| US4746578A
              (en)
            
            * | 1984-01-09 | 1988-05-24 | Ngk Spark Plug Co., Ltd. | Glaze compositions for ceramic substrates | 
        
          | JPH0611669B2
              (ja)
            
            * | 1984-07-25 | 1994-02-16 | 株式会社住友金属セラミックス | 低温焼成セラミツクス | 
        
          | US5068210A
              (en)
            
            * | 1986-04-18 | 1991-11-26 | Tektronix, Inc. | Low dielectric constant ceramic materials | 
        
          | US5045402A
              (en)
            
            * | 1986-08-01 | 1991-09-03 | International Business Machines Corporation | Zirconia toughening of glass-ceramic materials | 
        
          | US5185215A
              (en)
            
            * | 1986-08-01 | 1993-02-09 | International Business Machines Corporation | Zirconia toughening of glass-ceramic materials | 
        
          | US5173331A
              (en)
            
            * | 1986-08-01 | 1992-12-22 | International Business Machines Corporation | Zirconia toughening of glass-ceramic materials | 
        
          | JPH0617249B2
              (ja)
            
            * | 1986-08-15 | 1994-03-09 | 松下電工株式会社 | ガラスセラミツク焼結体 | 
        
          | JPH0617250B2
              (ja)
            
            * | 1986-09-19 | 1994-03-09 | 松下電工株式会社 | ガラスセラミツク焼結体 | 
        
          | US4997795A
              (en)
            
            * | 1986-10-02 | 1991-03-05 | General Electric Company | Dielectric compositions of devitrified glass containing small amounts of lead oxide and iron oxide | 
        
          | US4879261A
              (en)
            
            * | 1987-01-13 | 1989-11-07 | E. I. Du Pont De Nemours And Company | Low Dielectric constant compositions | 
        
          | US4935844A
              (en)
            
            * | 1987-01-13 | 1990-06-19 | Ian Burn | Low dielectric constant compositions | 
        
          | JPS63181400A
              (ja)
            
            * | 1987-01-22 | 1988-07-26 | 松下電器産業株式会社 | セラミツク多層基板 | 
        
          | US4788046A
              (en)
            
            * | 1987-08-13 | 1988-11-29 | Ceramics Process Systems Corporation | Method for producing materials for co-sintering | 
        
          | US4849380A
              (en)
            
            * | 1988-01-28 | 1989-07-18 | E. I. Du Pont De Nemours And Company | Dielectric composition | 
        
          | US4849379A
              (en)
            
            * | 1988-01-28 | 1989-07-18 | E. I. Du Pont De Nemours And Company | Dielectric composition | 
        
          | US5393604A
              (en)
            
            * | 1988-01-28 | 1995-02-28 | Mcdonnell Douglas Corporation | Production of silica "green" tape and co-fired silica substrates therefrom | 
        
          | US4978640A
              (en)
            
            * | 1988-02-24 | 1990-12-18 | Massachusetts Institute Of Technology | Dispersion strengthened composite | 
        
          | US5043302A
              (en)
            
            * | 1988-03-25 | 1991-08-27 | The United States Of America As Represented By The Secretary Of The Navy | Glassy binder system for ceramic substrates, thick films and the like | 
        
          | DE4007156C1
              (OSRAM)
            
            * | 1990-03-07 | 1991-09-26 | W.C. Heraeus Gmbh, 6450 Hanau, De |  | 
        
          | US5212121A
              (en)
            
            * | 1990-06-13 | 1993-05-18 | Mitsui Mining Company, Limited | Raw batches for ceramic substrates, substrates produced from the raw batches, and production process of the substrates | 
        
          | US5124282A
              (en)
            
            * | 1990-11-21 | 1992-06-23 | David Sarnoff Research Center, Inc. | Glasses and overglaze inks made therefrom | 
        
          | JP2642253B2
              (ja)
            
            * | 1991-02-27 | 1997-08-20 | 日本特殊陶業株式会社 | ガラス−セラミックス複合体 | 
        
          | JPH0723252B2
              (ja)
            
            * | 1991-07-31 | 1995-03-15 | 日本電気株式会社 | 低温焼結性低誘電率無機組成物 | 
        
          | US5242867A
              (en)
            
            * | 1992-03-04 | 1993-09-07 | Industrial Technology Research Institute | Composition for making multilayer ceramic substrates and dielectric materials with low firing temperature | 
        
          | US5922444A
              (en)
            
            * | 1992-10-27 | 1999-07-13 | Ngk Spark Plug Co., Ltd. | Glaze composition | 
        
          | US5391841A
              (en)
            
