CA1198833A - Tape-automated-bonding of integrated circuits - Google Patents
Tape-automated-bonding of integrated circuitsInfo
- Publication number
- CA1198833A CA1198833A CA000406703A CA406703A CA1198833A CA 1198833 A CA1198833 A CA 1198833A CA 000406703 A CA000406703 A CA 000406703A CA 406703 A CA406703 A CA 406703A CA 1198833 A CA1198833 A CA 1198833A
- Authority
- CA
- Canada
- Prior art keywords
- tape
- interconnection
- bonding
- terminal
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/077—
-
- H10W70/05—
-
- H10W70/453—
-
- H10W72/701—
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Wire Bonding (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB8122218 | 1981-07-17 | ||
| GB8122218 | 1981-07-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1198833A true CA1198833A (en) | 1985-12-31 |
Family
ID=10523346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000406703A Expired CA1198833A (en) | 1981-07-17 | 1982-07-06 | Tape-automated-bonding of integrated circuits |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0070691B1 (enExample) |
| JP (2) | JPS5827355A (enExample) |
| AT (1) | ATE33322T1 (enExample) |
| CA (1) | CA1198833A (enExample) |
| DE (1) | DE3278301D1 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62287093A (ja) * | 1986-06-05 | 1987-12-12 | Okuno Seiyaku Kogyo Kk | 電気亜鉛−ニツケル合金めつき浴 |
| EP0327996A3 (en) * | 1988-02-09 | 1990-12-27 | National Semiconductor Corporation | Tape automated bonding of bumped tape on bumped die |
| DE4017863C1 (enExample) * | 1990-06-02 | 1991-07-18 | Du Pont De Nemours (Deutschland) Gmbh, 4000 Duesseldorf, De | |
| JP4497032B2 (ja) * | 2005-06-16 | 2010-07-07 | Tdk株式会社 | 電子部品 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5394874A (en) * | 1977-01-31 | 1978-08-19 | Matsushita Electric Ind Co Ltd | Connecting method for semiconductor device |
| JPS5469383A (en) * | 1977-11-15 | 1979-06-04 | Toshiba Corp | Production of semiconductor device |
| JPS5548954A (en) * | 1978-10-03 | 1980-04-08 | Toshiba Corp | Manufacturing of film carrier |
-
1982
- 1982-07-06 CA CA000406703A patent/CA1198833A/en not_active Expired
- 1982-07-15 EP EP82303716A patent/EP0070691B1/en not_active Expired
- 1982-07-15 DE DE8282303716T patent/DE3278301D1/de not_active Expired
- 1982-07-15 AT AT82303716T patent/ATE33322T1/de not_active IP Right Cessation
- 1982-07-16 JP JP57124983A patent/JPS5827355A/ja active Granted
-
1990
- 1990-06-05 JP JP2148461A patent/JPH03123046A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| EP0070691A1 (en) | 1983-01-26 |
| JPH0371778B2 (enExample) | 1991-11-14 |
| DE3278301D1 (en) | 1988-05-05 |
| EP0070691B1 (en) | 1988-03-30 |
| JPH03123046A (ja) | 1991-05-24 |
| JPS5827355A (ja) | 1983-02-18 |
| JPH033940B2 (enExample) | 1991-01-21 |
| ATE33322T1 (de) | 1988-04-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |