、保護絶縁膜
に直接加わらないようにする。さもないと図１８に示す
ように、ボンディング・パッド電極部６であるアルミ膜
上の保護絶縁膜５にワイヤ・ボンディング時に用いられ
る圧着や超音波などの機械的な力３１４が加わってしま
い、保護絶縁膜５にクラック３１５が生ずる。
【００３９】このクラック３１５は、外部より侵入して
くる水分３１２などが、アルミ配線４まで達し、これら
を腐食させ、蝕孔３１６を形成して断線故障を引き起こ
す原因となるので望ましくない。
【００４０】素子の形成された半導体基板１はダイシン
グにより半導体チップ２０として切り出され、従来の場
合と同様にリード・フレーム２３のダイパット部２３ａ
に半田や、導電性樹脂等を用いて接着する。
【００４１】次に、弾性絶縁膜１０の開孔部１１とリー
ド・フレーム２３のリード部２３ｂを金線などからなる
ボンディング・ワイヤ２４で接続する（図７）。
【００４２】このとき、ワイヤ・ボンディングのボール
径１２は、ボンディング・パッド電極・開孔部１１より
も大きくなるようにする。
【００４３】このようにしても、上述のように、保護絶
縁膜５の上層に形成されている、弾性絶縁膜１０がワイ
ヤ・ボンディング時に加わる機械的な力３１４が、直接
、保護絶縁膜５に加わるのを防止する作用をするので、
保護絶縁膜５にクラックが入るようなことはない。
【００４４】最後に、モールド樹脂２５により全体をパ
ッケージする（図８）。
【００４５】なお、上記実施例では、ボンディング・パ
ッド電極部６で、弾性を有する絶縁膜１０の開孔部１１
を、ボンディング・パッド開孔部７よりも、小さくした
場合の例を示したが、これは、ワイヤ・ボンディング時
の機械的な力の影響が、ワイヤ・ボンディング技術側で
低減しうる場合には、図１９に示すように、弾性絶縁膜
１０の開孔部１１と、ボンディング・パッド電極開孔部
７を同時に開孔して、ほぼ、同じ大きさにしても、同様
の効果を奏する。
【００４６】また、上記実施例では、保護絶縁膜５が、
シリコン酸化膜、シリコン窒化膜、シリコン酸窒化膜な
どの単層膜である場合について述べたが、保護絶縁膜は
、例えば、図２０に示すように、シリコン酸化膜３１７
とシリコン窒化膜３１８を積層構造としたような、上記
の膜を組み合わせた絶縁膜であっても良い。
【００４７】また、上記実施例では、配線構造が単層で
、かつ、第１の配線がアルミ配線の場合について述べた
が、図２１に示すように、第１の配線３１９は高融点金
属（Ｗ，Ｍｏ，Ｔｉ，ｅｔｃ）等の他の金属配線、高融
点金属シリサイド（ＷＳｉ２　，ＭｏＳｉ２　，ＴｉＳ
ｉ２　，ｅｔｃ）配線、あるいは、多結晶シリコン配線
であり、その上に、第２層以上のアルミなどの配線３２
０、３２１が形成された多層配線構造であっても同様の
効果を奏する。
【００４８】また、上記実施例では、保護絶縁膜５上に
形成される弾性絶縁膜１０が、単層膜である場合につい
て述べたが、例えば、図２２に示すように、ボンディン
グ・パッド開孔部７を除く半導体チップの主要部分に形
成する弾性絶縁膜３２２と、ボンディング・パッド近傍
に設ける弾性絶縁膜３２３が、異なる材質、異なる膜厚
であっても良い。弾性絶縁膜１０，３２２，３２３の材
料としてはポリイシド樹脂系絶縁膜やシリコーン樹脂系
絶縁膜を用いることができる。
【００４９】また、ボンディング・パッド開孔部７は、
小さな開孔部を複数個設けた形にしてもよい。
【００５０】また、上記実施例では、半導体基板１表面
にＤＲＡＭ素子２が形成された半導体装置に本発明を適
用した場合を述べたが、他のアルミ配線を有する半導体
装置に適用しても同様の効果を奏する。
【００５１】例えば、半導体基板表面にＳＲＡＭ（Ｓｔ
ａｔｉｃ　　ＲａｎｄｏｍＡｃｃｅｓｓ　　Ｍｅｍｏｒ
ｙ）素子を形成したものに、本発明によるボンディング
・パッド電極構造を適用した実施例を図２３に示す。
【００５２】詳細な説明は省略し、その主な構成のみを
述べるにとどめるが、図において、１はシリコン半導体
基板、４１０はシリコン半導体基板１表面に形成された
ＳＲＡＭ素子〔ダブルウェル・ＣＭＯＳ（Ｃｏｍｐｌｅ
ｍｅｎｔａｒｙ　　ＭｅｔａｌＯｘｉｄｅ　　Ｓｅｍｉ
−ｃｏｎｄｕｃｔｏｒ）構造〕、４１１はＰ形ウェル領
域、４１２はＮ形ウェル領域、４１３は素子分離用酸化
膜、４１４はゲート電極、４１５はＮ形不純物拡散層、
４１６はＰ形不純物拡散層、４１７は多結晶シリコン配
線、４１８はコンタクト孔、３はＳＲＡＭ素子３１０上
に堆積された下地絶縁膜、４は下地絶縁膜３上に形成さ
れた第１のアルミ配線、５は第１のアルミ配線４上に堆
積された第２の絶縁（保護絶縁膜）膜、６は外部端子（
リード部）２３ｂと接続するためのボンディング・パッ
ド電極、７はボンディング・パッド部開孔部、１０は、
弾性絶縁膜、１１は弾性絶縁膜１０の開孔部、２４は弾
性絶縁膜１０の開孔部１１と、外部端子（リード部）２
３ｂを接続するためのボンディング・ワイヤ、２５は、
モールド樹脂・封止材、である。
【００５３】同様に、半導体基板１表面に形成される素
子は、ＤＲＡＭ素子やＳＲＡＭ素子以外の他の素子、例
えば、ＥＰＲＯＭ（Ｅｒａｓａｂｌｅ　　Ｐｒｏｇｒａ
ｍａｂｌｅ　　Ｒｅａｄ　　Ｏｎｌｙ　　Ｍｅｍｏｒｙ
）素子、Ｅ２　ＰＲＯＭ（Ｅｌｅｃｔｒｉｃａｌ　　Ｅ
ｌａｓａｂｌｅ　　Ｐｒｏ−ｇｒａｍａｂｌｅ　　ＲＯ
Ｍ）素子、マイクロ・コンピューター回路素子、ＣＭＯ
Ｓ論理回路素子、バイポーラ・トランジスター素子等、
他の構造の素子であってもよい。
【００５４】
【発明の効果】以上に示したように、この発明による半
導体装置は、配線層上のパッド電極部の開孔部の近傍の
絶縁膜の少なくとも最表面に弾性を持つ絶縁膜を設け、
かつワイヤ・ボンディングが前記パッド電極の開孔部を
覆うので、前記パッド電極部において前記配線層は露出
せず、蝕孔の形成が抑えられ、またワイヤ・ボンディン
グ時のクラック発生をも抑え、信頼性のレベルの高い半
導体装置を得ることができる。
【図面の簡単な説明】
【図１】この発明の第１の実施例を示す断面図である。
【図２】この発明の第１の実施例の製造工程を示す断面
図である。
【図３】この発明の第１の実施例の製造工程を示す断面
図である。
【図４】この発明の第１の実施例の製造工程を示す断面
図である。
【図５】この発明の第１の実施例の製造工程を示す断面
図である。
【図６】この発明の第１の実施例の製造工程を示す断面
図である。
【図７】この発明の第１の実施例の製造工程を示す断面
図である。
【図８】この発明の第１の実施例の製造工程を示す断面
図である。
【図９】従来の半導体装置の構造を示す断面図である。
【図１０】従来のＤＲＡＭデバイスの構造を示す断面図
である。
【図１１】従来のＤＲＡＭデバイスの構造を製造工程順
に示す断面図である。
【図１２】従来のＤＲＡＭデバイスの構造を製造工程順
に示す断面図である。
【図１３】従来のＤＲＡＭデバイスの構造を製造工程順
に示す断面図である。
【図１４】従来のＤＲＡＭデバイスの構造を製造工程順
に示す断面図である。
【図１５】従来のＤＲＡＭデバイスの構造を製造工程順
に示す断面図である。
【図１６】従来のＤＲＡＭデバイスの構造を製造工程順
に示す断面図である。
【図１７】従来の技術の問題点を示す断面図である。
【図１８】従来の技術の問題点を示す断面図である。
【図１９】この発明の第２の実施例を示す断面図である
。
【図２０】この発明の第３の実施例を示す断面図である
。
【図２１】この発明の第４の実施例を示す断面図である
。
【図２２】この発明の第５の実施例を示す断面図である
。
【図２３】この発明の第６の実施例を示す断面図である
。
【符号の説明】
１　　　　　　シリコン半導体基板 ４　　　　　　配線層 ５　　　　　　第２の絶縁膜（保護絶縁膜）６　　　　
　　パッド電極部 ７　　　　　　パッド電極開孔部 １０　　　　弾性絶縁膜 ２４　　　　ワイヤ・ボンディング

