JPH033940B2 - - Google Patents

Info

Publication number
JPH033940B2
JPH033940B2 JP57124983A JP12498382A JPH033940B2 JP H033940 B2 JPH033940 B2 JP H033940B2 JP 57124983 A JP57124983 A JP 57124983A JP 12498382 A JP12498382 A JP 12498382A JP H033940 B2 JPH033940 B2 JP H033940B2
Authority
JP
Japan
Prior art keywords
tape
gold
bonding
bump
bumps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57124983A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5827355A (ja
Inventor
Nihaaru Shinadorai Furanshisu
Jon Sumooru Dabitsudo
Ansonii Burein Arekusanda
Kuupaa Kenisu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
British Telecommunications PLC
Original Assignee
British Telecommunications PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=10523346&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JPH033940(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by British Telecommunications PLC filed Critical British Telecommunications PLC
Publication of JPS5827355A publication Critical patent/JPS5827355A/ja
Publication of JPH033940B2 publication Critical patent/JPH033940B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/077—
    • H10W70/05—
    • H10W70/453—
    • H10W72/701—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Landscapes

  • Wire Bonding (AREA)
JP57124983A 1981-07-17 1982-07-16 自動ボンディング用テープ Granted JPS5827355A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB8122218 1981-07-17
GB8122218 1981-07-17

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2148461A Division JPH03123046A (ja) 1981-07-17 1990-06-05 自動ボンディング用テープの製造方法

Publications (2)

Publication Number Publication Date
JPS5827355A JPS5827355A (ja) 1983-02-18
JPH033940B2 true JPH033940B2 (enExample) 1991-01-21

Family

ID=10523346

Family Applications (2)

Application Number Title Priority Date Filing Date
JP57124983A Granted JPS5827355A (ja) 1981-07-17 1982-07-16 自動ボンディング用テープ
JP2148461A Granted JPH03123046A (ja) 1981-07-17 1990-06-05 自動ボンディング用テープの製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2148461A Granted JPH03123046A (ja) 1981-07-17 1990-06-05 自動ボンディング用テープの製造方法

Country Status (5)

Country Link
EP (1) EP0070691B1 (enExample)
JP (2) JPS5827355A (enExample)
AT (1) ATE33322T1 (enExample)
CA (1) CA1198833A (enExample)
DE (1) DE3278301D1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62287093A (ja) * 1986-06-05 1987-12-12 Okuno Seiyaku Kogyo Kk 電気亜鉛−ニツケル合金めつき浴
EP0327996A3 (en) * 1988-02-09 1990-12-27 National Semiconductor Corporation Tape automated bonding of bumped tape on bumped die
DE4017863C1 (enExample) * 1990-06-02 1991-07-18 Du Pont De Nemours (Deutschland) Gmbh, 4000 Duesseldorf, De
JP4497032B2 (ja) * 2005-06-16 2010-07-07 Ｔｄｋ株式会社 電子部品

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5394874A (en) * 1977-01-31 1978-08-19 Matsushita Electric Ind Co Ltd Connecting method for semiconductor device
JPS5469383A (en) * 1977-11-15 1979-06-04 Toshiba Corp Production of semiconductor device
JPS5548954A (en) * 1978-10-03 1980-04-08 Toshiba Corp Manufacturing of film carrier

Also Published As

Publication number Publication date
EP0070691A1 (en) 1983-01-26
JPH0371778B2 (enExample) 1991-11-14
DE3278301D1 (en) 1988-05-05
EP0070691B1 (en) 1988-03-30
JPH03123046A (ja) 1991-05-24
JPS5827355A (ja) 1983-02-18
ATE33322T1 (de) 1988-04-15
CA1198833A (en) 1985-12-31

Similar Documents

Publication Publication Date Title
US5786239A (en) Method of manufacturing a semiconductor package
US3781596A (en) Semiconductor chip carriers and strips thereof
US6746897B2 (en) Fabrication process of semiconductor package and semiconductor package
US7255802B2 (en) Tape substrate and method for fabricating the same
JPH11238763A (ja) 半導体素子実装用配線基板の製造方法
US5223321A (en) Tape-automated bonding of integrated circuits
US5355019A (en) Devices with tape automated bonding
US4139434A (en) Method of making circuitry with bump contacts
KR100234694B1 (ko) 비지에이 패키지의 제조방법
US6240632B1 (en) Method of manufacturing lead frame and integrated circuit package
JPS59139636A (ja) ボンデイング方法
JPH033940B2 (enExample)
JPH10223828A (ja) リードフレーム部材とその製造方法
JPH0732172B2 (ja) 銅テ−プおよびその製法
JPS62196840A (ja) 半導体装置及びその製造方法
JP3005841B2 (ja) 半導体装置用リ−ドフレ−ム及びその製造方法
US6352915B1 (en) Method for manufacturing semiconductor package containing cylindrical type bump grid array
JP3656590B2 (ja) 半導体装置用テープキャリアの製造方法
JPS62272546A (ja) 半導体装置用フイルムキヤリア
JP4390908B2 (ja) 配線部材の製造方法
JP2605999B2 (ja) 半導体パッケージの製造方法
JP3021508B2 (ja) 導電突起の形成方法
JPH1050885A (ja) 半導体装置用回路部材とそれを用いた半導体装置、及びそれらの製造方法
JPH01147848A (ja) Ｉｃ用リードフレームの製造方法
JPH10256453A (ja) 半導体装置用回路部材とそれを用いた半導体装置、及びそれらの製造方法