JPS60150508A - 透明電極基板の製造方法 - Google Patents

透明電極基板の製造方法

Info

Publication number
JPS60150508A
JPS60150508A JP59007576A JP757684A JPS60150508A JP S60150508 A JPS60150508 A JP S60150508A JP 59007576 A JP59007576 A JP 59007576A JP 757684 A JP757684 A JP 757684A JP S60150508 A JPS60150508 A JP S60150508A
Authority
JP
Japan
Prior art keywords
layer
water
transparent
film
transparent electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59007576A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0345488B2 (https=
Inventor
弘 畠山
正幸 小川
松村　紘三
英司 中川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissha Printing Co Ltd
Toray Industries Inc
Original Assignee
Nissha Printing Co Ltd
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissha Printing Co Ltd, Toray Industries Inc filed Critical Nissha Printing Co Ltd
Priority to JP59007576A priority Critical patent/JPS60150508A/ja
Priority to DE8585900743T priority patent/DE3570149D1/de
Priority to EP85900743A priority patent/EP0178327B1/en
Priority to US06/778,361 priority patent/US4663192A/en
Priority to PCT/JP1985/000018 priority patent/WO1985003378A1/ja
Publication of JPS60150508A publication Critical patent/JPS60150508A/ja
Publication of JPH0345488B2 publication Critical patent/JPH0345488B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H05B33/20—Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the chemical or physical composition or the arrangement of the material in which the electroluminescent material is embedded
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/138—Manufacture of transparent electrodes, e.g. transparent conductive oxides [TCO] or indium tin oxide [ITO] electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/10—Semiconductor bodies
    • H10F77/16—Material structures, e.g. crystalline structures, film structures or crystal plane orientations
    • H10F77/169—Thin semiconductor films on metallic or insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/20—Electrodes
    • H10F77/244—Electrodes made of transparent conductive layers, e.g. transparent conductive oxide [TCO] layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Liquid Crystal (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
  • Contacts (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Manufacture Of Switches (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP59007576A 1984-01-18 1984-01-18 透明電極基板の製造方法 Granted JPS60150508A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP59007576A JPS60150508A (ja) 1984-01-18 1984-01-18 透明電極基板の製造方法
DE8585900743T DE3570149D1 (en) 1984-01-18 1985-01-18 Method of manufacturing transparent electrode substrate
EP85900743A EP0178327B1 (en) 1984-01-18 1985-01-18 Method of manufacturing transparent electrode substrate
US06/778,361 US4663192A (en) 1984-01-18 1985-01-18 Production of transparent electrode substrate
PCT/JP1985/000018 WO1985003378A1 (fr) 1984-01-18 1985-01-18 Procede de fabrication d'un substrat d'electrode transparent

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59007576A JPS60150508A (ja) 1984-01-18 1984-01-18 透明電極基板の製造方法

Publications (2)

Publication Number Publication Date
JPS60150508A true JPS60150508A (ja) 1985-08-08
JPH0345488B2 JPH0345488B2 (https=) 1991-07-11

Family

ID=11669632

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59007576A Granted JPS60150508A (ja) 1984-01-18 1984-01-18 透明電極基板の製造方法

Country Status (5)

Country Link
US (1) US4663192A (https=)
EP (1) EP0178327B1 (https=)
JP (1) JPS60150508A (https=)
DE (1) DE3570149D1 (https=)
WO (1) WO1985003378A1 (https=)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01144520A (ja) * 1987-12-01 1989-06-06 Fuji Photo Film Co Ltd 導電膜の製造方法
JPH01146213A (ja) * 1987-12-01 1989-06-08 Fuji Photo Film Co Ltd 導電膜の製造方法
JP2003077352A (ja) * 2001-08-31 2003-03-14 Toppan Printing Co Ltd 導電パターン膜の製造方法
WO2004104684A1 (ja) * 2003-05-22 2004-12-02 Bridgestone Corporation 画像表示装置及びその製造に用いる基板重ね合わせ装置
JP2007086771A (ja) * 2005-08-26 2007-04-05 Mitsui Chemicals Inc フレキシブルディスプレイ用電極基板
JP2008018649A (ja) * 2006-07-14 2008-01-31 Toray Advanced Film Co Ltd シートの製造方法
JP2013157343A (ja) * 2012-01-26 2013-08-15 Tokyo Seimitsu Co Ltd ウェーハ処理方法及びシステム
WO2017213043A1 (ja) * 2016-06-10 2017-12-14 日東電工株式会社 透明導電性フィルムおよびタッチパネル
JP2017224269A (ja) * 2016-06-10 2017-12-21 日東電工株式会社 透明導電性フィルムおよびタッチパネル

