JPS5827355A - 自動ボンディング用テープ - Google Patents

自動ボンディング用テープ

Info

Publication number
JPS5827355A
JPS5827355A JP57124983A JP12498382A JPS5827355A JP S5827355 A JPS5827355 A JP S5827355A JP 57124983 A JP57124983 A JP 57124983A JP 12498382 A JP12498382 A JP 12498382A JP S5827355 A JPS5827355 A JP S5827355A
Authority
JP
Japan
Prior art keywords
tape
bonding
gold
bump
automatic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57124983A
Other languages
English (en)
Japanese (ja)
Other versions
JPH033940B2 (enExample
Inventor
フランシス・ニハ−ル・シナドウライ
ダビツド・ジヨン・スモ−ル
アレクサンダ・アンソニイ・ブレイン
ケニス・ク−パ−
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
British Telecommunications PLC
Original Assignee
British Telecommunications PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=10523346&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JPS5827355(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by British Telecommunications PLC filed Critical British Telecommunications PLC
Publication of JPS5827355A publication Critical patent/JPS5827355A/ja
Publication of JPH033940B2 publication Critical patent/JPH033940B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/077—
    • H10W70/05—
    • H10W70/453—
    • H10W72/701—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Landscapes

  • Wire Bonding (AREA)
JP57124983A 1981-07-17 1982-07-16 自動ボンディング用テープ Granted JPS5827355A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB8122218 1981-07-17
GB8122218 1981-07-17

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2148461A Division JPH03123046A (ja) 1981-07-17 1990-06-05 自動ボンディング用テープの製造方法

Publications (2)

Publication Number Publication Date
JPS5827355A true JPS5827355A (ja) 1983-02-18
JPH033940B2 JPH033940B2 (enExample) 1991-01-21

Family

ID=10523346

Family Applications (2)

Application Number Title Priority Date Filing Date
JP57124983A Granted JPS5827355A (ja) 1981-07-17 1982-07-16 自動ボンディング用テープ
JP2148461A Granted JPH03123046A (ja) 1981-07-17 1990-06-05 自動ボンディング用テープの製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2148461A Granted JPH03123046A (ja) 1981-07-17 1990-06-05 自動ボンディング用テープの製造方法

Country Status (5)

Country Link
EP (1) EP0070691B1 (enExample)
JP (2) JPS5827355A (enExample)
AT (1) ATE33322T1 (enExample)
CA (1) CA1198833A (enExample)
DE (1) DE3278301D1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62287093A (ja) * 1986-06-05 1987-12-12 Okuno Seiyaku Kogyo Kk 電気亜鉛−ニツケル合金めつき浴

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0327996A3 (en) * 1988-02-09 1990-12-27 National Semiconductor Corporation Tape automated bonding of bumped tape on bumped die
DE4017863C1 (enExample) * 1990-06-02 1991-07-18 Du Pont De Nemours (Deutschland) Gmbh, 4000 Duesseldorf, De
JP4497032B2 (ja) * 2005-06-16 2010-07-07 Ｔｄｋ株式会社 電子部品

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5548954A (en) * 1978-10-03 1980-04-08 Toshiba Corp Manufacturing of film carrier

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5394874A (en) * 1977-01-31 1978-08-19 Matsushita Electric Ind Co Ltd Connecting method for semiconductor device
JPS5469383A (en) * 1977-11-15 1979-06-04 Toshiba Corp Production of semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5548954A (en) * 1978-10-03 1980-04-08 Toshiba Corp Manufacturing of film carrier

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62287093A (ja) * 1986-06-05 1987-12-12 Okuno Seiyaku Kogyo Kk 電気亜鉛−ニツケル合金めつき浴

Also Published As

Publication number Publication date
EP0070691A1 (en) 1983-01-26
JPH0371778B2 (enExample) 1991-11-14
DE3278301D1 (en) 1988-05-05
EP0070691B1 (en) 1988-03-30
JPH03123046A (ja) 1991-05-24
JPH033940B2 (enExample) 1991-01-21
ATE33322T1 (de) 1988-04-15
CA1198833A (en) 1985-12-31

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