JPS55160453A - Hybrid integrated circuit - Google Patents

Hybrid integrated circuit

Info

Publication number
JPS55160453A
JPS55160453A JP6910879A JP6910879A JPS55160453A JP S55160453 A JPS55160453 A JP S55160453A JP 6910879 A JP6910879 A JP 6910879A JP 6910879 A JP6910879 A JP 6910879A JP S55160453 A JPS55160453 A JP S55160453A
Authority
JP
Japan
Prior art keywords
resistor
plating
foil
adhered
resistance value
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6910879A
Other languages
Japanese (ja)
Inventor
Yoshio Miura
Tafuo Nunoura
Akira Kazami
Tadao Abe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Original Assignee
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sanyo Electric Co Ltd, Sanyo Electric Co Ltd filed Critical Tokyo Sanyo Electric Co Ltd
Priority to JP6910879A priority Critical patent/JPS55160453A/en
Publication of JPS55160453A publication Critical patent/JPS55160453A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/01—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
    • H01L27/016—Thin-film circuits

Abstract

PURPOSE:To obtain the hybrid IC having an internal resistor by forming a low resistor by Ni plating between conductive paths formed through an insulating film on a metallic substrate having preferable thermal conductivity. CONSTITUTION:A Cu foil 3 is adhered at 6 to an Al2O3 5 on the surface of an Al substrate 1, and a predetermined pattern of conductive paths 3 are formed thereon. A resist mask is coated thereon, dipped in an electroless Ni plating solution containing NiSO4 and NaH2PO2 or the like to form an Ni flim having predetermined thickness as adhered thereon. The resistor 4 of Ni thus obtained contains 8- 10% of P, which lowers the resistance value of the Ni itself to obtain a layer resistance of 0.5-5OMEGA. The surface of the adhesive resin 6 is roughed to prevent the Cu foil and the Ni plating film from isolating. The Cu preferably adheres the Ni to affect no influence to the resistance value. This resistor can be regulated in the operating state of the circuit to improve the dissipation. In this manner, it can reduce the external parts to simplify the assembling of the IC.
JP6910879A 1979-06-01 1979-06-01 Hybrid integrated circuit Pending JPS55160453A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6910879A JPS55160453A (en) 1979-06-01 1979-06-01 Hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6910879A JPS55160453A (en) 1979-06-01 1979-06-01 Hybrid integrated circuit

Publications (1)

Publication Number Publication Date
JPS55160453A true JPS55160453A (en) 1980-12-13

Family

ID=13393095

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6910879A Pending JPS55160453A (en) 1979-06-01 1979-06-01 Hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPS55160453A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0602386A2 (en) * 1992-12-02 1994-06-22 Robert Bosch Gmbh Manufacturing method for a plastic-metal composition with good adhesive strength
EP0848585A1 (en) * 1996-12-13 1998-06-17 Macdermid Incorporated Process for the manufacture of printed circuit boards with plated resistors
WO2019066815A1 (en) * 2017-09-27 2019-04-04 Intel Corporation Substrate with integrated resistive circuit element and method of providing same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS423717Y1 (en) * 1965-08-05 1967-03-03
JPS4525826Y1 (en) * 1967-11-29 1970-10-07
JPS475698U (en) * 1971-02-10 1972-09-19

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS423717Y1 (en) * 1965-08-05 1967-03-03
JPS4525826Y1 (en) * 1967-11-29 1970-10-07
JPS475698U (en) * 1971-02-10 1972-09-19

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0602386A2 (en) * 1992-12-02 1994-06-22 Robert Bosch Gmbh Manufacturing method for a plastic-metal composition with good adhesive strength
EP0602386A3 (en) * 1992-12-02 1995-12-27 Bosch Gmbh Robert Manufacturing method for a plastic-metal composition with good adhesive strength.
EP0848585A1 (en) * 1996-12-13 1998-06-17 Macdermid Incorporated Process for the manufacture of printed circuit boards with plated resistors
WO2019066815A1 (en) * 2017-09-27 2019-04-04 Intel Corporation Substrate with integrated resistive circuit element and method of providing same

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