JPH0344433B2 - - Google Patents

Info

Publication number
JPH0344433B2
JPH0344433B2 JP60049123A JP4912385A JPH0344433B2 JP H0344433 B2 JPH0344433 B2 JP H0344433B2 JP 60049123 A JP60049123 A JP 60049123A JP 4912385 A JP4912385 A JP 4912385A JP H0344433 B2 JPH0344433 B2 JP H0344433B2
Authority
JP
Japan
Prior art keywords
solder
lsi
soldering
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60049123A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61208291A (ja
Inventor
Tsutomu Ootsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pioneer Corp
Original Assignee
Pioneer Electronic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pioneer Electronic Corp filed Critical Pioneer Electronic Corp
Priority to JP4912385A priority Critical patent/JPS61208291A/ja
Publication of JPS61208291A publication Critical patent/JPS61208291A/ja
Publication of JPH0344433B2 publication Critical patent/JPH0344433B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP4912385A 1985-03-12 1985-03-12 面実装型ｌｓｉの半田付け装置 Granted JPS61208291A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4912385A JPS61208291A (ja) 1985-03-12 1985-03-12 面実装型ｌｓｉの半田付け装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4912385A JPS61208291A (ja) 1985-03-12 1985-03-12 面実装型ｌｓｉの半田付け装置

Publications (2)

Publication Number Publication Date
JPS61208291A JPS61208291A (ja) 1986-09-16
JPH0344433B2 true JPH0344433B2 (OSRAM) 1991-07-05

Family

ID=12822284

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4912385A Granted JPS61208291A (ja) 1985-03-12 1985-03-12 面実装型ｌｓｉの半田付け装置

Country Status (1)

Country Link
JP (1) JPS61208291A (OSRAM)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63278669A (ja) * 1987-05-11 1988-11-16 Matsushita Electric Ind Co Ltd 基板加熱装置
JPH0831689B2 (ja) * 1990-11-28 1996-03-27 日本アルミット株式会社 半田付け装置
DE69122230T2 (de) * 1990-11-28 1997-01-30 Nihon Almit K K Lötanlage
JP2008198925A (ja) * 2007-02-15 2008-08-28 Matsushita Electric Ind Co Ltd 電子部品実装装置および電子部品実装方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5896796A (ja) * 1981-12-04 1983-06-08 セイコーエプソン株式会社 電子部品の基板への接合方法

Also Published As

Publication number Publication date
JPS61208291A (ja) 1986-09-16

Similar Documents

Publication Publication Date Title
US6799709B2 (en) Method and apparatus for local application of solder to preselected conductor areas on a printed circuit board
JPH0992682A (ja) ハンダ付け方法、ハンダ付け装置
US6153505A (en) Plastic solder array using injection molded solder
JPH0344433B2 (OSRAM)
US6915941B2 (en) Method for local application of solder to preselected areas on a printed circuit board
JP2809207B2 (ja) 半導体装置のリペア方法とリペア装置
JPH1154559A (ja) バンプ付きワークのボンディング装置およびボンディング方法
JPH04250692A (ja) リフロー半田付け装置
JPH1012992A (ja) 実装方法及び電子部品収容パレツト
JP3634396B2 (ja) プリント基板等のはんだ付方法及び装置
JPH02111094A (ja) 表面実装基板の半田付け方法及びその半田付け装置
JP2644248B2 (ja) 面実装型電子部品の半田付け方法
JPS63232486A (ja) 電子部品装着方法
JP3095959B2 (ja) チップ部品の基板への接続方法
JPH04219942A (ja) Ｉｃ部品のリード接合方法
JPH0831691B2 (ja) 電子部品のリプレース方法
JPH0249498A (ja) リード付電子部品実装装置
JPH04275489A (ja) はんだ付け方法
JPS6390195A (ja) はんだ付け方法
JPH0621147A (ja) 電子部品の実装方法
JPS63284892A (ja) フラットパッケ−ジ型電子部品の実装方法
JPS6323393A (ja) 半田付け方法
JPS62267068A (ja) 半田付け装置
JPH1140938A (ja) 接合材料の供給方法とその装置
JPS58158994A (ja) ポイント下加熱半田付方法及びその装置