JPS5655062A - Formation of solder bump - Google Patents

Formation of solder bump

Info

Publication number
JPS5655062A
JPS5655062A JP13080679A JP13080679A JPS5655062A JP S5655062 A JPS5655062 A JP S5655062A JP 13080679 A JP13080679 A JP 13080679A JP 13080679 A JP13080679 A JP 13080679A JP S5655062 A JPS5655062 A JP S5655062A
Authority
JP
Japan
Prior art keywords
solder
layer
film
solder bump
bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13080679A
Other languages
Japanese (ja)
Inventor
Keiji Miyamoto
Toru Kawanobe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13080679A priority Critical patent/JPS5655062A/en
Publication of JPS5655062A publication Critical patent/JPS5655062A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01022—Titanium [Ti]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To enable integration of solder bump by forming a substance not moistened with solder on a final passivation film before molting the solder film, melting the solder in this state, and forming a solder bump thereon. CONSTITUTION:A final passivation film 12 of electrode 11 and oxide film is coated on the upper surface of a substrate 10 made of semiconductor thin plate, a wiring layer 13 is formed thereon. The lower layer of the wiring layer is made of titanium layer 14 or the like which is not moistened with solder, and the upper layer is formed of a copper layer 15 of the like which is preferable adherence to the solder. A solder film 17 is formed at the window having the same size as the electrode 11 formed by photoetching. Subsequently, the photoresist film 16 is removed, is heated in the state that the copper layer 15 is removed, and a solder bump 18 is thus formed. Thus, when the solder is heated, the solder flowed to the titanium layer 14 is reduced, and the solder bump can be consequently integrated highly.
JP13080679A 1979-10-12 1979-10-12 Formation of solder bump Pending JPS5655062A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13080679A JPS5655062A (en) 1979-10-12 1979-10-12 Formation of solder bump

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13080679A JPS5655062A (en) 1979-10-12 1979-10-12 Formation of solder bump

Publications (1)

Publication Number Publication Date
JPS5655062A true JPS5655062A (en) 1981-05-15

Family

ID=15043138

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13080679A Pending JPS5655062A (en) 1979-10-12 1979-10-12 Formation of solder bump

Country Status (1)

Country Link
JP (1) JPS5655062A (en)

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