JPH0345488B2 - - Google Patents

Info

Publication number
JPH0345488B2
JPH0345488B2 JP59007576A JP757684A JPH0345488B2 JP H0345488 B2 JPH0345488 B2 JP H0345488B2 JP 59007576 A JP59007576 A JP 59007576A JP 757684 A JP757684 A JP 757684A JP H0345488 B2 JPH0345488 B2 JP H0345488B2
Authority
JP
Japan
Prior art keywords
layer
water
transparent
transparent conductive
conductive film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59007576A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60150508A (ja
Inventor
Hiroshi Hatakeyama
Masayuki Ogawa
Kozo Matsumura
Eiji Nakagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissha Printing Co Ltd
Original Assignee
Nissha Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissha Printing Co Ltd filed Critical Nissha Printing Co Ltd
Priority to JP59007576A priority Critical patent/JPS60150508A/ja
Priority to DE8585900743T priority patent/DE3570149D1/de
Priority to EP85900743A priority patent/EP0178327B1/en
Priority to US06/778,361 priority patent/US4663192A/en
Priority to PCT/JP1985/000018 priority patent/WO1985003378A1/ja
Publication of JPS60150508A publication Critical patent/JPS60150508A/ja
Publication of JPH0345488B2 publication Critical patent/JPH0345488B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H05B33/20—Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the chemical or physical composition or the arrangement of the material in which the electroluminescent material is embedded
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/138—Manufacture of transparent electrodes, e.g. transparent conductive oxides [TCO] or indium tin oxide [ITO] electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/10—Semiconductor bodies
    • H10F77/16—Material structures, e.g. crystalline structures, film structures or crystal plane orientations
    • H10F77/169—Thin semiconductor films on metallic or insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/20—Electrodes
    • H10F77/244—Electrodes made of transparent conductive layers, e.g. transparent conductive oxide [TCO] layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Liquid Crystal (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
  • Contacts (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Manufacture Of Switches (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP59007576A 1984-01-18 1984-01-18 透明電極基板の製造方法 Granted JPS60150508A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP59007576A JPS60150508A (ja) 1984-01-18 1984-01-18 透明電極基板の製造方法
DE8585900743T DE3570149D1 (en) 1984-01-18 1985-01-18 Method of manufacturing transparent electrode substrate
EP85900743A EP0178327B1 (en) 1984-01-18 1985-01-18 Method of manufacturing transparent electrode substrate
US06/778,361 US4663192A (en) 1984-01-18 1985-01-18 Production of transparent electrode substrate
PCT/JP1985/000018 WO1985003378A1 (fr) 1984-01-18 1985-01-18 Procede de fabrication d'un substrat d'electrode transparent

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59007576A JPS60150508A (ja) 1984-01-18 1984-01-18 透明電極基板の製造方法

Publications (2)

Publication Number Publication Date
JPS60150508A JPS60150508A (ja) 1985-08-08
JPH0345488B2 true JPH0345488B2 (https=) 1991-07-11

Family

ID=11669632

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59007576A Granted JPS60150508A (ja) 1984-01-18 1984-01-18 透明電極基板の製造方法

Country Status (5)

Country Link
US (1) US4663192A (https=)
EP (1) EP0178327B1 (https=)
JP (1) JPS60150508A (https=)
DE (1) DE3570149D1 (https=)
WO (1) WO1985003378A1 (https=)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0193820A3 (en) * 1985-02-27 1988-01-07 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Method for forming a thin film pattern
JPH01146213A (ja) * 1987-12-01 1989-06-08 Fuji Photo Film Co Ltd 導電膜の製造方法
JP2572245B2 (ja) * 1987-12-01 1997-01-16 富士写真フイルム株式会社 導電膜の製造方法
US5059454A (en) * 1989-04-26 1991-10-22 Flex Products, Inc. Method for making patterned thin film
JP4892803B2 (ja) * 2001-08-31 2012-03-07 凸版印刷株式会社 導電パターン膜の製造方法
TW573204B (en) * 2001-09-12 2004-01-21 Sipix Imaging Inc An improved electrophoretic display with gating electrodes
TWI229763B (en) 2001-10-29 2005-03-21 Sipix Imaging Inc An improved electrophoretic display with holding electrodes
US7156945B2 (en) * 2002-04-24 2007-01-02 Sipix Imaging, Inc. Process for forming a patterned thin film structure for in-mold decoration
TWI268813B (en) * 2002-04-24 2006-12-21 Sipix Imaging Inc Process for forming a patterned thin film conductive structure on a substrate
US7972472B2 (en) * 2002-04-24 2011-07-05 Sipix Imaging, Inc. Process for forming a patterned thin film structure for in-mold decoration
TWI240842B (en) * 2002-04-24 2005-10-01 Sipix Imaging Inc Matrix driven electrophoretic display with multilayer back plane
US7261920B2 (en) * 2002-04-24 2007-08-28 Sipix Imaging, Inc. Process for forming a patterned thin film structure on a substrate
US8002948B2 (en) * 2002-04-24 2011-08-23 Sipix Imaging, Inc. Process for forming a patterned thin film structure on a substrate
WO2004104684A1 (ja) * 2003-05-22 2004-12-02 Bridgestone Corporation 画像表示装置及びその製造に用いる基板重ね合わせ装置
JP4573673B2 (ja) * 2005-02-28 2010-11-04 富士フイルム株式会社 水蒸気バリアフィルム
US8557076B2 (en) * 2005-06-24 2013-10-15 Shih-Chuan Tsai Method of fabricating an environmental friendly cladding layer
JP4856498B2 (ja) * 2005-08-26 2012-01-18 三井化学株式会社 フレキシブルディスプレイ用電極基板
JP4775799B2 (ja) * 2006-07-14 2011-09-21 東レフィルム加工株式会社 金属薄膜転写材料用シートの製造方法
WO2011053250A1 (en) * 2009-10-26 2011-05-05 Agency For Science, Technology And Research Photoelectrode with a polymer layer
JP6202798B2 (ja) 2011-10-12 2017-09-27 エーエスエム インターナショナル エヌ．ヴェー．Ａｓｍ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｎ．Ｖ． 酸化アンチモン膜の原子層堆積
JP2013157343A (ja) * 2012-01-26 2013-08-15 Tokyo Seimitsu Co Ltd ウェーハ処理方法及びシステム
WO2017213043A1 (ja) * 2016-06-10 2017-12-14 日東電工株式会社 透明導電性フィルムおよびタッチパネル
JP6789801B2 (ja) * 2016-06-10 2020-11-25 日東電工株式会社 透明導電性フィルムおよびタッチパネル
KR102432417B1 (ko) * 2016-06-10 2022-08-12 닛토덴코 가부시키가이샤 투명 도전성 필름 및 터치 패널
US10676809B2 (en) 2018-06-20 2020-06-09 Lockheed Martin Corporation Methods and systems for generating patterns on flexible substrates