Claims (1)

    【特許請求の範囲】
  1. 【請求項１】　　半導体基板上に配線層を有し、前記配
    線層上に、外部端子と接続するためのパッド電極部を有
    し、前記半導体基板の主要部がパッド電極部の開孔部を
    除き絶縁膜で覆われており、前記パッド電極と外部端子
    とをワイヤ・ボンディングにより接続する構造を有する
    半導体装置において、パッド電極部の開孔部の近傍の前
    記絶縁膜の少なくとも最表面が、弾性を持つ絶縁膜で覆
    われており、かつ、パッド電極部の開孔部は前記ワイヤ
    ・ボンディングが覆う構造を有することを特徴とする半
    導体装置。
JP915791A 1991-01-29 1991-01-29 半導体装置 Expired - Fee Related JP2593965B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP915791A JP2593965B2 (ja) 1991-01-29 1991-01-29 半導体装置
KR1019920000819A KR960002092B1 (ko) 1991-01-29 1992-01-21 반도체장치
DE19924201792 DE4201792C2 (de) 1991-01-29 1992-01-23 Anschlußelektrodenstruktur und Verfahren zu deren Herstellung
US08/249,679 US5430329A (en) 1991-01-29 1994-05-26 Semiconductor device with bonding pad electrode
US08/416,130 US5525546A (en) 1991-01-29 1995-04-03 Semiconductor device and method of manufacturing thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP915791A JP2593965B2 (ja) 1991-01-29 1991-01-29 半導体装置

Publications (2)

Publication Number Publication Date
JPH04271132A true JPH04271132A (ja) 1992-09-28
JP2593965B2 JP2593965B2 (ja) 1997-03-26

Family

ID=11712788

Family Applications (1)

Application Number Title Priority Date Filing Date
JP915791A Expired - Fee Related JP2593965B2 (ja) 1991-01-29 1991-01-29 半導体装置

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Country Link
US (2) US5430329A (ja)
JP (1) JP2593965B2 (ja)
KR (1) KR960002092B1 (ja)
DE (1) DE4201792C2 (ja)

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KR920015496A (ko) 1992-08-27
JP2593965B2 (ja) 1997-03-26

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