JPH0414494B2 - - Google Patents

Info

Publication number
JPH0414494B2
JPH0414494B2 JP58248427A JP24842783A JPH0414494B2 JP H0414494 B2 JPH0414494 B2 JP H0414494B2 JP 58248427 A JP58248427 A JP 58248427A JP 24842783 A JP24842783 A JP 24842783A JP H0414494 B2 JPH0414494 B2 JP H0414494B2
Authority
JP
Japan
Prior art keywords
wafer
processed
brushes
rotating
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58248427A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60143634A (ja
Inventor
Nobuo Iijima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP58248427A priority Critical patent/JPS60143634A/ja
Publication of JPS60143634A publication Critical patent/JPS60143634A/ja
Publication of JPH0414494B2 publication Critical patent/JPH0414494B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3046—Mechanical treatment, e.g. grinding, polishing, cutting using blasting, e.g. sand-blasting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP58248427A 1983-12-29 1983-12-29 ウエ−ハ処理方法及び装置 Granted JPS60143634A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58248427A JPS60143634A (ja) 1983-12-29 1983-12-29 ウエ−ハ処理方法及び装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58248427A JPS60143634A (ja) 1983-12-29 1983-12-29 ウエ−ハ処理方法及び装置

Publications (2)

Publication Number Publication Date
JPS60143634A JPS60143634A (ja) 1985-07-29
JPH0414494B2 true JPH0414494B2 (enrdf_load_stackoverflow) 1992-03-13

Family

ID=17177959

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58248427A Granted JPS60143634A (ja) 1983-12-29 1983-12-29 ウエ−ハ処理方法及び装置

Country Status (1)

Country Link
JP (1) JPS60143634A (enrdf_load_stackoverflow)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6260225A (ja) * 1985-09-10 1987-03-16 Toshiba Ceramics Co Ltd シリコンウエハの洗浄方法
JPS62121098U (enrdf_load_stackoverflow) * 1986-01-27 1987-07-31
JPS6310548U (enrdf_load_stackoverflow) * 1986-07-08 1988-01-23
JPH0795540B2 (ja) * 1988-04-11 1995-10-11 株式会社日立製作所 超音波洗浄スプレイノズルを用いた基板両面の洗浄方法及び洗浄装置
JP2767165B2 (ja) * 1991-07-31 1998-06-18 信越半導体株式会社 ウエーハ洗浄槽
JP2890915B2 (ja) * 1991-08-13 1999-05-17 信越半導体株式会社 ウエーハのブラシ洗浄装置
US6003185A (en) * 1994-07-15 1999-12-21 Ontrak Systems, Inc. Hesitation free roller
JPH08188249A (ja) * 1995-01-05 1996-07-23 Murata Mach Ltd パレットへの物品の段積装置
JP2564661Y2 (ja) * 1995-01-11 1998-03-09 株式会社エンヤシステム 貼付板洗浄装置
US5675856A (en) * 1996-06-14 1997-10-14 Solid State Equipment Corp. Wafer scrubbing device
US5862560A (en) * 1996-08-29 1999-01-26 Ontrak Systems, Inc. Roller with treading and system including the same
EP0837493B8 (en) * 1996-10-21 2007-11-07 Ebara Corporation Cleaning apparatus
US5901399A (en) * 1996-12-30 1999-05-11 Intel Corporation Flexible-leaf substrate edge cleaning apparatus
US5868857A (en) 1996-12-30 1999-02-09 Intel Corporation Rotating belt wafer edge cleaning apparatus
JPH10321572A (ja) * 1997-05-15 1998-12-04 Toshiba Corp 半導体ウェーハの両面洗浄装置及び半導体ウェーハのポリッシング方法
JP2000176386A (ja) * 1998-12-16 2000-06-27 Ebara Corp 基板洗浄装置
US6711775B2 (en) * 1999-06-10 2004-03-30 Lam Research Corporation System for cleaning a semiconductor wafer
KR20010037210A (ko) * 1999-10-14 2001-05-07 구본준, 론 위라하디락사 기판 세정 장치 및 기판 세정 방법
JP6145334B2 (ja) * 2013-06-28 2017-06-07 株式会社荏原製作所 基板処理装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5184371U (enrdf_load_stackoverflow) * 1974-12-26 1976-07-06

Also Published As

Publication number Publication date
JPS60143634A (ja) 1985-07-29

Similar Documents

Publication Publication Date Title
JPH0414494B2 (enrdf_load_stackoverflow)
KR100412542B1 (ko) 작업물의세정방법및장치
US5966765A (en) Cleaning apparatus
KR101796651B1 (ko) 유체 제트를 구비한 디스크-브러시 세정장치 모듈
US6910240B1 (en) Wafer bevel edge cleaning system and apparatus
KR20140099191A (ko) 기판 이면의 연마 방법 및 기판 처리 장치
US6560809B1 (en) Substrate cleaning apparatus
US6261377B1 (en) Method of removing particles and a liquid from a surface of substrate
CN113664009A (zh) 一种晶圆清洗装置
JP3560051B2 (ja) 基板の研磨方法及び装置
JP2001096245A (ja) 洗浄方法および洗浄装置
US10651057B2 (en) Apparatus and method for cleaning a back surface of a substrate
US6079073A (en) Washing installation including plural washers
JP6125884B2 (ja) 基板処理装置及び処理基板の製造方法
JP2003093978A (ja) キャリヤプレートの洗浄方法及び装置
JPH1131674A (ja) ウェーハ洗浄装置
JPH10335283A (ja) 洗浄設備及び洗浄方法
JPH10223583A (ja) ブラシ式洗浄装置
JP2001212531A (ja) 洗浄装置
US6813796B2 (en) Apparatus and methods to clean copper contamination on wafer edge
JP2017147334A (ja) 基板の裏面を洗浄する装置および方法
TWI417951B (zh) 基板液體處理裝置、基板液體處理方法及儲存有基板液體處理程式的記憶媒體
JP6892176B1 (ja) ワーク洗浄装置
JP6122684B2 (ja) 基板処理装置及び処理基板の製造方法
JP6144531B2 (ja) 基板処理装置及び処理基板の製造方法