            * | 1992-12-08 | 1995-02-21 | Quick; Nathaniel R. | Laser processed coatings on electronic circuit substrates | 
        
          | US5447891A
              (en)
            
            * | 1993-09-29 | 1995-09-05 | Ferro Corporation | Lead-free glaze or enamel for use on ceramic bodies | 
        
          | US5397830A
              (en)
            
            * | 1994-01-24 | 1995-03-14 | Ferro Corporation | Dielectric materials | 
        
          | US5714246A
              (en)
            
            * | 1994-05-13 | 1998-02-03 | Ferro Corporation | Conductive silver low temperature cofired metallic green tape | 
        
          | JP3121990B2
              (ja)
            
            * | 1994-07-25 | 2001-01-09 | 京セラ株式会社 | ガラス−セラミック基板 | 
        
          | EP1083600B1
              (en)
            
            * | 1994-08-19 | 2007-02-14 | Hitachi, Ltd. | Multilayered circuit substrate | 
        
          | US5518968A
              (en)
            
            * | 1994-10-17 | 1996-05-21 | Cooper Industries, Inc. | Low-temperature lead-free glaze for alumina ceramics | 
        
          | US5637261A
              (en)
            
            * | 1994-11-07 | 1997-06-10 | The Curators Of The University Of Missouri | Aluminum nitride-compatible thick-film binder glass and thick-film paste composition | 
        
          | DE69623930T2
              (de)
            
            * | 1995-01-27 | 2003-05-15 | Sarnoff Corp., Princeton | Gläser mit niedrigem dielektrischem verlust | 
        
          | US6670693B1
              (en) | 1996-12-05 | 2003-12-30 | Nathaniel R. Quick | Laser synthesized wide-bandgap semiconductor electronic devices and circuits | 
        
          | US6271576B1
              (en)
            
            * | 1996-12-05 | 2001-08-07 | Nathaniel R. Quick | Laser synthesized ceramic sensors and method for making | 
        
          | JP3647130B2
              (ja)
            
            * | 1996-02-06 | 2005-05-11 | 昭栄化学工業株式会社 | 絶縁体ガラス組成物とこれを用いた厚膜多層回路絶縁層用ガラス組成物 | 
        
          | US6120906A
              (en)
            
            * | 1997-03-31 | 2000-09-19 | Kyocera Corporation | Insulated board for a wiring board | 
        
          | EP0897897A1
              (de)
            
            * | 1997-08-18 | 1999-02-24 | Siemens Aktiengesellschaft | Composit-Glaslot, Verwendung eines Composit-Glaslotes und Hochtemperatur-Brennstoffzelle | 
        
          | US5985473A
              (en)
            
            * | 1997-11-17 | 1999-11-16 | Cooper Automotive Products, Inc. | Low-temperature barium/lead-free glaze for alumina ceramics | 
        
          | US6184163B1
              (en)
            
            * | 1998-03-26 | 2001-02-06 | Lg Electronics Inc. | Dielectric composition for plasma display panel | 
        
          | JP3860336B2
              (ja)
            
            * | 1998-04-28 | 2006-12-20 | 日本特殊陶業株式会社 | ガラスセラミック複合体 | 
        
          | KR100301661B1
              (ko)
            
            * | 1998-04-30 | 2001-11-14 | 구자홍 | 플라즈마표시장치용유전체조성물 | 
        
          | US6136734A
              (en)
            
            * | 1998-08-18 | 2000-10-24 | Advanced Ceramic X Corp. | Low-fire, low-dielectric ceramic compositions | 
        
          | FR2784696B1
              (fr)
            
            * | 1998-10-14 | 2000-11-10 | Lorraine Laminage | Composition d'emaillage permettant d'eviter les coups d'ongle et tole emaillee obtenue | 
        
          | DK1010675T3
              (da) | 1998-12-15 | 2009-04-14 | Topsoe Fuel Cell As | Höjtemperaturforseglingsmateriale | 
        
          | US6174829B1
              (en)
            
            * | 1999-01-07 | 2001-01-16 | Advanced Ceramic X Corp. | Ceramic dielectric compositions | 
        
          | US6159883A
              (en)
            
            * | 1999-01-07 | 2000-12-12 | Advanced Ceramic X Corp. | Ceramic dielectric compositions | 
        
          | US6348427B1
              (en)
            
            * | 1999-02-01 | 2002-02-19 | Kyocera Corporation | High-thermal-expansion glass ceramic sintered product | 
        
          | CA2387242C
              (en)
            
            * | 1999-10-12 | 2009-05-12 | Aos Holding Company | Water-resistant porcelain enamel coatings and method of manufacturing same | 
        
          | US7410672B2
              (en) | 1999-10-12 | 2008-08-12 | Aos Holding Company | Water-resistant porcelain enamel coatings and method of manufacturing same | 
        
          | JP4497627B2
              (ja)
            
