Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
  • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
  • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
  • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
  • H05B33/00—Electroluminescent light sources
  • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
  • H05B33/20—Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the chemical or physical composition or the arrangement of the material in which the electroluminescent material is embedded
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
  • H10F71/00—Manufacture or treatment of devices covered by this subclass
  • H10F71/138—Manufacture of transparent electrodes, e.g. transparent conductive oxides [TCO] or indium tin oxide [ITO] electrodes
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
  • H10F77/00—Constructional details of devices covered by this subclass
  • H10F77/10—Semiconductor bodies
  • H10F77/16—Material structures, e.g. crystalline structures, film structures or crystal plane orientations
  • H10F77/169—Thin semiconductor films on metallic or insulating substrates
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
  • H10F77/00—Constructional details of devices covered by this subclass
  • H10F77/20—Electrodes
  • H10F77/244—Electrodes made of transparent conductive layers, e.g. transparent conductive oxide [TCO] layers
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
  • Y02E10/00—Energy generation through renewable energy sources
  • Y02E10/50—Photovoltaic [PV] energy

Definitions

• the present invention relates to a method for producing a flexible transparent electrode S substrate, and the purpose thereof is to achieve a purpose such as surface strength, abrasion resistance, and sheet resistance.
• the invention is to provide a method capable of producing a flexible transparent electrode Moto ⁇ easily and ⁇ manner was invasion B
• the following method has been adopted as a method for producing such a flexible (transparent electrode substrate).
• metal thin films such as gold, silver, ',' radium and the like, and metal oxide thin films such as tin oxide, indium oxide, antimony oxide, cadmium tin oxide and the like are transparent blasted by vacuum evaporation and sputtering.
• masking eyebrows are formed with resist ink or photoresist on the required electrode pattern, and then unnecessary metal thin film II or metal oxide thin film is formed by wet or dry etching method. removed, then deer that had been producing a flexible transparent electrode ⁇ group 3 ⁇ 4 by also removing the masking eyebrows ⁇
• the transparent electrode obtained by the above method also had various problems as follows:
• the pattern is thinned due to side etching, so the resistance may increase or a new line may occur.
• the transparent electrode base obtained by the above-mentioned ta method can be used only in a limited field or protected during use, especially in the presence of the ⁇ and ⁇ points. Special considerations such as providing a film were required.
• a treatment with a thin organic material which is hard to rush between a metal thin film or a metal oxide thin film and a transparent blastix film, described in Japanese Patent Application Laid-Open No. 56-104550.
• Maro for example, there has been proposed a method of forming a layer of a semi-inorganic polymer such as silicon butter, an acrylate resin formed from an organic compound having an acryloyl group and a butyl group, and a butyl polymer.
• the present invention provides a method for forming an eyebrow (B) on a transparent substrate film (A) on a polymer compound comprising at least one of polyurethane, polyester, and epoxy skirt resin on a transparent substrate film (A).
• a water-soluble lacquer coat C> Cr
• a transparent conductive layer D
• the water-soluble paint (C) (the water-soluble paint) Dissolving and removing the transparent conductive film (D) on (C) is also a method of producing a transparent electrode substrate, which is a special feature.
• Fig. 2, Fig. 2 -a, Fig. 3 -a and Fig. 4 are cross-sectional views also showing the connection S according to the present invention, Figs. 2-b, 3-b and 4 are The entire implementation of the idea is shown below. "
• a polymer compound layer (B) is formed on the transparent transparent base film (A) (see FIG. 1).
• the transparent transparent base film (A) in the present invention a broad range of brass such as polyester such as polyethylene terebutarate, polycarbonate, polychlorinated pinyl, polyethylene, polypropylene, polyamide, cellulose acetate, etc.
