JPH041501B2 - - Google Patents
Info
- Publication number
- JPH041501B2 JPH041501B2 JP57042179A JP4217982A JPH041501B2 JP H041501 B2 JPH041501 B2 JP H041501B2 JP 57042179 A JP57042179 A JP 57042179A JP 4217982 A JP4217982 A JP 4217982A JP H041501 B2 JPH041501 B2 JP H041501B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive pattern
- semiconductor element
- semiconductor device
- frame
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W70/695—
-
- H10W72/884—
-
- H10W90/734—
-
- H10W90/754—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57042179A JPS58159355A (ja) | 1982-03-17 | 1982-03-17 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57042179A JPS58159355A (ja) | 1982-03-17 | 1982-03-17 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58159355A JPS58159355A (ja) | 1983-09-21 |
| JPH041501B2 true JPH041501B2 (cg-RX-API-DMAC10.html) | 1992-01-13 |
Family
ID=12628757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57042179A Granted JPS58159355A (ja) | 1982-03-17 | 1982-03-17 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58159355A (cg-RX-API-DMAC10.html) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6038842A (ja) * | 1983-08-12 | 1985-02-28 | Hitachi Ltd | ピングリッドアレイ型半導体パッケージ |
| JPS6059756A (ja) * | 1983-09-12 | 1985-04-06 | Ibiden Co Ltd | プラグインパッケ−ジとその製造方法 |
| JPS6095943A (ja) * | 1983-10-31 | 1985-05-29 | Ibiden Co Ltd | プラグインパツケ−ジとその製造方法 |
| JPS6095944A (ja) * | 1983-10-31 | 1985-05-29 | Ibiden Co Ltd | プラグインパツケ−ジとその製造方法 |
| JPS60101998A (ja) * | 1983-11-07 | 1985-06-06 | イビデン株式会社 | プラグインパツケ−ジとその製造方法 |
| JPS60241244A (ja) * | 1984-05-16 | 1985-11-30 | Hitachi Micro Comput Eng Ltd | ピングリッドアレイ型半導体装置の製造方法 |
| JPS6194359U (cg-RX-API-DMAC10.html) * | 1984-11-27 | 1986-06-18 | ||
| FR2575331B1 (fr) * | 1984-12-21 | 1987-06-05 | Labo Electronique Physique | Boitier pour composant electronique |
| US4661192A (en) * | 1985-08-22 | 1987-04-28 | Motorola, Inc. | Low cost integrated circuit bonding process |
| JPS62194655A (ja) * | 1985-11-20 | 1987-08-27 | アンプ―アクゾ コーポレイション | 電子装置用接続パツケ−ジ及びその製造方法 |
| JPS62248244A (ja) * | 1986-04-21 | 1987-10-29 | Hitachi Cable Ltd | Pga用リ−ドフレ−ム |
| JPH0821672B2 (ja) * | 1987-07-04 | 1996-03-04 | 株式会社堀場製作所 | イオン濃度測定用シート型電極の製造方法 |
| US5255430A (en) * | 1992-10-08 | 1993-10-26 | Atmel Corporation | Method of assembling a module for a smart card |
| US5798909A (en) * | 1995-02-15 | 1998-08-25 | International Business Machines Corporation | Single-tiered organic chip carriers for wire bond-type chips |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5926618Y2 (ja) * | 1979-12-11 | 1984-08-02 | パイオニア株式会社 | スル−ホ−ル基板 |
-
1982
- 1982-03-17 JP JP57042179A patent/JPS58159355A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58159355A (ja) | 1983-09-21 |
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