            * | 1999-10-29 | 2010-07-07 | 京セラ株式会社 | ガラスセラミック焼結体およびその製造方法、配線基板ならびにその実装構造 | 
        
          | US6732562B2
              (en)
            
            * | 2000-05-09 | 2004-05-11 | University Of Central Florida | Apparatus and method for drawing continuous fiber | 
        
          | JP2002338295A
              (ja)
            
            * | 2001-05-17 | 2002-11-27 | Asahi Glass Co Ltd | 無アルカリガラス、電子回路基板用組成物および電子回路基板 | 
        
          | KR100592603B1
              (ko) | 2002-05-20 | 2006-06-23 | 엔지케이 스파크 플러그 캄파니 리미티드 | 유전체 자기 | 
        
          | KR20060003861A
              (ko)
            
            * | 2003-04-21 | 2006-01-11 | 아사히 가라스 가부시키가이샤 | 유전체 형성용 무연 유리, 유전체 형성용 유리 세라믹스조성물, 유전체 및 적층 유전체 제조 방법 | 
        
          | US6939748B1
              (en) | 2003-10-13 | 2005-09-06 | Nathaniel R. Quick | Nano-size semiconductor component and method of making | 
        
          | US8617965B1
              (en) | 2004-02-19 | 2013-12-31 | Partial Assignment to University of Central Florida | Apparatus and method of forming high crystalline quality layer | 
        
          | US7618880B1
              (en)
            
            * | 2004-02-19 | 2009-11-17 | Quick Nathaniel R | Apparatus and method for transformation of substrate | 
        
          | US7268063B1
              (en)
            
            * | 2004-06-01 | 2007-09-11 | University Of Central Florida | Process for fabricating semiconductor component | 
        
          | US7419887B1
              (en) | 2004-07-26 | 2008-09-02 | Quick Nathaniel R | Laser assisted nano deposition | 
        
          | US7951632B1
              (en)
            
            * | 2005-01-26 | 2011-05-31 | University Of Central Florida | Optical device and method of making | 
        
          | JP4650794B2
              (ja)
            
            * | 2005-07-01 | 2011-03-16 | 昭栄化学工業株式会社 | 積層電子部品用導体ペーストおよびそれを用いた積層電子部品 | 
        
          | US7811914B1
              (en)
            
            * | 2006-04-20 | 2010-10-12 | Quick Nathaniel R | Apparatus and method for increasing thermal conductivity of a substrate | 
        
          | US8617669B1
              (en) | 2006-04-20 | 2013-12-31 | Partial Assignment to University of Central Florida | Laser formation of graphene | 
        
          | US8067303B1
              (en) | 2006-09-12 | 2011-11-29 | Partial Assignment University of Central Florida | Solid state energy conversion device | 
        
          | JP5128203B2
              (ja) | 2007-08-22 | 2013-01-23 | 日本山村硝子株式会社 | 封着用ガラス組成物 | 
        
          | US8114693B1
              (en) | 2007-09-18 | 2012-02-14 | Partial Assignment University of Central Florida | Method of fabricating solid state gas dissociating device by laser doping | 
        
          | US7989374B2
              (en)
            
            * | 2008-05-15 | 2011-08-02 | Corning Incorporated | Non-contaminating, electro-chemically stable glass frit sealing materials and seals and devices using such sealing materials | 
        
          | KR20110108342A
              (ko)
            
            * | 2008-12-02 | 2011-10-05 | 유니버시티 오브 센트럴 플로리다 | 에너지 변환 장치 | 
        
          | JP5906888B2
              (ja)
            
            * | 2012-03-29 | 2016-04-20 | 旭硝子株式会社 | ガラスフリットおよび結晶化ガラス | 
        
          | US9059079B1
              (en) | 2012-09-26 | 2015-06-16 | Ut-Battelle, Llc | Processing of insulators and semiconductors | 
        
          | US9601641B1
              (en) | 2013-12-10 | 2017-03-21 | AppliCote Associates, LLC | Ultra-high pressure doping of materials | 
        
          | US9620667B1
              (en) | 2013-12-10 | 2017-04-11 | AppliCote Associates LLC | Thermal doping of materials | 
        
          | JP7494908B2
              (ja)
            
            * | 2020-06-17 | 2024-06-04 | 株式会社村田製作所 | ガラスセラミックス及び積層セラミック電子部品 | 
        
          | WO2023095605A1
              (ja)
            
            * | 2021-11-25 | 2023-06-01 | 株式会社村田製作所 | ガラスセラミックス及び電子部品 |