• a titter film can also be mentioned, and among them, a polyester film is particularly preferable.
• This polyester film has transparency, dimensional stability, uniformity of thickness, irradiance, ripening, chemical properties, This is because it was spent on water and other properties.
• the above-mentioned polyethylene film is used, which is stretched in the nip direction in order to improve the birch quality.
• the S-type transparent substrate film ( ⁇ ) is usually a film having a thickness of 12 io-250 ⁇ .
• the polymer compound eyebrow (B) formed above one having the following conditions is also used. (1) Excellent permeability, (2) Water spraying, (3) Water-soluble coating that drips after washing, (4) Releasability from eyebrows (C), (4) Transparent conductive Excellent adhesiveness with the yarn layer (D), ⁇ Transparent conductive layer (D) ⁇ yf, which can increase the surface strength of the transparent substrate film (A), etc.
• a material that also satisfies the above conditions is used. Such substances include the following. 1 Polyurethane
• organic acids such as phthal hajime, adipine mongolia, and malene mongolia.
• examples include the union of polyester diol and tolylene diisocyanate obtained by the reaction with dalicol such as glycol, glycerin, trimethylolethane, and pentaerythritol such as ethylene, brovirene, and butylene. Since the molecular weight of these polyurethanes is generally three-dimensional, it is difficult to measure.
• Dicarboxylic acids such as fumaric acid, phthalic anhydride, maleic acid, terephthalic acid, succinic acid, adibic acid, sebacin, etc. and ethylene glycol, propylene glycol, 1,4-butanediol, diethylene glycol, triethylene glycol, glycerin, etc.
• the molecular weight of these polyesters is Of10 to 100,000, preferably 3,000 to 20,0 (30 is desirable.
• Bisph an epoxy resin obtained by the reaction of t-norl A with epi-sigma-hydrhydrin, cured with an amine such as ethylenediamine or ethanolamine.
• the molecular weight of epoxy street fat is 200- 100, 000, preferably 300 to 2,000, is desirable.
• the thickness of these polymer compound layers ( ⁇ ) is 0.01 ⁇ ! ⁇ 10 zm, especially 0.1
• the polymer compound layer (B) may be formed on both sides of the insulating transparent substrate film (A). By doing so, the polymer compound layer (B) plays a role of, for example, protecting the surface of the insulating transparent substrate film (A).
• a water-soluble coating layer (C) is formed on the polymer compound layer (B) (see FIG. 2-a).
• the water-soluble coating film layer (C) is partially formed in a portion not requiring the transparent conductive film layer (D).
• the water-soluble coating layer (C) partially formed here corresponds to the negative part of the transparent electrode pattern.
• a mark or a mark for inspection is formed by forming the transparent conductive film layer (D;)
• the water-soluble substance used for forming the water-soluble coating layer (C) include vinyl-based water-soluble resins such as polyvinyl alcohol and polyvinylpyrrolidone, methylcellulose, carboxylmethylcell orifice, and hydroxyxetil.
• the 8 Ming conductive layer (D) preferably has an oleaginous apricot and also exhibits transparency when forming a thin cocoon.
• Metal oxides such as indium oxide, antimony oxide, titanium oxide, zirconium oxide, or indium oxide-oxide oxide, oxidized oxide-tungsten-antimony oxide, and particularly preferably indium oxide- »oxide
• these transparent conductive DenHiroshi Jg beta formed by (D) may be any single S, to Rukoto the double eyebrow two or more eyebrow Can also.
• the thickness of the transparent conductive layer (D) is 10 people to 50 OA, and the surface is 1 ⁇ / ⁇ to ⁇ + ⁇ / preferably ⁇
• the mouth is good.
• the light transmittance of the transparent conductive eyebrow (D) is 50 to 90%, preferably 80 to 80%, as the parallel light transmittance at 550 M.
• the sheet-like material shown in FIG. 3-a on which the transparent conductive eyebrows (D) are formed by the IB type is washed with water (see FIG. 4 ⁇ ).
• Examples of the water method include cold water or flowing water * shower water soot, washing in a water tank, ultrasonic soot, and micro washing. It is a good idea to use both the performance in the aquarium and the shower rinsing in an unusual process.
• the conditions of the former IH Chai—Eiho are as follows: Suizou 1 / ⁇ J ⁇ 3k /, flow rate 3 / min ⁇ 20 / min.