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0193820A3 (en) * 1985-02-27 1988-01-07 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Method for forming a thin film pattern
US5059454A (en) * 1989-04-26 1991-10-22 Flex Products, Inc. Method for making patterned thin film
TW573204B (en) * 2001-09-12 2004-01-21 Sipix Imaging Inc An improved electrophoretic display with gating electrodes
TWI229763B (en) 2001-10-29 2005-03-21 Sipix Imaging Inc An improved electrophoretic display with holding electrodes
US7156945B2 (en) * 2002-04-24 2007-01-02 Sipix Imaging, Inc. Process for forming a patterned thin film structure for in-mold decoration
TWI268813B (en) * 2002-04-24 2006-12-21 Sipix Imaging Inc Process for forming a patterned thin film conductive structure on a substrate
US7972472B2 (en) * 2002-04-24 2011-07-05 Sipix Imaging, Inc. Process for forming a patterned thin film structure for in-mold decoration
TWI240842B (en) * 2002-04-24 2005-10-01 Sipix Imaging Inc Matrix driven electrophoretic display with multilayer back plane
US7261920B2 (en) * 2002-04-24 2007-08-28 Sipix Imaging, Inc. Process for forming a patterned thin film structure on a substrate
US8002948B2 (en) * 2002-04-24 2011-08-23 Sipix Imaging, Inc. Process for forming a patterned thin film structure on a substrate
JP4573673B2 (ja) * 2005-02-28 2010-11-04 富士フイルム株式会社 水蒸気バリアフィルム
US8557076B2 (en) * 2005-06-24 2013-10-15 Shih-Chuan Tsai Method of fabricating an environmental friendly cladding layer
WO2011053250A1 (en) * 2009-10-26 2011-05-05 Agency For Science, Technology And Research Photoelectrode with a polymer layer
JP6202798B2 (ja) 2011-10-12 2017-09-27 エーエスエム インターナショナル エヌ．ヴェー．Ａｓｍ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｎ．Ｖ． 酸化アンチモン膜の原子層堆積
KR102432417B1 (ko) * 2016-06-10 2022-08-12 닛토덴코 가부시키가이샤 투명 도전성 필름 및 터치 패널
US10676809B2 (en) 2018-06-20 2020-06-09 Lockheed Martin Corporation Methods and systems for generating patterns on flexible substrates

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5129877A (https=) * 1974-09-06 1976-03-13 Fuji Photo Film Co Ltd
JPS5156966A (ja) * 1974-11-13 1976-05-19 Tokyo Cosmos Electric Tomeidodenmakupataanno keiseihoho
US3985597A (en) * 1975-05-01 1976-10-12 International Business Machines Corporation Process for forming passivated metal interconnection system with a planar surface
JPS51143892A (en) * 1975-06-05 1976-12-10 Casio Comput Co Ltd Process for forming a transparent conductive film
JPS5215267A (en) * 1975-07-28 1977-02-04 Hitachi Ltd Fine processing method
JPS603724B2 (ja) * 1975-09-17 1985-01-30 セイコーインスツルメンツ株式会社 透明導電性パタ−ンの形成方法
JPS5929926B2 (ja) * 1975-09-30 1984-07-24 株式会社東芝 液晶表示器の製造方法
JPS54150417A (en) * 1978-05-19 1979-11-26 Hitachi Ltd Production of transparent conductive layer
JPS6019608B2 (ja) * 1978-10-03 1985-05-17 シャープ株式会社 電極パタ−ン形成方法
JPS5610450A (en) * 1979-07-05 1981-02-02 Teijin Ltd Transparent conductive film
US4307179A (en) * 1980-07-03 1981-12-22 International Business Machines Corporation Planar metal interconnection system and process
JPS5792704A (en) * 1980-12-01 1982-06-09 Tokyo Denshi Kagaku Kk Method of forming pattern of metallic oxide film

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01144520A (ja) * 1987-12-01 1989-06-06 Fuji Photo Film Co Ltd 導電膜の製造方法
JPH01146213A (ja) * 1987-12-01 1989-06-08 Fuji Photo Film Co Ltd 導電膜の製造方法
JP2003077352A (ja) * 2001-08-31 2003-03-14 Toppan Printing Co Ltd 導電パターン膜の製造方法
WO2004104684A1 (ja) * 2003-05-22 2004-12-02 Bridgestone Corporation 画像表示装置及びその製造に用いる基板重ね合わせ装置
JPWO2004104684A1 (ja) * 2003-05-22 2006-07-20 株式会社ブリヂストン 画像表示装置及びその製造に用いる基板重ね合わせ装置
JP2007086771A (ja) * 2005-08-26 2007-04-05 Mitsui Chemicals Inc フレキシブルディスプレイ用電極基板
JP2008018649A (ja) * 2006-07-14 2008-01-31 Toray Advanced Film Co Ltd シートの製造方法
JP2013157343A (ja) * 2012-01-26 2013-08-15 Tokyo Seimitsu Co Ltd ウェーハ処理方法及びシステム
WO2017213043A1 (ja) * 2016-06-10 2017-12-14 日東電工株式会社 透明導電性フィルムおよびタッチパネル
WO2017213046A1 (ja) * 2016-06-10 2017-12-14 日東電工株式会社 透明導電性フィルムおよびタッチパネル
JP2017224269A (ja) * 2016-06-10 2017-12-21 日東電工株式会社 透明導電性フィルムおよびタッチパネル

Also Published As

Publication number Publication date
JPH0345488B2 (https=) 1991-07-11
EP0178327B1 (en) 1989-05-10
US4663192A (en) 1987-05-05
WO1985003378A1 (fr) 1985-08-01
DE3570149D1 (en) 1989-06-15
EP0178327A4 (en) 1986-06-05
EP0178327A1 (en) 1986-04-23

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