JPH0196278A - 接着剤 - Google Patents

接着剤

Info

Publication number
JPH0196278A
JPH0196278A JP25547087A JP25547087A JPH0196278A JP H0196278 A JPH0196278 A JP H0196278A JP 25547087 A JP25547087 A JP 25547087A JP 25547087 A JP25547087 A JP 25547087A JP H0196278 A JPH0196278 A JP H0196278A
Authority
JP
Japan
Prior art keywords
adhesive
imidazole
addition salt
epoxy resin
acid addition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP25547087A
Other languages
English (en)
Japanese (ja)
Other versions
JPH042638B2 (enExample
Inventor
Akio Oura
大浦　昭雄
Hisashi Kondo
寿 近藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP25547087A priority Critical patent/JPH0196278A/ja
Publication of JPH0196278A publication Critical patent/JPH0196278A/ja
Publication of JPH042638B2 publication Critical patent/JPH042638B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components

Landscapes

  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP25547087A 1987-10-08 1987-10-08 接着剤 Granted JPH0196278A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25547087A JPH0196278A (ja) 1987-10-08 1987-10-08 接着剤

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25547087A JPH0196278A (ja) 1987-10-08 1987-10-08 接着剤

Publications (2)

Publication Number Publication Date
JPH0196278A true JPH0196278A (ja) 1989-04-14
JPH042638B2 JPH042638B2 (enExample) 1992-01-20

Family

ID=17279214

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25547087A Granted JPH0196278A (ja) 1987-10-08 1987-10-08 接着剤

Country Status (1)

Country Link
JP (1) JPH0196278A (enExample)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5001212A (en) * 1988-06-28 1991-03-19 Skw Trostberg Aktiengesellschaft Additive for heat-hardenable epoxide resin masses
WO2010103809A1 (ja) * 2009-03-11 2010-09-16 日本曹達株式会社 エポキシ樹脂組成物、硬化剤及び硬化促進剤
JP2010242074A (ja) * 2009-03-19 2010-10-28 Nippon Soda Co Ltd 新規な包接錯体、エポキシ樹脂組成物及び半導体封止用エポキシ樹脂組成物
CN102356109A (zh) * 2009-03-17 2012-02-15 日本曹达株式会社 包合配合物、固化剂、固化促进剂、环氧树脂组合物及半导体封装用环氧树脂组合物
US20130158231A1 (en) * 2010-09-15 2013-06-20 Nippon Soda Co., Ltd. Liquid curable epoxy resin composition and adhesive agent containing same
US8653160B2 (en) 2007-09-21 2014-02-18 Nippon Soda Co., Ltd. Inclusion complex containing epoxy resin composition for semiconductor encapsulation
JP5474995B2 (ja) * 2009-10-16 2014-04-16 日本曹達株式会社 エポキシ硬化樹脂形成用組成物及びその硬化物
US8735529B2 (en) 2006-12-21 2014-05-27 Nippon Soda Co., Ltd. Clathrate compound, curing catalyst, composition for forming cured resin, and cured resin
WO2014104046A1 (ja) * 2012-12-27 2014-07-03 学校法人 関西大学 熱伝導性導電性接着剤組成物
KR20190035904A (ko) * 2016-08-15 2019-04-03 에보니크 데구사 게엠베하 에폭시 수지 시스템을 위한 이미다졸 염 첨가제를 갖는 무수물 에폭시 경화제
KR20190091544A (ko) * 2016-12-12 2019-08-06 에보니크 데구사 게엠베하 신규한 저온 무수물 에폭시 경화된 시스템
JP2020158727A (ja) * 2019-03-28 2020-10-01 味の素株式会社 エポキシ樹脂組成物
TWI742362B (zh) * 2018-04-17 2021-10-11 南韓商Ｌｇ化學股份有限公司 用於半導體電路連接之黏著劑組成物及含彼之黏著膜
CN115304885A (zh) * 2022-08-18 2022-11-08 湖南亿润新材料科技有限公司 一种中温固化高Tg低溴环氧树脂半固化片的制备方法