• a method of passing a sponge roller's joy while catching water is also popular.
• the material of the sponge roller used in this method should be as soft as possible. For example, it is effective to use polyvinyl alcohol.
• the present invention comprises the above-described steps. However, before or after coloring the polymer compound layer (B), the present invention is based on a process such as characters and symbols.
• Printing run (E may be formed, see Fig. 2-b, Fig. 3-b and Fig. 4-b ⁇ ) ⁇
• the printing eyebrows ( ⁇ ) should be a 16 »transparent base film ( ⁇ ), That is, on the surface opposite to the surface where the polymer compound S (B) is formed, or on the transparent electrode.
• This printed eyebrow (E) is a transparent ⁇ display ⁇ on the pole base slope (F).
• the imprint (E) of the polymer is also formed on the upper and lower sides of the polymerized eyebrow (8), that is, the imprint layer (EJ) is formed on a transparent transparent substrate film ( ⁇ ⁇ ⁇ ⁇ ). ) And the transparent conductive layer (D :) can be formed into a rush, which is a very beneficial effect obtained by employing the present invention. This is because, when trying to do this with the conventional etching method, the eyebrows before forming the transparent conductive layer and the masking eyebrows after forming the transparent conductive layer are closely registered. This is an extremely difficult technology because the process of forming, forming, and printing a mark is a three-step process. In the present invention, multicolor printing is required. by Being machine, in which printing Kiyoshi and (E) a water-soluble coating eyebrow (C) can be SaiNaru registration be performed Yokuzu ⁇
• the characteristic value of the present invention is determined by the following measurement method.
• the reciprocating motion was repeated 3 times at a repetition rate of i 40 times at '20 Ogr, and the test was repeated until the surface electric resistance of the sample reached the initial value of 10 times.
• the transparent conductive film was washed with water using a sponge roller under the following conditions ; Water pressure 2 / ⁇ , Water volume 2 / min, Purification speed 5B / min
• the durability of the transparent electrode substrate obtained in this manner was evaluated by a dot life test method. There was no clan, and the planting was extremely high.
• Kibashika who performed a dot life test on a transparent electrode base slope made in exactly the same way without using a polyurethane-based material t'lft, was repeated 5,000 times.
• the transparent conductive layer was separated, and the practical value was low.
• the present invention has the following effects because it has the above-described configuration. That is, not only can all the disadvantages of the conventional etching method be eliminated, but also because the polymer compound eyebrows are interposed between the base film and the transparent conductive eyebrows, the surface strength and the abrasion are reduced. It has excellent properties and sheet resistance.
• the transparent substrate obtained according to the present invention has the following characteristics. It can be widely used as a flexible transparent electrode such as a display body, an electroluminescent display body, an electronic photograph ⁇ body, an electric swimming body, an electron beam E body, a 3 switch, a connector, etc. In terms of business, it is extremely expensive to use.

Landscapes

• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Liquid Crystal (AREA)
• Non-Insulated Conductors (AREA)
• Laminated Bodies (AREA)
• Manufacturing Of Electric Cables (AREA)
• Devices For Indicating Variable Information By Combining Individual Elements (AREA)
• Manufacture Of Switches (AREA)
• Contacts (AREA)
• Manufacturing Of Printed Wiring (AREA)

Priority Applications (1)

Applications Claiming Priority (2)

Publications (1)

Family

ID=11669632

Family Applications (1)

Country Status (5)

Families Citing this family (25)

Citations (7)

Family Cites Families (5)

• 1984
  • 1984-01-18 JP JP59007576A patent/JPS60150508A/ja active Granted
• 1985
  • 1985-01-18 US US06/778,361 patent/US4663192A/en not_active Expired - Lifetime
  • 1985-01-18 DE DE8585900743T patent/DE3570149D1/de not_active Expired
  • 1985-01-18 EP EP85900743A patent/EP0178327B1/en not_active Expired
  • 1985-01-18 WO PCT/JP1985/000018 patent/WO1985003378A1/ja not_active Ceased

Patent Citations (7)

Non-Patent Citations (1)

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