DE3278301D1 - Tape for tape-automated-bonding of integrated circuits and method of producing the tape - Google Patents

Tape for tape-automated-bonding of integrated circuits and method of producing the tape

Info

Publication number
DE3278301D1
DE3278301D1 DE8282303716T DE3278301T DE3278301D1 DE 3278301 D1 DE3278301 D1 DE 3278301D1 DE 8282303716 T DE8282303716 T DE 8282303716T DE 3278301 T DE3278301 T DE 3278301T DE 3278301 D1 DE3278301 D1 DE 3278301D1
Authority
DE
Germany
Prior art keywords
tape
bonding
automated
producing
integrated circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8282303716T
Other languages
German (de)
English (en)
Inventor
Francis Nihal Sinnadurai
David John Small
Alexander Anthony Blain
Kenneth Cooper
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
British Telecommunications PLC
Original Assignee
British Telecommunications PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=10523346&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE3278301(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by British Telecommunications PLC filed Critical British Telecommunications PLC
Application granted granted Critical
Publication of DE3278301D1 publication Critical patent/DE3278301D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12033—Gunn diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
DE8282303716T 1981-07-17 1982-07-15 Tape for tape-automated-bonding of integrated circuits and method of producing the tape Expired DE3278301D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8122218 1981-07-17

Publications (1)

Publication Number Publication Date
DE3278301D1 true DE3278301D1 (en) 1988-05-05

Family

ID=10523346

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8282303716T Expired DE3278301D1 (en) 1981-07-17 1982-07-15 Tape for tape-automated-bonding of integrated circuits and method of producing the tape

Country Status (5)

Country Link
EP (1) EP0070691B1 (enExample)
JP (2) JPS5827355A (enExample)
AT (1) ATE33322T1 (enExample)
CA (1) CA1198833A (enExample)
DE (1) DE3278301D1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62287093A (ja) * 1986-06-05 1987-12-12 Okuno Seiyaku Kogyo Kk 電気亜鉛−ニツケル合金めつき浴
EP0327996A3 (en) * 1988-02-09 1990-12-27 National Semiconductor Corporation Tape automated bonding of bumped tape on bumped die
DE4017863C1 (enExample) * 1990-06-02 1991-07-18 Du Pont De Nemours (Deutschland) Gmbh, 4000 Duesseldorf, De
JP4497032B2 (ja) * 2005-06-16 2010-07-07 Ｔｄｋ株式会社 電子部品

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5394874A (en) * 1977-01-31 1978-08-19 Matsushita Electric Ind Co Ltd Connecting method for semiconductor device
JPS5469383A (en) * 1977-11-15 1979-06-04 Toshiba Corp Production of semiconductor device
JPS5548954A (en) * 1978-10-03 1980-04-08 Toshiba Corp Manufacturing of film carrier

Also Published As

Publication number Publication date
JPS5827355A (ja) 1983-02-18
EP0070691B1 (en) 1988-03-30
ATE33322T1 (de) 1988-04-15
CA1198833A (en) 1985-12-31
JPH0371778B2 (enExample) 1991-11-14
JPH033940B2 (enExample) 1991-01-21
JPH03123046A (ja) 1991-05-24
EP0070691A1 (en) 1983-01-26

Similar Documents

Publication Publication Date Title
EP0551382A4 (en) Semiconductor chip assemblies, methods of making same and components for same
SG73389A1 (en) Method of connecting tab tape to semiconductor chip and bump sheet and bumped tape used in the method
EP0473796A4 (en) Semiconductor device having a plurality of chips
KR970001928B1 (en) Process for flip-chip connection of a semiconductor chip
WO1997040532A3 (en) Molded flex circuit ball grid array and method of making
FR2579798B1 (fr) Procede de fabrication de modules electroniques pour cartes a microcircuits et modules obtenus selon ce procede
CA2171458A1 (en) Multi-chip module
CA2118649A1 (en) Interconnection Structure of Electronic Parts
MY106727A (en) Plastic molded type semiconductor device.
GB2307336B (en) Integrated circuit package and method of fabrication
FR2720190B1 (fr) Procédé de raccordement des plages de sortie d'une puce à circuit intégré, et module multipuces ainsi obtenu.
AU8353191A (en) Memory card
EP0393584A3 (en) High frequency semiconductor device
DE3278301D1 (en) Tape for tape-automated-bonding of integrated circuits and method of producing the tape
JPS57199228A (en) Wire bonding pad device
DE3572566D1 (en) Method of making lead frame support for ic chip
US5270570A (en) Lead frame for a multiplicity of terminals
US5656854A (en) Lead frame for a multiplicity of terminals
EP0288776A3 (en) Gold alloy wire connection to copper doped aluminum semiconductor circuit interconnection bonding pad
GB2244176B (en) Method and apparatus for forming a conductive pattern on an integrated circuit
EP0312975A3 (en) Semiconductor chip package
JPS55124248A (en) Leadless package
JPS6477135A (en) Semiconductor device
EP0376924A3 (en) Gold compression bonding
GB9318573D0 (en) Bonding process for producing multiple simultaneous connections between silicon di and a substrate

Legal Events

Date Code Title Description
8363 Opposition against the patent
8365 Fully valid after opposition proceedings
8339 Ceased/non-payment of the annual fee