DE3278301D1 - Tape for tape-automated-bonding of integrated circuits and method of producing the tape - Google Patents

Tape for tape-automated-bonding of integrated circuits and method of producing the tape

Info

Publication number
DE3278301D1
DE3278301D1 DE8282303716T DE3278301T DE3278301D1 DE 3278301 D1 DE3278301 D1 DE 3278301D1 DE 8282303716 T DE8282303716 T DE 8282303716T DE 3278301 T DE3278301 T DE 3278301T DE 3278301 D1 DE3278301 D1 DE 3278301D1
Authority
DE
Germany
Prior art keywords
tape
bonding
automated
producing
integrated circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8282303716T
Other languages
German (de)
English (en)
Inventor
Francis Nihal Sinnadurai
David John Small
Alexander Anthony Blain
Kenneth Cooper
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
British Telecommunications PLC
Original Assignee
British Telecommunications PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=10523346&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE3278301(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by British Telecommunications PLC filed Critical British Telecommunications PLC
Application granted granted Critical
Publication of DE3278301D1 publication Critical patent/DE3278301D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/077—Connecting of TAB connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Landscapes

  • Wire Bonding (AREA)
DE8282303716T 1981-07-17 1982-07-15 Tape for tape-automated-bonding of integrated circuits and method of producing the tape Expired DE3278301D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8122218 1981-07-17

Publications (1)

Publication Number Publication Date
DE3278301D1 true DE3278301D1 (en) 1988-05-05

Family

ID=10523346

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8282303716T Expired DE3278301D1 (en) 1981-07-17 1982-07-15 Tape for tape-automated-bonding of integrated circuits and method of producing the tape

Country Status (5)

Country Link
EP (1) EP0070691B1 (enExample)
JP (2) JPS5827355A (enExample)
AT (1) ATE33322T1 (enExample)
CA (1) CA1198833A (enExample)
DE (1) DE3278301D1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62287093A (ja) * 1986-06-05 1987-12-12 Okuno Seiyaku Kogyo Kk 電気亜鉛−ニツケル合金めつき浴
EP0327996A3 (en) * 1988-02-09 1990-12-27 National Semiconductor Corporation Tape automated bonding of bumped tape on bumped die
DE4017863C1 (enExample) * 1990-06-02 1991-07-18 Du Pont De Nemours (Deutschland) Gmbh, 4000 Duesseldorf, De
JP4497032B2 (ja) * 2005-06-16 2010-07-07 Ｔｄｋ株式会社 電子部品

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5394874A (en) * 1977-01-31 1978-08-19 Matsushita Electric Ind Co Ltd Connecting method for semiconductor device
JPS5469383A (en) * 1977-11-15 1979-06-04 Toshiba Corp Production of semiconductor device
JPS5548954A (en) * 1978-10-03 1980-04-08 Toshiba Corp Manufacturing of film carrier

Also Published As

Publication number Publication date
JPH0371778B2 (enExample) 1991-11-14
EP0070691B1 (en) 1988-03-30
JPH033940B2 (enExample) 1991-01-21
CA1198833A (en) 1985-12-31
JPH03123046A (ja) 1991-05-24
JPS5827355A (ja) 1983-02-18
EP0070691A1 (en) 1983-01-26
ATE33322T1 (de) 1988-04-15

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Legal Events

Date Code Title Description
8363 Opposition against the patent
8365 Fully valid after opposition proceedings
8339 Ceased/non-payment of the annual fee