JPS5548954A - Manufacturing of film carrier - Google Patents

Manufacturing of film carrier

Info

Publication number
JPS5548954A
JPS5548954A JP12118478A JP12118478A JPS5548954A JP S5548954 A JPS5548954 A JP S5548954A JP 12118478 A JP12118478 A JP 12118478A JP 12118478 A JP12118478 A JP 12118478A JP S5548954 A JPS5548954 A JP S5548954A
Authority
JP
Japan
Prior art keywords
bump
forming
copper
open region
photoetching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12118478A
Other languages
Japanese (ja)
Inventor
Toshihiro Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP12118478A priority Critical patent/JPS5548954A/en
Publication of JPS5548954A publication Critical patent/JPS5548954A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To easily produce a long film, by coating the front and back surfaces of a laminated body consisting of resin and copper foil with photosensitive resin, forming a bump-forming open region by using photoetching, providing here a plated layer, and forming a lead frame by photoetching the surface of the copper foil.
CONSTITUTION: Thin polyimide resin 5 is cast on one surface of ribbon material 4 made of electrolytic copper or rolled copper, and thereby laminated plate 1 is formed. Both surfaces of this are covered with photosensitive resin. Next, by means of photoetching, a bump-forming open region, indexing open regions 3l, 3l', 3m, 3m', 3n, and 3n' are formed on the side of polyimide resin 5. The copper-foil- exposed surface of the bump-forming open region is coated with Au or Zn bump 8. Subsequently, the copper foil surface is photoetched, and lead frame 40 is formed, which contains fingers 4mlW4ml and semiconductor element fitting open region 9m. Thermoelectric bonding is done by fitting the position of the bump of this film carrier to the position of the Al or Au electrode pad of the element.
COPYRIGHT: (C)1980,JPO&Japio
JP12118478A 1978-10-03 1978-10-03 Manufacturing of film carrier Pending JPS5548954A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12118478A JPS5548954A (en) 1978-10-03 1978-10-03 Manufacturing of film carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12118478A JPS5548954A (en) 1978-10-03 1978-10-03 Manufacturing of film carrier

Publications (1)

Publication Number Publication Date
JPS5548954A true JPS5548954A (en) 1980-04-08

Family

ID=14804926

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12118478A Pending JPS5548954A (en) 1978-10-03 1978-10-03 Manufacturing of film carrier

Country Status (1)

Country Link
JP (1) JPS5548954A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5827355A (en) * 1981-07-17 1983-02-18 ブリティシュ・テレコミュニケーションズ・パブリック・リミテッド・カンパニ Automatic bonding tape and method of producing same
JPS5959274U (en) * 1982-10-13 1984-04-18 丸善精工株式会社 Backing plate for vise
JPS62171134A (en) * 1986-01-23 1987-07-28 Fuji Xerox Co Ltd Film carrier and manufacture of semiconductor device using the filmcarrier
JPS6332941A (en) * 1986-04-29 1988-02-12 インターナショナル・ビジネス・マシーンズ・コーポレーション Connection structure for electronic circuit
JPH02229445A (en) * 1989-03-01 1990-09-12 Nitto Denko Corp Film carrier and semiconductor device
US4984062A (en) * 1987-03-30 1991-01-08 Mitsubishi Denki Kabushiki Kaisha Packaged semiconductor device
JPH0364938A (en) * 1989-08-02 1991-03-20 Nitto Denko Corp Film carrier and semiconductor device
US5014112A (en) * 1985-11-12 1991-05-07 Texas Instruments Incorporated Semiconductor integrated circuit device having mirror image circuit bars bonded on opposite sides of a lead frame
WO1991006977A1 (en) * 1989-11-06 1991-05-16 Nippon Mektron, Ltd. Flexible circuit board for mounting ic and method of producing the same
US5082802A (en) * 1985-11-12 1992-01-21 Texas Instruments Incorporated Method of making a memory device by packaging two integrated circuit dies in one package
US5559372A (en) * 1994-12-19 1996-09-24 Goldstar Electron Co., Ltd. Thin soldered semiconductor package

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH033940B2 (en) * 1981-07-17 1991-01-21 Buriteitsushu Terekomyunikeeshonzu Plc
JPS5827355A (en) * 1981-07-17 1983-02-18 ブリティシュ・テレコミュニケーションズ・パブリック・リミテッド・カンパニ Automatic bonding tape and method of producing same
JPS5959274U (en) * 1982-10-13 1984-04-18 丸善精工株式会社 Backing plate for vise
US5082802A (en) * 1985-11-12 1992-01-21 Texas Instruments Incorporated Method of making a memory device by packaging two integrated circuit dies in one package
US5014112A (en) * 1985-11-12 1991-05-07 Texas Instruments Incorporated Semiconductor integrated circuit device having mirror image circuit bars bonded on opposite sides of a lead frame
JPS62171134A (en) * 1986-01-23 1987-07-28 Fuji Xerox Co Ltd Film carrier and manufacture of semiconductor device using the filmcarrier
JPS6332941A (en) * 1986-04-29 1988-02-12 インターナショナル・ビジネス・マシーンズ・コーポレーション Connection structure for electronic circuit
JPH055375B2 (en) * 1986-04-29 1993-01-22 Intaanashonaru Bijinesu Mashiinzu Corp
JPH05283474A (en) * 1986-04-29 1993-10-29 Internatl Business Mach Corp <Ibm> Forming method of semiconductor chip package and chip-bonding tape for the method
US4984062A (en) * 1987-03-30 1991-01-08 Mitsubishi Denki Kabushiki Kaisha Packaged semiconductor device
JPH02229445A (en) * 1989-03-01 1990-09-12 Nitto Denko Corp Film carrier and semiconductor device
JPH0364938A (en) * 1989-08-02 1991-03-20 Nitto Denko Corp Film carrier and semiconductor device
WO1991006977A1 (en) * 1989-11-06 1991-05-16 Nippon Mektron, Ltd. Flexible circuit board for mounting ic and method of producing the same
EP0452506B1 (en) * 1989-11-06 1996-03-13 Nippon Mektron, Ltd. METHOD OF PRODUCING A FLEXIBLE CIRCUIT BOARD FOR MOUNTING IC's
US5559372A (en) * 1994-12-19 1996-09-24 Goldstar Electron Co., Ltd. Thin soldered semiconductor package

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