JPH042638B2 - - Google Patents

Info

Publication number
JPH042638B2
JPH042638B2 JP25547087A JP25547087A JPH042638B2 JP H042638 B2 JPH042638 B2 JP H042638B2 JP 25547087 A JP25547087 A JP 25547087A JP 25547087 A JP25547087 A JP 25547087A JP H042638 B2 JPH042638 B2 JP H042638B2
Authority
JP
Japan
Prior art keywords
group
adhesive
epoxy resin
imidazole
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP25547087A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0196278A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP25547087A priority Critical patent/JPH0196278A/ja
Publication of JPH0196278A publication Critical patent/JPH0196278A/ja
Publication of JPH042638B2 publication Critical patent/JPH042638B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
JP25547087A 1987-10-08 1987-10-08 接着剤 Granted JPH0196278A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25547087A JPH0196278A (ja) 1987-10-08 1987-10-08 接着剤

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25547087A JPH0196278A (ja) 1987-10-08 1987-10-08 接着剤

Publications (2)

Publication Number Publication Date
JPH0196278A JPH0196278A (ja) 1989-04-14
JPH042638B2 true JPH042638B2 (enExample) 1992-01-20

Family

ID=17279214

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25547087A Granted JPH0196278A (ja) 1987-10-08 1987-10-08 接着剤

Country Status (1)

Country Link
JP (1) JPH0196278A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011045941A1 (ja) 2009-10-16 2011-04-21 日本曹達株式会社 エポキシ硬化樹脂形成用組成物及びその硬化物
US8623942B2 (en) 2009-03-11 2014-01-07 Nippon Soda Co., Ltd. Epoxy resin composition, curing agent, and curing accelerator

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0348919A3 (de) * 1988-06-28 1990-08-22 SKW Trostberg Aktiengesellschaft Additiv für hitzehärtbare Epoxidharzmassen
US8735529B2 (en) 2006-12-21 2014-05-27 Nippon Soda Co., Ltd. Clathrate compound, curing catalyst, composition for forming cured resin, and cured resin
MY150836A (en) 2007-09-21 2014-02-28 Nippon Soda Co Inclusion complex containing epoxy resin composition for semiconductor encapsulation
KR101349996B1 (ko) * 2009-03-17 2014-01-13 닛뽕소다 가부시키가이샤 포접 착물, 경화제, 경화 촉진제, 에폭시 수지 조성물 및 반도체 밀봉용 에폭시 수지 조성물
JP5546914B2 (ja) * 2009-03-19 2014-07-09 日本曹達株式会社 新規な包接錯体、エポキシ樹脂組成物及び半導体封止用エポキシ樹脂組成物
TWI473831B (zh) * 2010-09-15 2015-02-21 Nippon Soda Co Liquid hardened epoxy resin composition and a binder containing the same
JP5642147B2 (ja) * 2012-12-27 2014-12-17 学校法人 関西大学 熱伝導性導電性接着剤組成物
WO2018035007A1 (en) * 2016-08-15 2018-02-22 Evonik Degussa Gmbh Anhydride epoxy curing agents having imidazole salt additives for epoxy resin systems
CN110062783A (zh) * 2016-12-12 2019-07-26 赢创德固赛有限公司 新的低温酸酐环氧固化体系
KR102204964B1 (ko) * 2018-04-17 2021-01-19 주식회사 엘지화학 반도체 회로 접속용 접착제 조성물 및 이를 포함한 접착 필름
JP7166525B2 (ja) * 2019-03-28 2022-11-08 味の素株式会社 エポキシ樹脂組成物
CN115304885A (zh) * 2022-08-18 2022-11-08 湖南亿润新材料科技有限公司 一种中温固化高Tg低溴环氧树脂半固化片的制备方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8623942B2 (en) 2009-03-11 2014-01-07 Nippon Soda Co., Ltd. Epoxy resin composition, curing agent, and curing accelerator
WO2011045941A1 (ja) 2009-10-16 2011-04-21 日本曹達株式会社 エポキシ硬化樹脂形成用組成物及びその硬化物
US9068074B2 (en) 2009-10-16 2015-06-30 Nippon Soda Co., Ltd. Composition for formation of cured epoxy resin, and cured products thereof

Also Published As

Publication number Publication date
JPH0196278A (ja) 1989-04-14

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