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5129877A (https=) * 1974-09-06 1976-03-13 Fuji Photo Film Co Ltd
JPS5156966A (ja) * 1974-11-13 1976-05-19 Tokyo Cosmos Electric Tomeidodenmakupataanno keiseihoho
US3985597A (en) * 1975-05-01 1976-10-12 International Business Machines Corporation Process for forming passivated metal interconnection system with a planar surface
JPS51143892A (en) * 1975-06-05 1976-12-10 Casio Comput Co Ltd Process for forming a transparent conductive film
JPS5215267A (en) * 1975-07-28 1977-02-04 Hitachi Ltd Fine processing method
JPS603724B2 (ja) * 1975-09-17 1985-01-30 セイコーインスツルメンツ株式会社 透明導電性パタ−ンの形成方法
JPS5929926B2 (ja) * 1975-09-30 1984-07-24 株式会社東芝 液晶表示器の製造方法
JPS54150417A (en) * 1978-05-19 1979-11-26 Hitachi Ltd Production of transparent conductive layer
JPS6019608B2 (ja) * 1978-10-03 1985-05-17 シャープ株式会社 電極パタ−ン形成方法
JPS5610450A (en) * 1979-07-05 1981-02-02 Teijin Ltd Transparent conductive film
US4307179A (en) * 1980-07-03 1981-12-22 International Business Machines Corporation Planar metal interconnection system and process
JPS5792704A (en) * 1980-12-01 1982-06-09 Tokyo Denshi Kagaku Kk Method of forming pattern of metallic oxide film

Also Published As

Publication number Publication date
JPS60150508A (ja) 1985-08-08
EP0178327B1 (en) 1989-05-10
US4663192A (en) 1987-05-05
WO1985003378A1 (fr) 1985-08-01
DE3570149D1 (en) 1989-06-15
EP0178327A4 (en) 1986-06-05
EP0178327A1 (en) 1986-04-23

Similar Documents

Publication Publication Date Title
JPH0345488B2 (https=)
KR100592919B1 (ko) 투명도전성 필름 및 터치판넬
US4425263A (en) Flexible screen-printable conductive composition
EP0247366A1 (en) Electrically conducting polymer film and method of manufacturing the same
KR910007305B1 (ko) 멤브레인 스위치
CN102985898A (zh) 透明导电性膜及其制造方法
JP2000231450A (ja) 透明導電性フィルム、タッチパネルおよび液晶表示素子
JP3743560B2 (ja) 透明導電性フィルム、及びこれを用いたエレクトロルミネッセンスパネル
JP4910225B2 (ja) 透明導電性フィルム、及びこれを用いたエレクトロルミネッセンスパネル及びタッチパネル
JP4665263B2 (ja) 透明導電性フィルムおよびこれを用いたタッチパネル
JPH1165771A (ja) タッチパネル用電極基板およびその製造方法
JPS60131238A (ja) 透明導電フイルム
JP3330844B2 (ja) カラー表示装置用電極板とカラー表示装置
JPH11320745A (ja) 透明導電性フィルムおよびタッチパネル
JP4284566B2 (ja) 透明導電性フィルム、タッチパネルおよび液晶表示素子
US3804689A (en) Process for removing copper films from substrates
JP3797453B2 (ja) 透明導電性フィルムおよびタッチパネル
JPS63269415A (ja) 透明複合導電体の製造方法
JPS62154413A (ja) 凹凸面を有する透明電極化樹脂の製造方法
JP2020026043A (ja) 積層体
JPH1010518A (ja) カラー表示装置用電極板とカラー表示装置
JP2000082336A (ja) 透明導電性フィルムおよびタッチパネル
KR960011761B1 (ko) 멤브레인 터치 판넬용 필름의 제조방법
JPS62255920A (ja) エレクトロクロミツクデイスプレイ素子
JPS6264007A (ja) 透明導電膜及びその形成方法