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5001212A (en) * 1988-06-28 1991-03-19 Skw Trostberg Aktiengesellschaft Additive for heat-hardenable epoxide resin masses
US8735529B2 (en) 2006-12-21 2014-05-27 Nippon Soda Co., Ltd. Clathrate compound, curing catalyst, composition for forming cured resin, and cured resin
US8653160B2 (en) 2007-09-21 2014-02-18 Nippon Soda Co., Ltd. Inclusion complex containing epoxy resin composition for semiconductor encapsulation
WO2010103809A1 (ja) * 2009-03-11 2010-09-16 日本曹達株式会社 エポキシ樹脂組成物、硬化剤及び硬化促進剤
KR101331381B1 (ko) * 2009-03-11 2013-11-20 닛뽕소다 가부시키가이샤 에폭시 수지 조성물, 경화제 및 경화 촉진제
US8623942B2 (en) 2009-03-11 2014-01-07 Nippon Soda Co., Ltd. Epoxy resin composition, curing agent, and curing accelerator
CN102356109A (zh) * 2009-03-17 2012-02-15 日本曹达株式会社 包合配合物、固化剂、固化促进剂、环氧树脂组合物及半导体封装用环氧树脂组合物
JP2010242074A (ja) * 2009-03-19 2010-10-28 Nippon Soda Co Ltd 新規な包接錯体、エポキシ樹脂組成物及び半導体封止用エポキシ樹脂組成物
US9068074B2 (en) 2009-10-16 2015-06-30 Nippon Soda Co., Ltd. Composition for formation of cured epoxy resin, and cured products thereof
JP5474995B2 (ja) * 2009-10-16 2014-04-16 日本曹達株式会社 エポキシ硬化樹脂形成用組成物及びその硬化物
US20130158231A1 (en) * 2010-09-15 2013-06-20 Nippon Soda Co., Ltd. Liquid curable epoxy resin composition and adhesive agent containing same
WO2014104046A1 (ja) * 2012-12-27 2014-07-03 学校法人 関西大学 熱伝導性導電性接着剤組成物
CN104968746A (zh) * 2012-12-27 2015-10-07 学校法人关西大学 热传导性导电性粘接剂组合物
KR20190035904A (ko) * 2016-08-15 2019-04-03 에보니크 데구사 게엠베하 에폭시 수지 시스템을 위한 이미다졸 염 첨가제를 갖는 무수물 에폭시 경화제
JP2019524967A (ja) * 2016-08-15 2019-09-05 エボニック デグサ ゲーエムベーハーＥｖｏｎｉｋ Ｄｅｇｕｓｓａ ＧｍｂＨ エポキシ樹脂系用のイミダゾール塩添加剤を含有する酸無水物エポキシ硬化剤
KR20190091544A (ko) * 2016-12-12 2019-08-06 에보니크 데구사 게엠베하 신규한 저온 무수물 에폭시 경화된 시스템
JP2020501000A (ja) * 2016-12-12 2020-01-16 エボニック デグサ ゲーエムベーハーＥｖｏｎｉｋ Ｄｅｇｕｓｓａ ＧｍｂＨ 新規な低温酸無水物エポキシ硬化系
US11286336B2 (en) 2016-12-12 2022-03-29 Evonik Operations Gmbh Low temperature anhydride epoxy cured systems
TWI742362B (zh) * 2018-04-17 2021-10-11 南韓商Ｌｇ化學股份有限公司 用於半導體電路連接之黏著劑組成物及含彼之黏著膜
US11834415B2 (en) 2018-04-17 2023-12-05 Lg Chem, Ltd. Adhesive composition for semiconductor circuit connection and adhesive film including the same
JP2020158727A (ja) * 2019-03-28 2020-10-01 味の素株式会社 エポキシ樹脂組成物
CN115304885A (zh) * 2022-08-18 2022-11-08 湖南亿润新材料科技有限公司 一种中温固化高Tg低溴环氧树脂半固化片的制备方法

Also Published As

Publication number Publication date
JPH042638B2 (enExample) 1992-01-20

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